JPH0521835A - Manufacturing system for photocoupler - Google Patents

Abstract

PURPOSE:To improve the efficiency of management by providing buffers between equipments to keep the quantity of lead frames(LF) constant, making holes in specified positions in a LF, and controlling the system by a computer. CONSTITUTION:Dimple molding machines(DM) 1 and 8 starts molding when the quantity of LFs decreases in a buffer between the DM 1 and a mounter(MT) 2 and a buffer between the DM 8 and an MT 8. The MTs 2 and 9 starts bonding chips onto LFs and make lot start holes in the LFs. Then bonders 3 and 10, potting equipment 11, frame welder 4, primary sealing device 5, inner tiebar cutter 6 and secondary sealing device 7, when reading the lot start holes, start respective operation. Computers 16, 18 and 19 accumulate information from each operation system and, when non-defective counters on the MTs 2 and 9 count a number stored, send a lot end signal to the MTs 2 and 9. The MTs 2 and 9 make lot end holes in LFs. Then each equipment, when reading the lot end holes, ends operation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a production system for an optical coupler, and more particularly to an automatic production system in which each device is controlled by one control device.

[0002]

2. Description of the Related Art A conventional optical coupling machine automatic production system is
As shown in FIG. 4, individual devices were manually transported for each process. In the manufacturing process of the optical coupler, since the lead frames are opposed to each other, the mounting of the light emitting diode, the bonding, the resin coating process (hereinafter MBP process), the mounting of the phototransistor, and the bonding process are individually performed, and they are combined during the process. Further, it is complicated in that the mold sealing is performed twice.

[0003]

The conventional production system for an optical coupler has the following problems. (1) Since the process is complicated and it is difficult to uniformly control the production of each process, the operation rate of the entire process is reduced and the productivity is poor. (2) Since each process is scattered, it requires a large number of personnel, increasing the cost of the product.

Further, there are the following problems in switching the automatic production system of another product to the automatic production system of the optical coupler. (1) Since it is automated in a more complicated process than other products, a part that comprehensively controls each facility is required. (2) (a) The equipment for welding by welding the lead frame of the light emitting diode and the lead frame of the phototransistor is installed.

(B) Two mold devices are incorporated. As described above, according to (a) and (b), the production system becomes a long process, and the positional accuracy of the lead frame of each equipment is required.

[0006]

The production system for an optical coupler according to the present invention has the following five features. (1) The lead frame of each of the light emitting diode and the phototransistor is repeated in a certain unit in the feeding direction, and the lead frame is continuously supplied to this system. (2) A plurality of devices are carried by one lead frame, or a lead frame obtained by cutting this one lead frame in the middle of the device is carried on one rail, and each device is connected by this lead frame. There is. Further, a lead frame buffer is provided between each device, and the device detects the amount of the lead frame in this buffer, and controls the operation of the devices before and after this buffer. (3) Make a hole in a specific place of the lead frame, and let the device recognize the following information there.

(A) Lead frame position (b) Defective portion (c) Lot start and end The device is controlled based on this information. (4) Connect each device of this production system to a LAN (local
Area network) to provide the following information.

(A) Process progress information (b) Production quality information (c) Operating state (5) The lead frame feed mechanism of each device and the mechanism for determining the position are separated, and the mechanism for determining the position is fixed. ..

[0009]

The present invention will be described below with reference to the drawings. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a block diagram of FIG. 1, FIG. 3 is a view showing a product processing state in each process, FIG. 5 is a mechanism diagram of a buffer section, and FIG. 6 is a feeding mechanism. It is a figure.

What is produced by this production system is a so-called double mold coupler in which lead frames are opposed to each other and welded to perform mold sealing twice.

In the production system of the present invention, two series of production lines in which dimple forming machines 1 and 8, mounters 2 and 9, and bonders 3 and 10 are arranged in series are arranged in parallel, and a potting machine 11 is arranged at the end of one of the production lines. Then, following these two series of production lines, one series of production lines in which the frame welding machine 4, the primary enclosing machine 5, the inner tie bar cutting machine 6, and the secondary enclosing machine 7 are arranged in series is provided, and each device is controlled. Computers 16, 18, and 19 are provided. Further, a buffer is provided between the respective devices, and the lead frames 13 and 14 are continuously and automatically supplied.

The operation of this production system is as follows. (1) The dimple forming machine turns on / off the device operation signal.
Regardless of F, when the amount of the lead frame in the buffer between the dimple forming machine and the mounter becomes small, dimple forming is started. (2) Upon receiving the device operation signal ON, the mounter starts bonding the chip to the lead frame. At the same time, the mounter drills a lot start hole in the lead frame. (3) Receive the mounter work start report and start collecting the following information.

(A) Device operating time, accident stop time, repair time (b) Number of operations, number of defective products (4) or less, bonder, resin coating machine (potting machine), frame welding machine, primary sealing machine, inner tie bar cutting The machine and the two o'clock enclosing machine read the start signal of the above 2 by an optical sensor, issue a work start report of each device, and start the work. The information system (computer) is
Collection and collection of the same information as (a) and (b) in (3) will be started from the work system. (5) Defective product detection In the buffer section between devices, defective holes (3
9) Open. When the part with the defective hole advances to the next device, the optical hole sensor detects the defective hole and reports it to the information system. (6) The information system that received the report of defective products totals the number of hits as defective products. When the counter of the number of non-defective products of the mounter reaches the initially registered number, a lot end signal is output to the mounter. (7) The mounter receiving the lot end signal makes a lot end hole in the lead frame. (8) Hereinafter, the bonder, potting machine, frame welding machine, primary encapsulation machine, inner tie bar cutting machine, and secondary encapsulation machine read the above lot end holes of 4 with an optical sensor and complete the work of each device. The information system is (3)
The collection of the information of the information items (a) and (b), which has started the aggregation in step 3, is terminated. Finally, the information system which has received the lot end signal from the secondary enclosure machine turns off the device operation signal unless the mounter has already received the start report of the next lot.

Next, the mechanical features of this production system will be described with reference to FIGS. 5 and 6. (1) Detection of the amount of lead frames in the buffer between each device (FIG. 5).

When the front device finishes the work, the lead frame 5
When 1 is sent out, the buffer portion sags and the buffer reel 54 lowers. As a result, when the buffer reel central portion 53 reaches the position of the optical sensor 55, a buffer full signal is sent to the information system, and the operation of the previous equipment is stopped until the buffer reel 54 rises. On the contrary, when the work of the next equipment is started and the lead frame 51 is pulled, the buffer reel 54 rises, and when the center portion 53 of the buffer reel reaches the position of the optical sensor 52, the operation of the next equipment is started. A buffer-wait signal is output so that the operation is stopped until the value goes down.

As a result, the buffer reel center portion 5 is always provided.
3 controls the operation of the front and rear equipment so that it exists between the optical sensor 52 and the optical sensor 55. (2) A feed mechanism and a positioning mechanism (Fig. 6).

In the present production system, higher positional accuracy is required than in a general integrated circuit automatic machine because of the following two points.

(A) Since the assembly process is longer than that of an integrated circuit,
The length of the lead frame used in the system is long.

(B) Since the process of the light emitting diode and the process of the phototransistor are combined by a frame welding machine, the accuracy of this connection influences the accuracy of the position hole in the subsequent process. For the above reason, as shown in FIG. 6, the pins are taken out on the reels 63 and 67 for feeding the lead frame 61, the pins are engaged with the reference holes of the lead frame, and the reels 63 and 67 are turned to rotate the lead frame 6
Send 1. Further, this feeding is performed by the reference hole reading optical sensor 6
A signal is sent to the information system at 8 and the information system factors this signal. When the specified number of times has been reached, the rotation of the reels 63 and 67 is stopped, the positioning stage 65 is raised, the positioning pin 64 is engaged with the reference hole of the lead frame 61, and the lead frame is corrected to suit the work of the equipment.

By thus separating the feed mechanism and the positioning mechanism, the sliding portion of the positioning mechanism is reduced.

Next, another embodiment of the present invention will be described. In this embodiment, the production system itself is the same as that in the first embodiment, but the buffer mechanism between the facilities, which is a feature of the production system, is further improved. This improved buffer mechanism will be described. FIG. 7 is a principle diagram of this buffer mechanism.

In the buffer mechanism of the first embodiment, the lead frame 51 is in contact with the buffer reel 54 and the amount of the lead frame is detected by the vertical movement of the buffer reel 54. In this case, the contact area of the lead frame 51 is large, the contact resistance is large, and the lead frame 51 does not move smoothly. In this example,
In order to make the movement of the lead frame smooth, the following mechanism was improved. In the buffer between the devices, two columns 76, 77 with a hole in the center like a needle's head are set up, and a light emitting part 72, 74 used for an optical sensor is placed at an appropriate position on one of the columns. Two light-receiving parts 73 and 75 of the optical sensor are also bonded to the other side at the corresponding positions. Lead frame 7 with these two sensors hanging down
When 1 blocks the light, the length of the lead frame 71 in the buffer is detected.

Next, the operation of this buffer will be described. The front equipment ends the work, and the lead frame 71 hangs down. When hanging down to the position where the light of the optical sensors 74 and 75 is blocked, the previous equipment outputs a buffer full signal to stop the operation. on the other hand,
When the work of the next equipment is started, the lead frame 71 is pulled, and the light from the optical sensors 72 and 73 is no longer blocked,
A buffer wait signal is output from the previous equipment to stop the operation of the next equipment until the lead frame 71 is supplied.

By doing so, the movement of the lead frame 71 can be made smooth, and the same function as the buffer mechanism of the first embodiment can be provided.

[0025]

As described above, according to the present invention, (A) a computer is used to comprehensively control a complicated process to improve the management efficiency. (B) In each device, the lead frame feed mechanism and the positioning mechanism are separated and independent, so that the positioning accuracy is improved.

By performing the above two points, an automatic production system in the optical coupler becomes possible. This has the following effects. (1) Lead frames are continuously supplied to the system, enabling continuous production. (2) Since the devices that were conventionally separated are connected by the lead frame as in (1), the process control as a system becomes possible and the operating rate increases. (3) A hole is made at a specified location on the lead frame, and a sensor is used to distinguish between non-defective products and defective products. In addition, the operating status of the device is also aggregated by a computer, resulting in production numbers and equipment troubles. On the other hand, information was obtained in real time, and appropriate measures could be taken promptly in each situation. With the above three points, the following effects were obtained. (1) The number of personnel required to produce the same quantity was reduced to 1/6 that of the conventional line. (2) Compared to the case where the same number of individual facilities are used for production, the production volume has tripled. (3) Product cost was reduced by 80% from (1) and (2).

[Brief description of drawings]

FIG. 1 is a process drawing of an embodiment of the present invention.

FIG. 2 is a block diagram of FIG.

FIG. 3 is a view showing a processing state in each manufacturing process.

FIG. 4 is a diagram showing a conventional production system.

FIG. 5 is a buffer mechanism diagram of one embodiment.

FIG. 6 is a diagram of a feeding mechanism according to an embodiment.

FIG. 7 is a buffer mechanism diagram of another embodiment.

[Explanation of symbols]

1,8 Dimple molding machine (press machine for pressing lead frame to keep distance between light emitting diode and phototransistor) 2,9 Mounter 3,10 Bonder 4 Frame welding machine 5 Primary encapsulation machine 6 Inner tie bar cutting machine 7 Secondary Enclosing machine 11 Potting machine

Claims (1)

Claim: What is claimed is: 1. A light-emitting device processing production line comprising a dimple molding machine, a mounter and a bonder arranged in series, and a light emission comprising a dimple molding machine, a mounter, a bonder and a potting machine arranged in series. The production line for element processing, the frame welding machine, the primary encapsulation machine, the inner tie bar cutting machine, the secondary encapsulation machine are arranged in series, and the production line for processing the light-emitting element and the light-receiving element together; A production system for an optical coupler including a computer for centrally controlling each device and incorporating the following five features. (1) The lead frame of each of the light emitting diode and the phototransistor is continuously supplied to the production system by one lead frame. (2) A plurality of devices are connected by one lead frame or a lead frame obtained by cutting one lead frame, a lead frame buffer is provided between the devices, and the amount of the lead frame in the buffer is detected to Control the operation of equipment at both ends. (3) By making a hole in a specific place of the lead frame that is continuously supplied to the production system and detecting the position of the hole,
Apply control signals to the device. (4) The process progress information, the production quality information, and the device operation information are sent from each device of the production system to the computer, and the computer monitors and aggregates the process progress information, the production quality information, and the device operation information. (5) The lead frame feed mechanism of each device of the production system and the mechanism for determining the reference position of the lead frame for each device are independent.