JPH05226180A - Laminated ceramic capacitor - Google Patents

Laminated ceramic capacitor

Info

Publication number
JPH05226180A
JPH05226180A JP5723592A JP5723592A JPH05226180A JP H05226180 A JPH05226180 A JP H05226180A JP 5723592 A JP5723592 A JP 5723592A JP 5723592 A JP5723592 A JP 5723592A JP H05226180 A JPH05226180 A JP H05226180A
Authority
JP
Japan
Prior art keywords
layer
terminal electrode
silver
capacitor
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5723592A
Other languages
Japanese (ja)
Other versions
JPH0793229B2 (en
Inventor
Tokihiro Umeda
旬宏 梅田
Tomiro Yasuda
冨郎 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP4057235A priority Critical patent/JPH0793229B2/en
Publication of JPH05226180A publication Critical patent/JPH05226180A/en
Publication of JPH0793229B2 publication Critical patent/JPH0793229B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate improper tan delta and capacitance of a capacitor by forming a first terminal electrode layer made of silver or silver-palladium alloy and glass, forming a second terminal electrode layer made of organic solvent containing copper powder or copper alloy powder thereon and further forming a third terminal electrode of solder layer. CONSTITUTION:A part corresponding to a desired capacitance of a dielectric sheet 3 is so laminated as to dispose edges of the sheet 3 in which inner electrodes 2 are alternately opposed, and baked to manufacture a capacitor element 4. First terminal electrode layers 5 are provided at both ends of the element 4 by coating and baking the first layer made of silver-palladium alloy and glass. Second layer terminal electrodes 8 are formed on the first layer by applying and baking the first layer made of silver coated copper powder and phenol resin adhesive. Further, third layer terminal electrodes 9 are formed on the second layer by plating melted solder to form a capacitor 10.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は積層セラミックコンデン
サに関する。特にはコンデンサの端子電極の構造に関す
る。
FIELD OF THE INVENTION The present invention relates to a monolithic ceramic capacitor. In particular, it relates to the structure of the terminal electrode of the capacitor.

【0002】[0002]

【従来の技術】従来の積層セラミックコンデンサは、第
2図に示す如く、セラミックグリーンシート1上に内部
電極として、銀パラジウム合金と有機バインダからなる
ペースト状インク2が塗布された誘電体シート3を複数
枚積層、焼成してコンデンサ素子4となし、この素子4
の両端部に銀パラジウム合金とガラスとからなる端子電
極5を形成している。
2. Description of the Related Art As shown in FIG. 2, a conventional monolithic ceramic capacitor has a dielectric sheet 3 coated with a paste-like ink 2 made of a silver-palladium alloy and an organic binder as internal electrodes on a ceramic green sheet 1. A plurality of layers are laminated and fired to form a capacitor element 4. This element 4
The terminal electrodes 5 made of silver-palladium alloy and glass are formed on both ends of the.

【0003】端子電極の構造は、他に第2図で示した銀
パラジウムとガラスとからなる第1層の端子電極5の上
に、第3図に示す如くニッケルめっき層の第2層の端子
電極6、さらにはんだめっき層の第3層の端子電極7の
3層構造のもの、別のものとしては第4図に示す如く、
銅又は銅合金の球状粉と有機接着剤とからなる第1層の
電極層8上に、溶融はんだめっき層からなる第2層の電
極層9の2層構造(特開平(3−266404号)が公
知である。
In addition, the structure of the terminal electrode is such that, as shown in FIG. 3, a second layer terminal of a nickel plating layer is provided on the first layer terminal electrode 5 made of silver palladium and glass shown in FIG. The electrode 6 and the terminal electrode 7 of the third layer of the solder plating layer have a three-layer structure, and as another one, as shown in FIG.
Two-layer structure of a second electrode layer 9 made of a molten solder plating layer on a first electrode layer 8 made of copper or copper alloy spherical powder and an organic adhesive (Japanese Patent Laid-Open No. 3-266404) Is known.

【0004】[0004]

【発明が解決しようとする課題】従来のコンデンサの端
子電極は、第2図に示す銀パラジウム合金とガラスとか
らなる組成材料の端子電極5のものが一般的である。こ
のコンデンサ11は基板へ実装する際のはんだ付けで端
子電極5が溶融はんだ中に溶解し、素子4が露出してし
まうことがある。
The terminal electrode of the conventional capacitor is generally the terminal electrode 5 of the composition material composed of silver-palladium alloy and glass shown in FIG. When the capacitor 11 is mounted on a substrate by soldering, the terminal electrode 5 may be melted in the molten solder and the element 4 may be exposed.

【0005】第3図のコンデンサ12は、第2層にニッ
ケルめっき層6を設け、この対策を行ったものである
が、ニッケルめっきを行う際のめっき液が残留し、移動
中に絶縁抵抗が低下してしまう欠点があり、高耐圧品に
は適用できない。
The capacitor 12 shown in FIG. 3 is provided with a nickel plating layer 6 on the second layer to take measures against this. However, the plating solution during nickel plating remains and the insulation resistance during movement is increased. It cannot be applied to high withstand voltage products because it has the drawback of decreasing.

【0006】第4図のコンデンサ13は、第1層電極層
8に銅又は銅合金の球状粉と有機接着剤とからなる材料
を用いたことにより、はんだくわれがなく、耐湿性や絶
縁抵抗の低下には問題ない。しかし、有機接着剤を用い
ているために焼付温度が200℃以下と低く、従来の電
極(ガラス)が800℃で焼付けていた場合と異なり、
内部電極2と端子電極8が相互に拡散して、完全に合金
を形成して接続することなく、更に球状の銅又は銅合金
と薄い層状の内部電極2に接触する構造が点接触となっ
ているので、内部電極2の層数が少ない小容量品になる
程tan δや容量不良が増大する傾向があった。
The capacitor 13 shown in FIG. 4 uses the material consisting of the spherical powder of copper or copper alloy and the organic adhesive for the first electrode layer 8, so that there is no soldering, moisture resistance and insulation resistance. There is no problem with the decrease of. However, since the organic adhesive is used, the baking temperature is as low as 200 ° C or lower, which is different from the case where the conventional electrode (glass) is baked at 800 ° C.
A structure in which the internal electrode 2 and the terminal electrode 8 diffuse into each other to form a complete alloy and are not connected to each other and further contact the spherical copper or copper alloy and the thin layered internal electrode 2 is point contact. Therefore, the smaller the number of layers of the internal electrodes 2, the smaller the capacity, the more the tan δ and the capacity defect tended to increase.

【0007】[0007]

【課題を解決するための手段】本発明は、積層セラミッ
クコンデンサの端子構造を改良するもので、銀又は銀パ
ラジウム合金とガラスとからなる第1層の端子電極層5
を形成し、次にこの第1層の電極層5の上に銅粉又は銅
合金粉を有機溶剤とからなる第2層の端子電極層8を設
け、さらにこの第2層の電極層8の上にはんだ層9の第
3の端子電極層9を形成してなる積層セラミックコンデ
ンサ10を提供する。
SUMMARY OF THE INVENTION The present invention is to improve the terminal structure of a monolithic ceramic capacitor, which is a first terminal electrode layer 5 made of silver or silver-palladium alloy and glass.
And then a second terminal electrode layer 8 made of copper powder or copper alloy powder and an organic solvent is provided on the first electrode layer 5 and further the second electrode layer 8 is formed. Provided is a multilayer ceramic capacitor 10 having a third terminal electrode layer 9 of a solder layer 9 formed thereon.

【0008】[0008]

【作用】本発明のコンデンサは、端子電極の第1層に銀
又は銀パラジウムとガラスからなる層5を約800℃の
高温で焼付けるため内部電極2との相互拡散が十分に行
われ、完全な合金を形成して接続される。これらの接触
が線接触としてなされるので接触が確実に行われる。こ
の上に第2層として銅又は銅合金粉と有機溶剤とからな
る層を形成することによりtan δ不良及び容量不良の発
生を防止できる。
In the capacitor of the present invention, the layer 5 made of silver or silver palladium and glass is baked on the first layer of the terminal electrode at a high temperature of about 800 ° C., so that the mutual diffusion with the internal electrode 2 is sufficiently performed, and Are formed and connected. Since these contacts are made as line contacts, the contacts are surely made. By forming a layer made of copper or copper alloy powder and an organic solvent as a second layer thereon, the occurrence of tan δ defects and capacity defects can be prevented.

【0009】[0009]

【実施例】本発明の積層セラミックコンデンサ10の実
施例を第1図に基づき説明する。チタン酸バリウム系の
強誘電セラミックからなる厚さ30μmのグリーンシー
ト1の表面に銀パラジウムに有機バインダが添加された
ペースト状インクを用い1〜3μm厚さの内部電極2を
形成して誘電体シート3を製作する。この誘電体シート
3の内部電極2が交互に相対向する端縁部に位置するよ
う誘電体シート3を所望される容量相当分積層する。こ
の後焼成して一体化することによりコンデンサ素子4が
製作される。
EXAMPLE An example of the monolithic ceramic capacitor 10 of the present invention will be described with reference to FIG. A dielectric sheet is formed by forming an internal electrode 2 having a thickness of 1 to 3 μm on a surface of a green sheet 1 having a thickness of 30 μm made of a barium titanate-based ferroelectric ceramic and using a paste ink in which an organic binder is added to silver palladium. Produce 3. The dielectric sheets 3 are laminated by the amount corresponding to the desired capacitance so that the internal electrodes 2 of the dielectric sheet 3 are alternately located at the opposite edge portions. After this, the capacitor element 4 is manufactured by firing and integrating.

【0010】このコンデンサ素子4の両端部に端子電極
を形成する。端子電極の第1層として銀パラジウム合金
とガラスとからなるものを塗布し800℃で焼付けし第
1層の端子電極層5を設ける。この第1層の上に平均粒
径が10μmの銀被覆銅粉とフェノール樹脂系接着剤と
からなるものを塗布し200℃で焼付け第2の端子電極
層8を形成する。さらに第2層の上に溶融はんだめっき
により第3層の端子電極9を形成しコンデンサ10をう
る。
Terminal electrodes are formed on both ends of the capacitor element 4. As the first layer of the terminal electrode, a material composed of silver-palladium alloy and glass is applied and baked at 800 ° C. to form the first terminal electrode layer 5. A second terminal electrode layer 8 is formed by coating a silver-coated copper powder having an average particle size of 10 μm and a phenol resin adhesive on the first layer and baking at 200 ° C. Furthermore, the terminal electrode 9 of the third layer is formed on the second layer by hot-dip soldering to obtain the capacitor 10.

【0011】表1は定格電圧630VDCの積層セラミ
ックコンデンサの容量単位に、tanδの不良率を従来例
(第4回)と本発明の実施例のものと対比して示すもの
である。従来例のものは容量が小さくなるほど、tan δ
の不良率が大きくなっているのに対し、本発明の実施例
品は容量に左右されずtan δが低い値で安定化している
ことがわかる。 以下余白。
Table 1 shows the failure rate of tan δ in the unit of capacitance of a laminated ceramic capacitor having a rated voltage of 630 VDC in comparison with the conventional example (4th) and the example of the present invention. As the capacity of the conventional example decreases, tan δ
It can be seen that while the defect rate of No. 1 is large, the product of the example of the present invention is stabilized at a low value of tan δ regardless of the capacity. The margin below.

【0012】[0012]

【表1】 [Table 1]

【0013】[0013]

【発明の効果】本発明のコンデンサは、第1層の端子電
極層5に銀パラジウム合金とガラスとからなる層を80
0℃の高温と焼付け形成しているため、内部電極2と端
子電極5とが相互拡散し完全に合金を形成して接続され
る。この上に銅合金粉と有機溶剤とからなる第2層の端
子電極層8を形成することによりコンデンサ10として
のtan δ及び容量不良を解消することができる。
According to the capacitor of the present invention, a layer of silver-palladium alloy and glass is formed on the first terminal electrode layer 5 as a layer.
Since baking is performed at a high temperature of 0 ° C., the internal electrode 2 and the terminal electrode 5 mutually diffuse to form an alloy and are connected. By forming the second terminal electrode layer 8 composed of the copper alloy powder and the organic solvent on this, tan δ and the capacity defect as the capacitor 10 can be eliminated.

【0014】[0014]

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明は実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.

【図2】従来のコンデンサの断面図。FIG. 2 is a sectional view of a conventional capacitor.

【図3】従来のコンデンサの断面図。FIG. 3 is a cross-sectional view of a conventional capacitor.

【図4】従来のコンデンサの断面図。FIG. 4 is a sectional view of a conventional capacitor.

【符号の説明】[Explanation of symbols]

2…内部電極、 3…誘電体シート、 4…素子、 5
…第1層の端子電極層、8…第2層の端子電極層、 9
…第3層の端子電極層、 10…コンデンサ。
2 ... internal electrode, 3 ... dielectric sheet, 4 ... element, 5
... first terminal electrode layer, 8 ... second terminal electrode layer, 9
... The third terminal electrode layer, 10 ... Capacitor.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 セラミック誘電体に内部電極を形成する
誘電体シートからなり、この誘電体シートの両端部から
内部電極が導出するよう複数積層してなる積層セラミッ
クコンデンサに対し、このコンデンサ素子の端子電極と
して、銀又は銀パラジウム合金とガラスとからなる第1
層の端子電極を形成し、この第1層の上に銅粉又は銅合
金粉と有機溶剤とからなる第2の端子電極層8を設け、
さらにこの第2層の上にはんだ層の第3の端子電極層9
を形成することを特徴とする積層セラミックコンデン
サ。
1. A monolithic ceramic capacitor comprising a dielectric sheet for forming internal electrodes on a ceramic dielectric, wherein a plurality of internal electrodes are led out from both ends of the dielectric sheet. First electrode composed of silver or a silver-palladium alloy and glass as an electrode
A terminal electrode of a layer is formed, and a second terminal electrode layer 8 made of copper powder or copper alloy powder and an organic solvent is provided on the first layer,
Furthermore, the third terminal electrode layer 9 of the solder layer is formed on the second layer.
Forming a laminated ceramic capacitor.
JP4057235A 1992-02-12 1992-02-12 Monolithic ceramic capacitors Expired - Fee Related JPH0793229B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4057235A JPH0793229B2 (en) 1992-02-12 1992-02-12 Monolithic ceramic capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4057235A JPH0793229B2 (en) 1992-02-12 1992-02-12 Monolithic ceramic capacitors

Publications (2)

Publication Number Publication Date
JPH05226180A true JPH05226180A (en) 1993-09-03
JPH0793229B2 JPH0793229B2 (en) 1995-10-09

Family

ID=13049879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4057235A Expired - Fee Related JPH0793229B2 (en) 1992-02-12 1992-02-12 Monolithic ceramic capacitors

Country Status (1)

Country Link
JP (1) JPH0793229B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2354112A (en) * 1999-09-08 2001-03-14 Murata Manufacturing Co Ceramic electronic component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217829U (en) * 1988-07-21 1990-02-06
JPH03266404A (en) * 1990-03-15 1991-11-27 Hitachi Aic Inc Chip type ceramic capacitor
JPH04329616A (en) * 1991-04-30 1992-11-18 Marcon Electron Co Ltd Laminated type electronic component
JPH05144666A (en) * 1991-11-18 1993-06-11 Toshiba Corp Multilayer ceramic capacitor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987575A (en) * 1982-11-11 1984-05-21 Fujitsu Ltd Data rearranging circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217829U (en) * 1988-07-21 1990-02-06
JPH03266404A (en) * 1990-03-15 1991-11-27 Hitachi Aic Inc Chip type ceramic capacitor
JPH04329616A (en) * 1991-04-30 1992-11-18 Marcon Electron Co Ltd Laminated type electronic component
JPH05144666A (en) * 1991-11-18 1993-06-11 Toshiba Corp Multilayer ceramic capacitor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2354112A (en) * 1999-09-08 2001-03-14 Murata Manufacturing Co Ceramic electronic component
GB2354112B (en) * 1999-09-08 2001-08-08 Murata Manufacturing Co Ceramic electronic component
US6381117B1 (en) 1999-09-08 2002-04-30 Murata Manufacturing Co., Ltd. Ceramic electronic component

Also Published As

Publication number Publication date
JPH0793229B2 (en) 1995-10-09

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