JPH05209931A - Device for measuring semiconductor element - Google Patents

Abstract

PURPOSE:To isolate the affection by external noise so as to stabilize measured values in order to enhance the degree of accuracy for the measurement in the case of measuring a semiconductor element with the use of an automatic handler. CONSTITUTION:A device for measuring a semiconductor element comprises a metal measuring table (c) attached thereto with a socket (b) for fixing a semiconductor element (h) during measurement, a metal shield plate (i) integrally incorporated with a part for retaining the semiconductor element in parallel with the table. The measuring table (c) and the metal shield table (i) are electrically insulated from a handler body (f) while the earth line (e) of the measuring system is grounded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element measuring apparatus, and more particularly to a semiconductor element measuring apparatus effective when measuring a small signal using an auto handler.

[0002]

2. Description of the Related Art A conventional semiconductor device measuring apparatus electrically insulates a measurement table c, to which a socket b for mounting a semiconductor device h is attached, from a handler body f by an insulating part g, as shown in FIG. The measurement test box d is electrically connected to the measurement table c, and is connected to a measurement system ground line independent of the handler side.

A mechanism for pressing the semiconductor element h is composed of a suction nozzle i, a lead fixing portion j, and a lead fixing component supporting portion k, and each component is made of an insulating material and electrically connected to the semiconductor element h. Insulated.

[0004]

In the conventional shield mechanism of the semiconductor element measuring apparatus, the upper side of the semiconductor element is not covered at the time of measurement, and the product holding portion is insulated and the handler side and the measuring instrument side are insulated. Since it is not connected to any of them, the high frequency propagation noise from the mechanical drive pulse motor, servo motor and large current switch circuit of the handler that supplies the semiconductor element cannot be completely cut off, the measured value is not stable, and the measurement accuracy deteriorates. There was a problem such as doing.

[0005]

According to the present invention, a conductive measuring table having a socket for fixing a semiconductor element attached thereto, a conductive semiconductor element holding portion, and a conductive portion electrically connected to the holding portion. It is possible to obtain a semiconductor device measuring apparatus having a conductive shield plate, and the measurement table and the shield plate are electrically insulated from the handler.

Further, according to the present invention, the above-mentioned semiconductor element measuring device in which the measuring table and the shield plate are grounded can be obtained.

Furthermore, according to the present invention, the aforementioned semiconductor device measuring apparatus in which the measuring table and the shield plate are further electrically connected to the measuring test box can be obtained.

Further, according to the present invention, it is possible to obtain the above-mentioned semiconductor element measuring device in which the shield plate is composed of a plurality of plates.

[0009]

The present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of a semiconductor device measuring apparatus showing a first embodiment of the present invention. 2 is an enlarged view of the product holding part of the measuring device of FIG. 1, and FIG. 3 is a view of the product holding part of FIG. 2 seen from above the suction nozzle. The left side is with a shield plate, and the right side is a state where the shield plate is removed. Shown respectively.

The semiconductor element h is a metallic measuring table c electrically insulated from the handler body f by an insulating part g.
It is fixed to the socket b assembled in by the suction nozzle i and the lead fixing portion j. At this time, the lead fixed component support portion k and the metal suction nozzle i have an integrated structure, and the metal shield plate 1 is arranged parallel to the measurement table c.
In this state, the product pressing portion a is insulated from the handler f, and is connected to the test box d electrically connected to the measurement table c by the GND line e. At this time, the test box d is connected to the ground wire of the measurement system independently of the handler.

With respect to the size of the shield plate, a hardening was obtained against the blocking of external noise which affects the measurement when the following specifications were met.

In FIG. 4, the length W of one side of the shield plate is sufficiently larger than the size of the semiconductor element, and the relationship between the height H from the upper surface of the semiconductor element to the shield plate and W is W ≧ 3H. is there.

FIG. 5 is a mechanical operation diagram of a semiconductor element measuring apparatus showing a second embodiment of the present invention, and FIG. 6 is a plan view of a shield plate of the semiconductor element measuring apparatus of one embodiment of the present invention. In the second embodiment, it is divided into a plurality of parts.

In the state shown in FIG. 5A, the semiconductor element h is conveyed by the suction nozzle i to the position of the socket b on the measurement table c. In this state, the semiconductor element h is pressed onto the socket b as shown in FIG.

Next, as shown in FIG. 5C, the left and right lead fixing portions j and the shield plate 1 fix the semiconductor element h.

At this time, the shield plate 1 and the suction nozzle i are electrically connected by the recess m for connecting to the suction nozzle shown in FIG.

[0018]

As described above, the present invention has the measurement table and the shield plate which are electrically insulated from the handler body and arranged in parallel with each other, and both are electrically connected to the measurement test box. With this structure, when measuring a semiconductor element, the influence of external noise can be blocked by about 90% as a peak level of noise, and as a result, the stability of measured values and the accuracy of measured values can be improved.

Further, by dividing the shield plate into two parts on the left and right sides and separating them from the suction nozzles and operating each independently, the transportation system of the semiconductor element including the suction nozzles can be made light in weight, thus speeding up the mechanical operation and Since loss time such as opening and closing the shield plate can be easily shortened, it is possible to suppress the deterioration of the ability of the auto handler.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor device measuring apparatus showing a first embodiment according to the present invention.

FIG. 2 is an enlarged view of a lead retainer of the measuring device shown in FIG.

FIG. 3 is a plan view of the lead pressing portion of FIG. 2 seen from above the suction nozzle.

FIG. 4 is a model cross-sectional view of a semiconductor device measuring apparatus according to the first embodiment of the present invention.

FIG. 5 is a mechanical operation diagram of a semiconductor device measuring apparatus showing a second embodiment of the present invention.

FIG. 6 is a plan view of a shield plate of a semiconductor device measuring apparatus showing a second embodiment of the present invention.

FIG. 7 is a sectional view of a conventional semiconductor device measuring apparatus.

[Explanation of symbols]

 a Product pressing part b Socket c Measurement table d Test box e GND line f Handler body g Insulating part h Semiconductor element i Adsorption nozzle j Lead fixing part k Lead fixing part support part l Shield plate m Indentation for connection to adsorption nozzle

Claims (4)

[Claims] 1. A conductive measuring table to which a socket for fixing a semiconductor element is attached, the conductive semiconductor element pressing portion, and a conductive shield plate electrically connected to the pressing portion. The semiconductor device measuring apparatus, wherein the measurement table and the shield plate are electrically insulated from a handler. 2. The semiconductor device measuring apparatus according to claim 1, wherein the measurement table and the shield plate are grounded. 3. The semiconductor device measuring apparatus according to claim 1, wherein the measurement table and the shield plate are further electrically connected to a measurement test box. 4. The semiconductor device measuring apparatus according to claim 1, wherein the shield plate is composed of a plurality of plates.