JPH04359586A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH04359586A JPH04359586A JP13454591A JP13454591A JPH04359586A JP H04359586 A JPH04359586 A JP H04359586A JP 13454591 A JP13454591 A JP 13454591A JP 13454591 A JP13454591 A JP 13454591A JP H04359586 A JPH04359586 A JP H04359586A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flat
- protrusion
- mini
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、印刷配線基板に関し、
特に高放熱性が要求される金属板を使用した印刷配線基
板に関する。[Industrial Application Field] The present invention relates to a printed wiring board,
In particular, it relates to a printed wiring board using a metal plate that requires high heat dissipation.
【０００２】0002
【従来の技術】図３は従来の金属板を使用した印刷配線
基板の一例にミニフラットＩＣを搭載した断面図である
。2. Description of the Related Art FIG. 3 is a cross-sectional view of a mini-flat IC mounted on an example of a conventional printed wiring board using a metal plate.
【０００３】図３に示す様に、従来の印刷配線基板は、
平坦な金属板４上に絶縁層３を形成し、さらに、その上
に部品搭載ランド２を銅箔などで形成し後、その部品搭
載ランド２上にミニフラットＩＣ１を搭載していた。As shown in FIG. 3, the conventional printed wiring board is
An insulating layer 3 is formed on a flat metal plate 4, and a component mounting land 2 is formed thereon with copper foil or the like, and then a mini-flat IC 1 is mounted on the component mounting land 2.
【０００４】この印刷配線基板は、金属板４の表面が平
坦であるため、ミニフラットＩＣ１の裏面と絶縁層３と
の間に空間ができ、その為、ミニフラットＩＣ１で発熱
した熱は、印刷配線基板を通して、放熱しにくい構造と
なっていた。In this printed wiring board, since the surface of the metal plate 4 is flat, a space is created between the back surface of the mini-flat IC 1 and the insulating layer 3, so that the heat generated by the mini-flat IC 1 is transferred to the printed circuit board. The structure made it difficult to dissipate heat through the wiring board.
【０００５】[0005]
【発明が解決しようとする課題】上述した従来の印刷配
線基板は、金属板が平坦な為、ミニフラットＩＣの裏面
と絶縁層との間に空間ができてしまい、ミニフラットＩ
Ｃで発生した熱が印刷配線基板を通して放熱しにくいと
いう問題点があった。[Problems to be Solved by the Invention] In the conventional printed wiring board described above, since the metal plate is flat, a space is created between the back surface of the mini-flat IC and the insulating layer.
There was a problem in that the heat generated by C was difficult to dissipate through the printed wiring board.
【０００６】本発明の目的は、放熱特性の優れた印刷配
線基板を提供することにある。An object of the present invention is to provide a printed wiring board with excellent heat dissipation characteristics.
【０００７】[0007]
【課題を解決するための手段】本発明は、金属板と、該
金属板を被覆する絶縁層と、該絶縁層上に形成された部
品搭載ランドとを有する印刷配線基板において、前記部
品搭載ランド間に搭載するＩＣの裏面と接触する凸部を
形成する。Means for Solving the Problems The present invention provides a printed wiring board having a metal plate, an insulating layer covering the metal plate, and a component mounting land formed on the insulating layer. A convex portion is formed which contacts the back surface of the IC mounted between the two.
【０００８】[0008]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments Next, embodiments of the present invention will be described with reference to the drawings.
【０００９】図１は本発明の第１の実施例にミニフラッ
トＩＣを搭載した断面図である。FIG. 1 is a sectional view of a first embodiment of the present invention in which a mini-flat IC is mounted.
【００１０】第１の実施例は、図１に示す様に、例えば
、２０ピンのＳＯＰミニフラットＩＣ１を搭載する場合
は、まず、高さが１００μｍ程度の凸部を金属板４に設
け、その上に絶縁層３を形成する。次に、その上に凸部
を挟んで部品塔載ランド２を形成する。次に、裏面が印
刷配線基板の凸部に接する様にミニフラットＩＣ１を搭
載する。In the first embodiment, as shown in FIG. 1, when mounting a 20-pin SOP mini-flat IC 1, first, a convex portion with a height of about 100 μm is provided on the metal plate 4, and then An insulating layer 3 is formed thereon. Next, a component mounting land 2 is formed thereon with the convex portion sandwiched therebetween. Next, the mini-flat IC 1 is mounted so that the back side is in contact with the convex portion of the printed wiring board.
【００１１】この様な構造にすることによって、ミニフ
ラットＩＣ１の裏面が印刷配線基板の凸部に接している
為に、ミニフラットＩＣ１で発生した熱が、効率よく金
属板４を通して放熱される。With this structure, the back surface of the mini-flat IC 1 is in contact with the convex portion of the printed wiring board, so that the heat generated in the mini-flat IC 1 is efficiently radiated through the metal plate 4.
【００１２】図２は本発明の第２の実施例にミニフラッ
トＩＣを搭載した断面図である。FIG. 2 is a sectional view of a second embodiment of the present invention in which a mini-flat IC is mounted.
【００１３】第２の実施例は、図２に示す様に、金属板
４上に、例えば、２０ピンのＳＯＰミニフラットＩＣ１
を搭載する場合は、まず、高さが１００μｍ程度の凸部
を絶縁層３に形成し、さらに、その上に凸部を挟んで部
品搭載ランド２を形成する。次に、裏面が印刷配線基板
の凸部に接する様にミニフラットＩＣ１を搭載する。In the second embodiment, as shown in FIG. 2, for example, a 20-pin SOP mini-flat IC 1 is mounted on a metal plate 4.
When mounting a component, first, a convex portion having a height of about 100 μm is formed on the insulating layer 3, and then a component mounting land 2 is formed on the insulating layer 3 with the convex portion sandwiched therebetween. Next, the mini-flat IC 1 is mounted so that the back side is in contact with the convex portion of the printed wiring board.
【００１４】この様な構造にすることによっても、第１
の実施例と同様の効果が得られる。[0014] By adopting such a structure, the first
The same effects as in the embodiment can be obtained.
【００１５】[0015]
【発明の効果】以上説明したように、本発明は、印刷配
線基板に凸部を設け、裏面がこの凸部に接する様にミニ
フラットＩＣを搭載することにより、優れた放熱特性が
得られるという効果がある。[Effects of the Invention] As explained above, the present invention provides excellent heat dissipation characteristics by providing a convex portion on a printed wiring board and mounting a mini-flat IC so that the back surface is in contact with the convex portion. effective.
【図１】本発明の第１の実施例にミニフラットＩＣを搭
載した断面図である。FIG. 1 is a cross-sectional view of a mini-flat IC mounted on a first embodiment of the present invention.
【図２】本発明の第２の実施例にミニフラットＩＣを搭
載した断面図である。FIG. 2 is a sectional view of a second embodiment of the present invention equipped with a mini-flat IC.
【図３】従来の金属板を使用した印刷配線基板の一例に
ミニフラットＩＣを搭載した断面図である。FIG. 3 is a cross-sectional view of a mini-flat IC mounted on an example of a conventional printed wiring board using a metal plate.
１ ミニフラットＩＣ ２ 部品搭載ランド ３ 絶縁層 ４ 金属板 1 Mini flat IC 2 Parts mounting land 3 Insulating layer 4 Metal plate
Claims (3)
該絶縁層上に形成された部品搭載ランドとを有する印刷
配線基板において、前記部品搭載ランド間に搭載するＩ
Ｃの裏面と接触する凸部を形成したことを特徴とする印
刷配線基板。Claim 1: a metal plate; an insulating layer covering the metal plate;
In the printed wiring board having component mounting lands formed on the insulating layer, an I mounted between the component mounting lands is provided.
A printed wiring board characterized in that a convex portion is formed in contact with the back surface of the printed circuit board.
とする請求項１記載の印刷配線基板。2. The printed wiring board according to claim 1, wherein the convex portion is formed on a metal plate.
とする請求項１記載の印刷配線基板。3. The printed wiring board according to claim 1, wherein the convex portion is formed on an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13454591A JPH04359586A (en) | 1991-06-06 | 1991-06-06 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13454591A JPH04359586A (en) | 1991-06-06 | 1991-06-06 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04359586A true JPH04359586A (en) | 1992-12-11 |
Family
ID=15130825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13454591A Pending JPH04359586A (en) | 1991-06-06 | 1991-06-06 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04359586A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005094144A1 (en) * | 2004-03-29 | 2005-10-06 | Sanyo Electric Co., Ltd. | Circuit device and method for manufacturing same |
-
1991
- 1991-06-06 JP JP13454591A patent/JPH04359586A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005094144A1 (en) * | 2004-03-29 | 2005-10-06 | Sanyo Electric Co., Ltd. | Circuit device and method for manufacturing same |
| JPWO2005094144A1 (en) * | 2004-03-29 | 2008-02-14 | 三洋電機株式会社 | Circuit device and manufacturing method thereof |
| JP4722836B2 (en) * | 2004-03-29 | 2011-07-13 | 三洋電機株式会社 | Circuit device and manufacturing method thereof |
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