JPH05222594A - Plating apparatus - Google Patents

Abstract

PURPOSE:To provide a plating apparatus capable of removing gaseous cyanogen discharged from the apparatus in the apparatus. CONSTITUTION:Gaseous cyanogen G is generated from a plating soln. Q during electrolysis in a plating apparatus 10 and exhaust gas contg. the gaseous cyanogen G is discharged from the apparatus 10 through a centralized exhaust duct 20. At this time, a gaseous cyanogen removal chamber 12 is installed in the plating apparatus 10, the gaseous cyanogen G is removed in the chamber 12 and cyanogen-free exhaust gas is introduced into the centralized exhaust duct 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus that uses a cyan bath in the process of manufacturing various electronic parts such as semiconductor wafers or liquid crystals.

[0002]

2. Description of the Related Art When a metal bump (projection electrode) is formed on a semiconductor wafer by plating, a plating apparatus using a cyan bath is used. Conventionally, in this type of plating apparatus, the cyan gas generated during plating electrolysis is generally not treated on the apparatus side but treated by a scrubber (washing tower) or the like provided outdoors to be excluded.

[0003]

In this case, the cyan gas generated in the plating apparatus is guided to the outdoor scrubber through the collective exhaust duct. Therefore, the cyan gas in the collective exhaust duct reacts with the acidic gas discharged from other devices in the collective exhaust duct, becomes a condensate and adheres to the inner wall of the duct, and if the condensate increases, it may leak to the outside of the duct. was there. Therefore, it is necessary to provide an independent duct and take special measures such as guiding exhaust gas containing cyan gas from the plating apparatus through the duct.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a plating apparatus capable of removing the above problems and removing the cyan gas discharged from the plating apparatus in the plating apparatus. To do.

[0005]

In order to solve the above problems, the present invention is configured such that cyan gas is generated from a plating solution during electrolysis and exhaust gas containing the cyan gas is discharged to the outside of the apparatus using a duct. In the plating device, a wet or dry type cyan gas removing device for removing cyan gas generated from the plating liquid during electrolysis is provided in the plating device, and the exhaust gas from which the cyan gas has been removed by the cyan gas removing device is introduced into a duct. And

In the plating apparatus, a cyan gas recovery section for locally recovering the cyan gas generated from the plating solution during electrolysis is provided near the plating tank, and the cyan gas recovered by the cyan gas recovery section is guided to the cyan gas removal apparatus. Is characterized by.

[0007]

According to the present invention, since the cyan gas removing device is provided in the plating apparatus as described above and the exhaust gas from which the cyan gas has been removed is guided to the duct, the cyan gas is guided from another device in the duct. The problem of reacting with acidic gases can be eliminated.

Further, by providing a cyan gas recovery part for locally recovering the cyan gas near the plating tank and guiding the recovered cyan gas to the cyan gas removing device, the cyan gas can be efficiently removed.

[0009]

【Example】

[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a plating apparatus which is an embodiment of the present invention. In FIG. 1, reference numeral 10 is a plating apparatus, and the plating apparatus 10 is configured to include a plating processing chamber 11 and a cyan gas removal chamber 12.

A plating tank 13 is provided inside the plating processing chamber 11.
Is provided, and the external air introduction port 14 and the exhaust gas discharge port 15 are provided on the peripheral wall thereof. The cyan gas removal chamber 12 is provided with a water sprinkling chamber 16 and a filler 17 for uniformly spraying water on the upper part thereof, and the water collected in the lower portion of the water sprinkling chamber 16 is pumped by a pump 18 through a water sprinkling pipe 19 to fill the filler It is designed to guide you to the top. Reference numeral 20 denotes a collective exhaust duct that guides exhaust gas from each plating device 10 and other devices (not shown) to a scrubber installed outside.

In the plating apparatus having the structure shown in FIG. 1, the cyan gas G generated from the plating solution Q in the plating tank 13 during electrolysis is introduced into the sprinkling chamber 16 from the exhaust gas outlet 15 together with the outside air introduced from the external air inlet 14. .. In the water sprinkling chamber 16, the water introduced onto the filler 17 through the water sprinkling pipe 19 by the pump 18 is uniformly sprinkled by the filler 17 as fine water particles. Cyan gas is absorbed by the water particles of this water spray and accumulates in the lower part of the water spray chamber 16. The exhaust gas from which the cyan gas has been removed passes through the filler 17 and is guided to the collective exhaust duct 20. As a result, cyan gas is not guided to the collective exhaust duct 20, and there is no risk of reacting with acid gas from other devices. The inside of the cyan gas removing chamber 12 constitutes a so-called wet type cyan gas removing device that absorbs cyan gas into water spray. The sprinkling water is not limited to water and may be any liquid that can efficiently absorb cyan gas.

[Embodiment 2] FIG. 2 is a diagram showing a schematic configuration of a plating apparatus according to another embodiment of the present invention. In FIG. 2, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions.
2 is different from FIG. 1 in that a dry cyan gas removing device 21 filled with a cyan gas absorbent such as activated carbon is provided in the cyan gas removing chamber 12.

In the plating apparatus having the structure shown in FIG. 2, the cyan gas G generated from the plating solution Q in the plating tank 13 during electrolysis is guided to the cyan gas removing apparatus 21 from the exhaust gas outlet 15 together with the external air from the external air inlet 14. Get burned. Cyan gas is removed by the cyan gas removing device 21, and the exhaust gas from which the cyan gas has been removed is guided to the collective exhaust duct 20.
As a result, cyan gas is not guided to the collective exhaust duct 20, and there is no risk of reacting with acid gas from other devices, as is the case with the plating device having the configuration shown in FIG.

[Embodiment 3] FIG. 3 is a diagram showing a schematic structure of a plating apparatus according to another embodiment of the present invention. Figure 3 Smell Figure 1
2 and the same reference numerals as those in FIG. 2 indicate the same or corresponding portions. In FIG. 3, a difference from FIGS. 1 and 2 is that a plating chamber 13 is provided with a cyan gas recovery section 22 for locally recovering the cyan gas generated from the plating solution Q during electrolysis and the plating processing chamber. That is, the exhaust gas containing no cyan gas in 11 is guided to the collective exhaust duct 20 through the duct 23. The cyan gas removing chamber 12 is provided with a wet type cyan gas removing device as shown in FIG. 1 or a dry type cyan gas removing device as shown in FIG.

In the plating apparatus having the structure shown in FIG. 3, the cyan gas G generated from the plating solution in the plating tank 13 during electrolysis is locally recovered by the cyan gas recovery section 22 and guided to the cyan gas removal chamber 12 from the exhaust gas discharge port 15. .. In the cyan gas removing chamber 12, the cyan gas is removed by a wet type cyan gas removing device or a dry type cyan gas removing device, and the exhaust gas from which the cyan gas has been removed is the collective exhaust duct 2
Lead to zero. With this configuration, the exhaust gas containing the high-density cyan gas is guided to the cyan gas removal chamber 12, so that the cyan gas can be efficiently collected.

With the configuration shown in FIG. 3, cyan gas is not guided to the collective exhaust duct 20, and there is no risk of reacting with the acid gas from other devices. It is the same as the plating apparatus having the configuration shown.
The configuration of the cyan gas recovery part 22 is not limited to that shown in FIG. 3, and the point is that the cyan gas generated from the plating solution during electrolysis can be locally recovered in the vicinity of the plating tank. Anything will do.

[0017]

As described above, according to the present invention, the following excellent effects can be obtained. (1) Since a cyan gas removing device is provided in the plating device and the exhaust gas from which the cyan gas has been removed is guided to the duct, the problem that the cyan gas reacts with the acidic gas introduced from another device in the duct is eliminated. it can.

(2) Further, by providing a cyan gas recovery section for locally recovering the cyan gas near the plating tank and guiding the recovered cyan gas to the cyan gas removal device, the cyan gas can be efficiently removed. ..

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of a plating apparatus that is an embodiment of the present invention.

FIG. 2 is a diagram showing a schematic configuration of a plating apparatus that is an embodiment of the present invention.

FIG. 3 is a diagram showing a schematic configuration of a plating apparatus that is an embodiment of the present invention.

[Explanation of symbols]

 10 Plating Device 11 Plating Treatment Room 12 Cyan Gas Removal Room 13 Plating Tank 14 External Air Inlet 15 Exhaust Gas Outlet 16 Sprinkling Chamber 17 Filler 18 Pump 19 Sprinkling Pipe 20 Collective Exhaust Duct 21 Cyan Gas Removal Device 22 Cyan Gas Recovery Section

Claims (3)

[Claims] 1. A plating apparatus configured such that cyan gas is generated from a plating solution during electrolysis and exhaust gas containing the cyan gas is discharged to the outside of the apparatus using a duct, and a cyan gas generated from the plating solution during the electrolysis. A plating device, wherein a cyan gas removing device for removing the gas is provided in the plating device, and the exhaust gas from which the cyan gas has been removed by the cyan gas removing device is guided to the duct. 2. The plating according to claim 1, wherein the cyan gas removing device is a wet type in which a liquid that absorbs cyan gas is dispersed in exhaust gas to absorb and remove cyan gas, or a dry type in which cyan gas is removed through an absorbent. apparatus. 3. A cyan gas recovery unit for locally recovering a cyan gas generated from a plating solution during electrolysis is provided near the plating tank, and the cyan gas recovered by the cyan gas recovery unit is guided to the cyan gas removal device. The plating apparatus according to Item 1 or 2.