JPH05226392A - Packaging system for semiconductor device and nozzle for resin discharge - Google Patents

Abstract

PURPOSE:To provide a system suitable to package a semiconductor element in a high density as well as to make it possible to discharge a resin with high accuracy and with high uniformity. CONSTITUTION:A multi-nozzle is provided with a multi-nozzle holder 17 and a plurality of nozzle 18a and 18b supported by this holder 17. On the other hand, a semiconductor element 12 is directly mounted on a substrate 13 and is made a prescribed connection to a wiring pattern formed on the substrate 13 through bonding wires 15. The nozzles 18a, which are positioned at the outer contour of the multi-nozzle, of the plurality of the nozzles 18a and 18b are respectively provided with a taper 19 on their point parts. Specially, the tapers 19 are well balanced and provided according to material physical properties, such as the viscosity of a resin 10, a discharge pressure and a discharge condition, such as the size of the nozzles 18a, and a state that the resin 10, which is discharged through the nozzles 18a, is off the center lines of the nozzles 18a and the discharge direction of the resin are controlled by such the tapers 19 as shown in the figure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method for a semiconductor device, and more particularly to a mounting method in which a semiconductor element is directly mounted on a substrate and then sealed with a resin, and a resin discharging method used in such a mounting method. It concerns a nozzle.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor device mounting method using a resin sealing technique in which a semiconductor element such as an IC (integrated circuit) element is directly mounted on a substrate and is sealed with a resin,
Use a resin discharge nozzle having an appropriate tube diameter according to the viscosity of the resin. The tip portion of such a nozzle usually has a shape cut in the vertical direction of the nozzle pipe, and therefore a method is adopted in which the resin is discharged along the direction of the center line of the nozzle.

Further, by adopting a multi-nozzle having a structure in which a plurality of pins constituting each of such nozzles are erected in a holder, a uniform distribution of the discharged resin on the discharge surface is achieved. ..

FIG. 4 shows an example of a conventional multi-nozzle having such a structure.

In FIG. 4, a multi-nozzle is a multi-nozzle holder 27 and a plurality of nozzles 2 supported by these.
Eight. On the other hand, the semiconductor element 22 is directly mounted on the substrate 23 and is bonded by the bonding wire 25.
The wiring pattern formed on the wiring 3 is connected in a predetermined manner.
According to the conventional multi-nozzle configured as described above, the resin 20 discharged from the nozzle 28 causes
The semiconductor element 22 can be resin-sealed on the substrate 23.

[0006]

Generally, in this type of semiconductor device mounting method, in order to meet the recent demand for high-density and high-accuracy mounting of semiconductor devices, the accuracy of the region where the sealing resin is formed and It is desired to improve the uniformity of the discharged resin.

However, according to the above-mentioned conventional multi-nozzle, it is necessary to mount the semiconductor elements at a high density. Therefore, the restriction on the sealing resin region is severe,
When the uniformity of the discharged resin is strictly required, it is difficult to manufacture a multi-nozzle with a narrow pitch due to the limits of the nozzle size and the nozzle pitch. That is, it is difficult to obtain a fixed amount / uniform resin discharge at the time of high-density mounting and an arbitrary discharged resin shape from the nozzle shape.

On the other hand, the nozzle may be deformed, for example, bent, but in this case, the resin is clogged at the bent portion and cannot be practically used.

The present invention has been made in view of the above-mentioned conventional problems, and is a method of mounting a semiconductor device suitable for mounting semiconductor elements at high density, and a resin discharge capable of discharging resin with high accuracy and uniformity. An object is to provide a nozzle for use.

[0010]

In order to achieve the above-mentioned object, a semiconductor device mounting method according to the present invention mounts a semiconductor element on a substrate and seals the semiconductor element with resin discharged from a nozzle. The method is characterized in that the discharge direction and shape of the discharge resin are controlled by processing the shape of the tip of the nozzle.

In order to achieve the above-mentioned object, the resin discharge nozzle of the present invention is a resin discharge nozzle for resin-sealing a semiconductor element mounted on a substrate, and the discharge direction and shape of the discharge resin are different. It is characterized in that the shape of the tip portion is processed so as to have a predetermined direction and shape.

[0012]

In the mounting method of the semiconductor device of the present invention, the discharge direction and shape of the discharge resin are controlled by processing the shape of the tip of the nozzle. Here, such processing includes, for example, processing of providing a taper, slit or the like at the tip of the nozzle, surface processing of the inner wall of the nozzle tip that gives resistance to the flow of the resin to be discharged, and the like. By such processing, the discharge resin is discharged not in the direction along the nozzle center line but in the direction deviating from the center line. Here, the degree of deviation from the center line and the ejection direction of the resin are largely dependent on the material properties such as the viscosity of the resin, the ejection conditions such as the ejection pressure and the nozzle size, and the nozzle tip shape. Therefore, the degree of deviation from the center line can be adjusted by subjecting the tip shape of the nozzle to the above-described processing in a well-balanced manner according to the physical properties of these resins and the discharge conditions. Therefore, if such processing is applied to the nozzle tip shape, it is not necessary to narrow the nozzle pitch when resin-sealing the semiconductor element mounted on the substrate, and the desired resin discharge amount distribution / discharge shape can be obtained. Therefore, it is possible to improve the accuracy of the region where the sealing resin is formed at any position on the substrate while maintaining the uniformity of the discharged resin.

On the other hand, in the resin discharge nozzle of the present invention, the shape of the tip portion is processed so that the discharge direction and shape of the discharge resin will be a predetermined direction and shape. Therefore, by using such a nozzle, the mounting method of the semiconductor device of the present invention as described above can be realized, that is, when the semiconductor element mounted on the substrate is resin-sealed, the resin discharge nozzle is used. If so, the resin can be discharged with high accuracy and uniformity.

From the following examples of the present invention, such effects of the present invention will be made clearer, and other effects of the present invention will be made clear.

[0015]

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 schematically shows the structure of a multi-nozzle which is an embodiment of the present invention.

In FIG. 1, a multi-nozzle includes a multi-nozzle holder 17 and a plurality of nozzles 18 supported by the multi-nozzle holder 17.
a and 18b. On the other hand, the semiconductor element 12 is directly mounted on the substrate 13 and is connected to the wiring pattern formed on the substrate 13 by the bonding wires 15 in a predetermined manner.

Particularly in this embodiment, a plurality of nozzles 18a,
Each of the nozzles 18a located on the outer contour of 18b has
A taper 19 is provided at the tip.

According to the multi-nozzle of this embodiment configured as described above, the semiconductor element 12 can be resin-sealed on the substrate 13 by the resin 10 discharged from the nozzles 18a and 18b. Here, since the taper 19 is provided, the resin 10 is discharged in a direction inwardly deviating from the center line of the nozzle 18a. In particular, the taper 19 has material properties such as viscosity of the resin 10 and the like. And the discharge conditions such as the discharge pressure and the size of the nozzle 18a. That is, the degree of deviation from the center line of the resin 10 discharged from the nozzle 18a and the discharge direction are such that the taper 19
As a result, the substrate 10 is controlled as shown in FIG. 1, and as a result, the uniformity of the resin 10 is maintained while using the nozzle of a size that does not affect the nozzle pitch and does not cause resin clogging. Semiconductor device 1 on 13
A proper amount of the resin 10 can be discharged around the area 2.

In the above embodiment, the taper is provided for a plurality of nozzles 18a located on the outer contour, but the taper may be provided only for one nozzle 18a located on the outer contour. .. In this case, it is possible to obtain a deformed resin shape such as left-right asymmetry.

For example, as shown in FIG.
In the case where the discharge condition of the resin 10 is restricted by the outer shape of the substrate 13a due to the relationship with the mounting position of 2, or the discharge condition of the resin 10 is restricted by the step difference of the substrate 13b as shown in FIG. If there are restrictions on the resin discharge conditions due to obstacles, etc.,
Obtaining a resin shape deformed in this way is extremely effective.

In the above embodiment, the nozzles 18a located on the outer contour are tapered. However, if necessary, the nozzles 18b located other than the outer contour are tapered. The resin discharge amount distribution / discharge shape may be controlled according to.

Further, in the above embodiments, the taper 19 is provided at the tip of the nozzle 18a. However, as the processing to be applied to the tip, for example, processing such as forming a slit or the like of the resin to be ejected is performed. Surface treatment of the inner wall of the nozzle tip that gives resistance to the flow may be performed, and these treatments also allow the discharge resin to be discharged not in the direction along the nozzle centerline but in the direction away from the centerline. ,
Therefore, it is possible to obtain a desired resin discharge amount distribution and discharge shape.

[0024]

As described in detail above, according to the mounting method of the semiconductor device of the present invention, the discharge direction and shape of the discharge resin are changed to a predetermined direction and shape by processing the shape of the tip of the nozzle. Since the control is performed, it is not necessary to narrow the nozzle pitch when resin-sealing the semiconductor element mounted on the substrate, and while using a nozzle size that does not cause resin clogging, The resin discharge amount distribution / discharge shape can be obtained. Therefore, it is possible to improve the accuracy of the region where the sealing resin is formed at any position on the substrate while maintaining the uniformity of the discharged resin.

On the other hand, according to the resin discharge nozzle of the present invention, since the shape of the tip portion is processed so that the discharge direction and shape of the discharge resin are the predetermined direction and shape,
The semiconductor device mounting method of the present invention can be realized.

As a result, by using the semiconductor device mounting method and the resin discharge nozzle of the present invention, a highly functional semiconductor device in which semiconductor elements are mounted at a high density can be efficiently manufactured at a low price. ..

[Brief description of drawings]

FIG. 1 is a schematic side view showing a multi-nozzle that is an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a semiconductor device resin-sealed by using another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a semiconductor device which is resin-sealed by using still another embodiment of the present invention.

FIG. 4 is a schematic side view showing a conventional multi-nozzle.

[Explanation of symbols]

 10 Resin 12 Semiconductor Element 13, 13a, 13b Substrate 15 Bonding Wire 17 Multi Nozzle Holder 18a, 18b Nozzle 19 Tape

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromi Maruyama 3121-1 Satomi, Satosho-cho, Asaguchi-gun, Okayama Prefecture Shat Petakaya Electronics Co., Ltd.

Claims (2)

[Claims] 1. A method of mounting a semiconductor device, in which a semiconductor element is mounted on a substrate and the semiconductor element is sealed with a resin discharged from a nozzle, wherein the shape of the tip of the nozzle is processed to form the discharged resin. A method of mounting a semiconductor device, characterized in that the ejection direction and shape of the ink are controlled. 2. A resin ejection nozzle for resin-sealing a semiconductor element mounted on a substrate, wherein a tip portion is shaped so that the ejection direction and shape of the ejection resin are a predetermined direction and shape. A resin discharge nozzle characterized by being processed.