JPH0519970Y2 - - Google Patents

Info

Publication number

JPH0519970Y2

JPH0519970Y2 JP1987166053U JP16605387U JPH0519970Y2 JP H0519970 Y2 JPH0519970 Y2 JP H0519970Y2 JP 1987166053 U JP1987166053 U JP 1987166053U JP 16605387 U JP16605387 U JP 16605387U JP H0519970 Y2 JPH0519970 Y2 JP H0519970Y2

Authority

JP

Japan

Prior art keywords

electrodes

polymer piezoelectric

lead wires

piezoelectric element

storage part

Prior art date

1987-10-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• 229920000642 polymer Polymers 0.000 claims description 18
• 239000012790 adhesive layer Substances 0.000 claims description 6
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
• 239000012528 membrane Substances 0.000 description 8
• 239000000853 adhesive Substances 0.000 description 3
• 230000001070 adhesive effect Effects 0.000 description 3
• 239000000463 material Substances 0.000 description 2
• FCYVWWWTHPPJII-UHFFFAOYSA-N 2-methylidenepropanedinitrile Chemical compound N#CC(=C)C#N FCYVWWWTHPPJII-UHFFFAOYSA-N 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000002033 PVDF binder Substances 0.000 description 1
• 229930182556 Polyacetal Natural products 0.000 description 1
• 239000002390 adhesive tape Substances 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 239000002131 composite material Substances 0.000 description 1
• 229920001577 copolymer Polymers 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 229920006332 epoxy adhesive Polymers 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 238000000605 extraction Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229920006324 polyoxymethylene Polymers 0.000 description 1
• 238000007738 vacuum evaporation Methods 0.000 description 1