JPH0520365U - Heat dissipation mounting structure for integrated circuits - Google Patents

Abstract

(57) [Abstract] [Purpose] To efficiently dissipate heat from the integrated circuit when the integrated circuit is mounted on a printed circuit board. [Structure] The integrated circuit 1 is mounted on a surface pattern 3 of an integrated circuit mounting portion on a printed circuit board 4 with a thermal conductive grease 2 interposed therebetween. Further, three large-diameter conductor holes 6 are bored through the printed board from the surface pattern on which the integrated circuit is mounted. Then, the heat conductive grease is filled in these conductor holes, and the back surface pattern 5 formed on the back surface of the printed circuit board is used for heat dissipation, so that heat can be transferred efficiently and with low heat resistance. Try to demonstrate.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an integrated circuit heat dissipation mounting structure, and more particularly to an integrated circuit heat dissipation mounting structure by surface mounting of a printed circuit board.

[0002]

[Prior Art]

 As a heat dissipation structure of an integrated circuit by surface mounting on a printed circuit board, a structure as shown in FIG. 2 has been conventionally known. To briefly explain this, the integrated circuit 1 is mounted on the surface pattern 3 of the printed board 4 in a state where the heat conductive grease 2 is put in the lower heat radiation portion thereof. Reference numeral 5 in the drawing denotes a back surface pattern formed on the back surface of the printed circuit board 4.

Then, the heat generated in the integrated circuit 1 is conducted to the surface pattern 3 on the printed board 4 from the lower heat radiation portion of the integrated circuit 1 through the heat conductive grease 2, and is radiated to the entire printed board 4. It was a mounting structure that

[0004]

[Problems to be solved by the device]

 However, in the above-described conventional mounting structure with an integrated circuit, the heat conductive grease 2 is passed through the heat dissipation portion of the integrated circuit 1 to conduct heat to the surface pattern 3 of the printed circuit board 4 and dissipate heat from the entire printed circuit board 3. Since it has only the structure, there is a problem that sufficient heat dissipation effect is not obtained. That is, in the above-described conventional structure, the heat generated from the integrated circuit 1 has a small thermal resistance up to the surface pattern 3 of the printed circuit board 4 through the heat conductive grease 2, so that sufficient heat conduction can be obtained. However, since the printed board 4 has a large thermal resistance, it cannot be said that a sufficient heat dissipation effect can be obtained by obtaining heat conduction over the entire surface of the printed board 4.

[0005]

[Means for Solving the Problems]

 In order to meet such demands, the heat dissipation mounting structure for an integrated circuit according to the present invention is a printed circuit board on which an integrated circuit is mounted and mounted, and a pattern is printed from the pattern of the integrated circuit mounting part on the printed circuit board toward the back surface side of the printed circuit board. A plurality of large-diameter conductor holes provided, thermal conductive grease applied between the integrated circuit and the surface pattern and filling the plurality of large-diameter conductor holes, and a back surface of the printed circuit board. It has a formed back surface pattern for heat dissipation, and the heat conductive grease filled in the conductor holes is configured to conduct the heat generated in the integrated circuit from the front surface pattern to the back surface pattern so that the heat can be released. It is a thing.

[0006]

[Action]

 According to the present invention, the heat generated from the integrated circuit is conducted to the surface pattern of the printed circuit board through the heat conductive grease, and the heat conductive grease filled in the plurality of large-diameter conductor holes. It is also possible to conduct the heat to the backside pattern of the printed circuit board through this, thereby reducing the thermal resistance in the printed circuit board, and to fully exert the heat dissipation effect also through this backside pattern.

[0007]

【Example】

 FIG. 1 shows an embodiment of a heat dissipation mounting structure for an integrated circuit according to the present invention. The same or corresponding parts in FIG. 2 as those in FIG. 2 are designated by the same reference numerals and detailed description thereof will be omitted. ..

According to the present invention, in the heat dissipation mounting structure of the integrated circuit 1 having the above-described configuration, the surface pattern 3 corresponding to the mounting portion of the integrated circuit 1 on the printed circuit board 4 faces the rear surface side of the printed circuit board 4. By forming three large diameter conductor holes 6 and filling the conductor holes 6 with the heat conductive grease 2 applied between the integrated circuit 1 and the surface pattern 3, It is characterized in that the back surface pattern 5 for heat radiation, which receives conduction of heat generated in the integrated circuit 1 through the heat conductive grease 2, is formed on the back surface of the printed circuit board 4.

According to such a configuration, the heat generated from the integrated circuit 1 is conducted to the surface pattern 3 of the printed circuit board 4 via the thermal conductive grease 2, and at the same time, three large diameters are used. It is also conducted to the back surface pattern 5 of the printed circuit board 4 through the heat conductive grease 2 filled in the conductor holes 6 and radiated through the back surface pattern 5, whereby the thermal resistance of the printed circuit board 4 is reduced. The heat dissipation effect can be exhibited more efficiently and surely than before by reducing the heat dissipation.

It is needless to say that the present invention is not limited to the structure of the above-described embodiment, and the shape, structure, etc. of each part can be appropriately modified and changed. For example, in the above-mentioned embodiment, the case where three large-diameter conductor holes 6 are formed in the mounting portion of the printed circuit board 4 on which the integrated circuit 1 is mounted is shown, but the present invention is not limited to this, and the thermal resistance is not limited thereto. It suffices that heat can be conducted from the front surface pattern 3 to the back surface pattern 5 of the printed circuit board 4 in a state in which the size is reduced. The number and size of the conductor holes 6 depend on the size and heat generation amount of the integrated circuit 1. All you have to do is set it.

[0011]

[Effect of the device]

 As described above, according to the heat dissipation mounting structure of the integrated circuit according to the present invention, the printed circuit board on which the integrated circuit is mounted is mounted, and the pattern of the integrated circuit mounting portion on the printed circuit board is directed toward the back surface side of the printed circuit board. Formed on the back surface of the printed circuit board are a plurality of perforated large-diameter conductor holes, thermal conductive grease applied between the integrated circuit and the surface pattern and filling the large-diameter conductor holes. Since the back surface pattern for heat dissipation is provided, and the heat conductive grease filled in the conductor holes is configured to conduct the heat generated in the integrated circuit from the front surface pattern to the back surface pattern so that the heat can be dissipated. Despite the simple structure, the heat generated from the integrated circuit was conducted to the surface pattern of the printed circuit board through the heat conductive grease and filled in the large-diameter conductor hole. Can be conducted by reducing the thermal resistance on the back surface of the PC board via a conductive grease, there is a practically superior effect of being able to exert a sufficient heat radiation effect through the back-side pattern.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view of an essential part showing an embodiment of a heat dissipation mounting structure for an integrated circuit according to the present invention.

FIG. 2 is a schematic cross-sectional view illustrating a heat dissipation mounting structure of a conventional integrated circuit.

[Explanation of symbols]

 1 Integrated Circuit 2 Thermal Conductive Grease 3 Surface Pattern 4 Printed Circuit Board 5 Backside Pattern 6 Conductor Hole

Claims (1)

[Scope of utility model registration request] 1. A printed circuit board on which an integrated circuit is mounted and mounted, a plurality of large-diameter conductor holes formed from a surface pattern of the integrated circuit mounting portion on the printed circuit board toward a rear surface of the printed circuit board, and A thermal conductive grease which is applied between the integrated circuit and the surface pattern and is filled in the plurality of large-diameter conductor holes, and positions corresponding to the plurality of large-diameter conductor holes are included. A back surface pattern for heat dissipation formed on the back surface of the printed circuit board, and heat generated in the integrated circuit can be conducted through the heat conductive grease filled in the conductor holes in the back surface pattern. A heat dissipating mounting structure for an integrated circuit characterized by being configured.