JPH05206202A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the mounting area of a semiconductor chip, by forming a terminal resistance layer for impedance matching of a transmission line, on a chip carrier. CONSTITUTION:A semiconductor chip 3 to which bumps 4 are joined is mounted on the tips of metal leads 2 protruding on the aperture part lower surface of an insulating film 1 of polyimide based resin or the like. On the upper surface of the insulating film 1, a resistance layer 5 for a terminal resistor which is matched with the characteristic impedance of a transmission line and composed of a thin film or a thick film is formed along the leads 2, and connected with the leads 2 via a through hole 6 formed in the vicinity of the bumps 4. Since the terminal resistor is not constituted as an individual parts, high density mounting can be realized. Since the resistance layer is constituted of a thin film or a thick film, fine working is enabled, and the effect that impedance characteristics or the like can be easily and precisely matched is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a chip carrier.

[0002]

2. Description of the Related Art In a conventional semiconductor device, as shown in FIG. 2, a packaged semiconductor chip 11 is mounted on a printed wiring board, and wiring 12 of the printed wiring board electrically connected to the semiconductor chip 11 is provided. The resistors 13 for terminating were connected in parallel and mounted as separate parts from the semiconductor chip 11.

[0003]

In this conventional semiconductor device, the resistance for terminating the transmission line is a separate component.
There is a problem that the assembly is complicated and a valuable space on the wiring board is taken up by the terminating resistor for preventing reflection of the transmission waveform to be included in the transmission path.

Further, since the resistors of the individual parts are used, it is difficult to precisely match the respective resistance values.

[0005]

The semiconductor device of the present invention comprises:
A metal lead which is arranged on one surface of the insulating film having an opening in the center and whose tip projects into the opening, and a through hole which is provided on the other surface of the insulating film and provided on the insulating film. A resistance layer electrically connected to the metal lead through a hole, and a semiconductor chip connected to the tip of the metal lead and mounted.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

1A and 1B are a plan view and a sectional view taken along the line AA 'showing an embodiment of the present invention.

As shown in FIGS. 1 (a) and 1 (b), an insulating film 1 made of polyimide resin or the like having an opening at the center thereof.
The semiconductor chip 3 in which the bumps 4 provided on the semiconductor chip 3 are bonded to the tips of the metal leads 2 of the chip carrier which are arranged on the lower surface of the Attach it to the carrier. On the upper surface of the insulating film 1, a resistance layer 5 made of a thin film or a thick film formed along the lead 2 for terminating resistance is provided, and electrically connected to the metal lead 2 on the lower surface through a through hole 6 provided in the insulating film 1. It is connected.

Here, the resistance layer 5 is matched with the characteristic impedance of the transmission line, and the through hole 6 is formed as close to the bump 4 as possible in consideration of the influence of reflection in the transmission line.

[0010]

As described above, according to the present invention, since the terminating resistance layer for the purpose of impedance matching of the transmission line is provided on the chip carrier, the mounting area can be reduced when mounting the semiconductor chip, and the high density mounting can be achieved. It has an effect that can be realized.

Further, since the resistance layer can be formed of a thin film or a thick film which can be easily microfabricated, it has an effect of facilitating precise adjustment of impedance characteristics and the like.

[Brief description of drawings]

FIG. 1 is a plan view and a sectional view taken along the line AA ′ showing an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing an example of a conventional semiconductor device.

[Explanation of symbols]

 1 Insulating Film 2 Metal Lead 3 Semiconductor Chip 4 Bump 5 Resistive Layer 6 Through Hole 11 Semiconductor Chip 12 Wiring 13 Resistive Component

Claims (1)

[Claims] 1. A metal lead which is arranged on one surface of an insulating film having a hole in the center thereof and has a tip protruding into the hole, and a metal lead which is provided on the other surface of the insulating film. A semiconductor device comprising: a resistance layer electrically connected to the metal lead through a through hole provided in a film; and a semiconductor chip connected to and mounted on a tip of the metal lead.