JPH05218257A - Electronic component with guard body and its manufacture - Google Patents

Abstract

PURPOSE:To easily form an electronic component provided with a guard body, by punching a plate around the lead part of a lead frame which mounts a semiconductor chip and forms a molded body, and constituting a guard body by bending the plate. CONSTITUTION:A lead frame LF is punched along dashed lines A of a plate 104 around a lead 102. Plate parts 104a, 104b are bent upward along dashed lines C, and plate parts 104c, 104d are bent downward along the dashed lines C. By standing the plate parts, an electronic parts provided with a guard body can be obtained. Guard bodies 104a-104d protecting the lead 102 can be formed by bending the plate part 104.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component with a guard body and a method for manufacturing an electronic component with a guard body, and more specifically, an electronic component with a guard body having a guard body for protecting a lead by a plate portion of a lead frame. And a method for manufacturing the electronic component thereof.

[0002]

2. Description of the Related Art As an electronic component mounted on a substrate, there is one in which leads extend outward from a molded body such as QFP. In recent years, electronic components have been highly integrated, and the number of leads has been increased to several hundreds or more. For this reason, the leads tend to have a narrower pitch, and the leads are inevitably made finer and the strength is decreasing. Therefore, when an article hits the lead, the lead is easily bent and deformed, resulting in a defective product. There was a problem that became.

As a conventional means for solving such a problem, as shown in FIG. 8, a guard body 1 made of synthetic resin is provided at the tip of a lead 102 extending from a mold body 101.
An electronic component 100 with a guard body has been proposed in which the lead 102 is protected by forming 03.

[0004]

If the guard body 103 is formed as described above, there is an advantage that the lead 102 can be prevented from being bent and deformed by hitting an object on the lead 102 during storage or transportation. .. However, since the guard body 103 is formed by a synthetic resin molding apparatus, it is troublesome to manufacture and the cost is increased.

Therefore, an object of the present invention is to provide means for easily manufacturing an electronic component with a guard body.

[0006]

To this end, the present invention is designed to punch a plate portion around a lead portion of a lead frame,
This plate portion is bent to form a guard body.

[0007]

According to the above structure, the guard body can be easily formed by the plate portion of the lead frame only by punching and molding the lead frame.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 3 is a perspective view of the electronic component 100 with a guard body. Reference numeral 101 denotes a molded body, and leads 102 extend from the side surface thereof. 104 is a plate part,
The mold body 101 is supported by the tip portion of the support bar 105 extending from the plate portion 104. The peripheral portion of the plate portion 104 is bent and stands up, and the lead 102
Guards 104a, 104b, 104c, 1 for protecting the
It is 04d.

Next, a method of manufacturing the electronic component 100 will be described. FIG. 1 is a plan view of the lead frame LF. A semiconductor chip 106 is mounted on the lead frame LF, and a mold body 101 that protects the semiconductor chip 106 is formed. The lead frame LF shown in FIG. 1 is manufactured by exactly the same method as QFP. That is, the semiconductor chip 106 is mounted on the lead frame LF by the die bonder, and then the electrode of the semiconductor chip 106 and the lead 102 are connected by the wire bonder to the wire 10.
After connecting at 7, the mold body 101 is formed by the mold press device. However, when the semiconductor chip 106 is a flip chip or the like, the wire 107 is unnecessary.

Next, the lead frame LF is punched out along the broken line A on the plate portion 104 around the lead 102 by a punching device. FIG. 2 shows an electronic component obtained by punching the lead frame LF in this way. Next, the plate parts 104a and 104b are bent upward along the broken line C, and the plate parts 104c and 104d are bent downward along the broken line C to stand up to obtain the electronic component 100 with a guard body shown in FIG. Be done. By bending the plate portion 104 in this manner, the leads 10
Guard bodies 104a to 104d that protect the No. 2 are formed. As will be described later, this electronic component 100 has a structure shown in FIG.
By punching the support bar 105 along the broken line D (see FIG. 2) as shown in FIG.
And the electronic component 100 'is mounted on the substrate.

Next, a method of mounting the electronic component 100 with a guard body manufactured as described above on a substrate will be described.

FIG. 5 shows an electronic component 100 with a guard body on a substrate 8.
It is a side view of the apparatus mounted in 0. Reference numeral 1 denotes a tube-shaped chute as an electronic component supply unit, and the electronic component 100 (see FIG. 3) slides down inside the chute. The chute 1 is similar to a chute used in an electronic component supply device generally known as a tube feeder.
A tape feeder, a tray feeder, or the like may be used as the supply unit of the electronic component 100.

Reference numeral 2 is a support frame, and a horizontal ball screw 3 is mounted on the support frame 2. A motor 4 rotates the ball screw 3. Reference numeral 5 denotes a nut screwed onto the ball screw 3, and when the motor 4 is driven, the nut 5 slides along the ball screw 3.

Reference numeral 50 denotes a punching device, the structure of which will be described below. Reference numeral 6 denotes a lower die, which is rotatably attached to the nut 5 by a pin 11 (see also FIG. 6). A die 7 for punching is provided on the lower die 6. Reference numeral 8 denotes a plate cam, and a roller 9 that rolls on the plate cam 8 is pivotally mounted on the lower die 6.

In FIG. 5, when the motor 4 rotates forward,
The nut 5 moves to the left, the roller 9 rides on the slope 8a of the plate cam 8, and stops at the receiving position a for receiving the electronic component 100 sent from the chute 1. In this state,
As shown by the solid line, the lower mold 6 is the discharge part 10 of the chute 1.
It is located below and is inclined at the same angle as the chute 1. Further, in this state, the electronic component 100 sliding down the chute 1
Are passed on the die 7. When the motor 4 rotates in the reverse direction, the lower die 6 slides to the right while being guided by the plate cam 8, changing its posture from a tilted posture to a horizontal posture, and punching position b
Also, the electronic components 100 are sequentially stopped at the delivery position c where they are delivered to the transfer head 21. The punching position b is an intermediate point between both the receiving position a and the delivering position c. Further, in the above-mentioned respective constituent parts 3, 4, 5
It constitutes a reciprocating means for reciprocating between. As a means for delivering the electronic component 100 onto the die 7, the electronic component 100 sent from the tube 1 or the electronic component 100 stored in a tape feeder, a tray feeder, or the like.
May be delivered to the die 7 by a pickup head, and the delivery means is not limited to this embodiment. Further, the punching position is not limited to this embodiment, and an upper die may be provided above the delivery position a and punching may be performed at the delivery position a.

In FIG. 6, reference numeral 12 denotes an upper die provided above the punching position b, and punches 13a and 13b for punching.
And a guide pin 14 integrally provided on the lower portion of the upper die 12. The lower end of this guide pin 14 is
It is tapered so that it can be easily inserted into the pin hole 17 of the lower die 6. Reference numeral 59 denotes a base portion, and the guide rods 51 are provided upright on the four corners of the base portion 59. Reference numeral 52 denotes an upper plate attached to the upper end portion of the guide rod 51. On the upper plate 52, a cylinder 15 as an elevating means for elevating the upper mold 12 is installed, and the rod 16 is provided with the upper mold 12. It is installed.

Reference numeral 53 denotes a bearing which is inserted into the guide rod 51, and is mounted on a mounting portion 54 connected to the upper die 12 with a relatively large clearance C1 of, for example, about 300 μm (enlarged part in FIG. 6). See figure). Therefore, the upper die 12 can be swung slightly by the clearance C1 to swing. The upper die 12 has a plate portion 104
Adsorption holes 18 are formed as adsorption means. 19
Is a tube connected to the suction hole 18, and the die 7
The plate portion 104 (see FIG. 7) that is punched out by the punches 13a and 13b and separated from the mold body 101 is sucked.

When the rod 16 of the cylinder 15 is projected, the upper die 1 is moved along the rod 51 through the bearing 53.
2, the guide pin 14 is inserted into the pin hole 17, the support bar 105 is cut from the broken line D in FIG. 3 by one punch 13a as shown in FIG. 7, and the lead bar is cut by the other punch 13b. 102 is a broken line B (see FIGS. 1 and 3).
(Refer to FIG. 4) and punching is performed, and an electronic component 100 ′ shown in FIG. 4 is obtained. 30 is a guard body 104a
It is an escape recess of ~ 104d.

In FIG. 5, reference numeral 60 is a stocker of the plate portion 104 from which the mold body 101 is separated, and is provided below the punching position b. With the punching device 50,
As shown in FIG. 4, the plate portion 104, which has been punched out and separated from the electronic component 100 ′, falls into the stocker 60 and is collected. By the way, since the leads 102 have an extremely narrow pitch and the thickness of the leads 102 is extremely thin, such as several tens of μm, the punches 13a and 13b and the die 7 are required to have a very strict clearance of, for example, 2 μm or less. Therefore, by inserting the guide pin 14 on the upper die 12 side into the pin hole 17 on the lower die 6 side, the upper die 12 and the lower die 6 are precisely aligned so as to satisfy this clearance. .. However, the accuracy of the stop position of the lower die 6 due to the driving of the ball screw 3 is low, and generally 20 to
It is inevitable that a stop position error of about 30 μm will occur.

When the stop position error of the lower die 6 occurs in this way, the guide pin 14 cannot be fitted into the pin hole 17 smoothly, and seizure occurs between the guide pin 14 and the pin hole 17, or in the worst case. Tip is chipped. Therefore, in the present means, as described above, the bearing 53 is provided with the clearance C1 of about 300 μm so that the upper die 12 can be slightly swung, so that even if an error occurs in the stop position of the lower die 6,
The guide pin 14 is inserted into the pin hole 17 without difficulty, and the upper die 12 is rocked along with this insertion, whereby the upper die 12 and the lower die 6 are precisely aligned and the lead 102 can be punched out accurately. it can. Of course, the guide pin 14 and the pin hole 17 are designed to satisfy the above clearance.
Strictly processed and formed, and provided at a precise position.

In FIG. 5, reference numeral 21 is a transfer head of the electronic component mounting apparatus. The transfer head 21 has a delivery position c.
Then, the electronic component 100 ′ (see FIG. 4) punched from the plate portion 104 by the punching device 50 is adsorbed to the nozzle 22 and picked up, and transferred and mounted on the substrate 80.

The present apparatus has the above-mentioned structure, and the overall operation will be described below. The electronic component 100 that has slid down the chute 1 is delivered onto the die 7 of the lower die 6 waiting at the receiving position a. Next, the lower die 6 moves to the punching position b. Next, the cylinder 15 is operated and the upper die 12 is lowered along the guide rod 51, whereby the guide pin 14 is inserted into the pin hole 17, and the lead 102 and the support bar 10 are inserted.
5 is punched and formed by the die 7 and punches 13a and 13b. At this time, the punches 13a, 13b
If the die 7 and the die 7 are misaligned, the upper die 12 swings with respect to the lower die 6 when the guide pin 14 is inserted into the pin hole 17 as described above, thereby aligning the two. The lead 102 is punched with high precision.

Next, the upper mold 12 rises, but at this time,
The punched plate portion 104 is attracted to the upper mold 12,
Ascend with the upper mold 12. Next, the lower die 6 moves to the delivery position c, and the electronic component 100 ′ is picked up by the transfer head 21 and transferred and mounted on the substrate 80. That is,
The lower die 6 also serves as a pickup stage by the transfer head 21. Further, when the lower die 6 is withdrawn from the punching position b, the suction state of the plate portion 104 is released, and the plate portion 104 falls into the stocker 60 and is collected.
The stocker 60 may be mounted behind the lower die 6 integrally therewith, and by doing so, when the lower die 6 moves from the punching position b to the delivery position c, the plate portion 104 is removed. The stocker 60 can be dropped and collected.

[0024]

As described above, according to the present invention, an electronic component with a guard can be easily obtained.

[Brief description of drawings]

FIG. 1 is a plan view of a lead frame according to the present invention.

FIG. 2 is a perspective view of the electronic component.

FIG. 3 is a perspective view of the electronic component.

FIG. 4 is a separation view of the electronic component and the plate portion.

FIG. 5 is a side view of a mounting device for electronic components with a guard body according to the present invention.

FIG. 6 is a side view of the punching device.

FIG. 7 is an enlarged cross-sectional view of the main part of the device.

FIG. 8 is a perspective view of a conventional electronic component.

[Explanation of symbols]

 100 electronic parts 101 mold body 104 plate part 104a guard body 104b guard body 104c guard body 104d guard body 106 semiconductor chip LF lead frame

Claims (2)

[Claims] 1. An electronic device with a guard body, characterized in that a plate portion around a lead portion of a lead frame on which a semiconductor chip is mounted and a molded body is formed is punched out, and the plate portion is bent to form a guard body. parts. 2. A step of (1) mounting a semiconductor chip on a lead frame, (2) a step of forming a molded body on the lead frame, and (3) a step of punching out a plate part around the lead part. 4) A step of bending a punched plate portion to form a guard body, and a method of manufacturing an electronic component with a guard body.