JPH05198464A - Electronic part holding device for dry type thin film forming method - Google Patents

Abstract

PURPOSE:To obtain an electronic part holding device for dry type thin film forming method which ensures difficulty of peeling of a deposited thin film, thereby reduces frequency of removing deposited thin film with the etching and also curtails etching time. CONSTITUTION:An electronic part holding device for thin film forming method 1 is provided with a structure in which at least a surface 1a on which a thin film formed by the dry type thin film forming method is deposited has a surface roughness in which the mean roughness of the center line Ra is =0.5mum or higher.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component holder used for forming electrodes or the like on an electronic component by a dry thin film forming method, and in particular, it is attached by a dry thin film forming method by devising the surface condition. The present invention relates to an electronic component holder having a structure in which peeling of a film is less likely to occur.

[0002]

2. Description of the Related Art Conventionally, in forming electrodes and the like on an electronic component element body, a dry thin film forming method such as vapor deposition, sputtering or ion plating has been widely used. A case of forming electrodes on the electronic component element body by this type of dry thin film forming method will be described with reference to FIGS. First, the electronic component holder 1 shown in FIG. 2 is prepared. The electronic component holder 1 is
It has a plurality of holding holes 2 made of metal or synthetic resin for holding the electronic component body. When forming the electrode, as shown in FIG. 3, the electrode 4 is formed by the dry thin film forming method in the vacuum chamber with the electronic component element body 3 inserted and held in the holding hole 2. In this case, the thin film formed by the dry thin film forming method is not limited to the portion forming the electrode 4,
The metal film 4a also adheres to the surface 1a of the electronic component holder 1.

By the way, the surface 1a of the electronic component holder 1
When the electronic component holder 1 is made of a metal such as stainless steel, the surface roughness thereof is a mirror surface or a degree close to a mirror surface. Similarly, also in the case of the electronic component holder 1 made of a synthetic resin, it is usual that the surface of the mold is mirror-finished in order to enhance the releasability after molding. Therefore, the obtained molded product, that is, the surface 1 of the electronic component holder 1
Usually, a is configured to have a mirror surface or a surface roughness in a state close to a mirror surface.

On the other hand, in the case of forming a plurality of layers of electrodes on the surface of the electronic component body 3, in many cases, after the state shown in FIG. 3, a metal film is further laminated by a dry thin film forming method. As described above, when a plurality of thin films are sequentially formed, or after the electrodes are formed on the surface of the electronic component base body 3, the electronic component base body 3 is removed from the holding hole 2 to hold a new electronic component base body. When the thin film is repeatedly formed by inserting the film in the No. 2 and the dry thin film forming method, the metal films 4a to 6a are stacked on the surface 1a of the electronic component holder 1, as shown in FIG.
Then, as the metal films 4a to 6a are stacked,
The laminated metal films 4a to 6a were partially peeled off, which sometimes caused troubles in the apparatus used in the dry thin film forming method. Therefore, conventionally, the metal films 4a to 6a attached to the surface 1a of the electronic component holder 1 as described above are removed by etching after repeating the thin film forming method several times.

[0005]

However, the above-mentioned etching is usually carried out using an acid specified by a specific chemical substance, and since the etching requires a considerable amount of time, it is difficult to carry out the work. There was a risk of adversely affecting the health of the person. Therefore, there is a strong demand for reducing the frequency of etching and shortening the etching time.

An object of the present invention is to provide a holder used when a metal film is formed on an electronic component by a dry thin film forming method, in which the frequency of removing the metal film attached to the holder by etching and the etching time are reduced. It is an object of the present invention to provide an electronic component holder for a dry thin film forming method, which can shorten the manufacturing cost.

[0007]

In the electronic component holder for a dry thin film forming method of the present invention, at least the surface on which the film formed by the dry thin film forming method adheres has a center line average roughness Ra value of 0.5 μm. It is characterized by having the above surface roughness.
The centerline average roughness Ra value is JISB060.
1 This is the center line average roughness Ra in "surface roughness".

[0008]

In the electronic component holder of the present invention, since the surface of the portion to which the film formed by the thin film forming method has a surface roughness of at least the center line average roughness Ra value of 0.5 μm or more, The film is firmly attached to the surface of the electronic component holder. Therefore, even if the dry thin film forming method is repeated and a plurality of layers of film adhere to the surface of the electronic component holder, the laminated film is unlikely to peel off. Therefore, the frequency of removing the attached film by etching can be reduced. In addition, since the surface of the electronic component holder has the above-mentioned surface roughness, microcracks are likely to occur in the attached thin film, and therefore the etching solution enters from the microcracks during etching, thereby enhancing the etching effect. ..
Therefore, the time for removing the thin film by etching can be shortened.

[0009]

Description of Embodiments The electronic component holder 1 having the same structure as that shown in FIG. I prepared the prepared one. The electronic component holder 1 of Conventional Example 1 having a Ra value of 0.09 μm is made of heat-resistant synthetic resin,
The surface obtained by molding was used as it was as a mirror surface. Further, in Conventional Example 2, the surface is made of a heat-resistant resin in a state close to a mirror surface, and the surface roughness of the surface is R.
An a value of 0.3 μm was used. On the other hand, the electronic component holder of Example 1 was made of heat-resistant synthetic resin, was brush-polished with # 600 abrasive grains, and had an Ra value of 0.5.
What was made into μm was used. Further, the electronic component holder of Example 2 is made of heat resistant synthetic resin and has a surface of # 50.
Brush-polished with an abrasive grain of 0 and an Ra value of 0.68 μm was used.

[0010]

[Table 1]

With respect to the above-mentioned four types of electronic component holders, a Ni-based alloy film and an Ag film were repeatedly formed to a thickness of about 1 μm in a vacuum vapor deposition apparatus. 1 μm
The Ni-based alloy film and the Ag film having a certain thickness are laminated
This is because conventionally, in the case of this combination, film peeling is likely to occur during mass production, which tends to cause troubles in the vacuum vapor deposition apparatus.

FIG. 5 shows a state in which the Ni-based alloy film 7a and the Ag film 8a are sequentially laminated on the surface 1a of the electronic component holder 1 as described above. As described above, when the Ni-based alloy film and the Ag film were repeatedly laminated, the number of film formations that resulted in film peeling when using the electronic component holders of Examples 1 and 2 and Conventional Examples 1 and 2 was as follows. The results are shown in Table 1. That is, in the electronic component holders of Conventional Examples 1 and 2, when the Ni-based alloy film 7a and the Ag film 8a were formed once, film peeling occurred after the above film formation was repeated four times. Further, in Conventional Example 2, film peeling occurred 5 times after the film formation. On the other hand, in Examples 1 and 2, film peeling occurred after forming the film 10 times or more. Therefore, it can be seen that film peeling is unlikely to occur when the electronic component holders of Examples 1 and 2 having the surface roughness Ra value of 0.5 μm or more are used. Therefore, in the electronic component holders of Examples 1 and 2, the frequency of etching the attached film can be reduced.

Further, the above-mentioned conventional examples 1 and 2 and examples 1 and 2 are also provided.
In the thin film attached to the electronic component holder of
In order to confirm whether cracks have occurred, Ni
Forming a laminated film consisting of the system alloy film 7a and the Ag film 8a three times
35% by weight HNO ₃Dip in and etch
went. As a result,
Even in the case of a misaligned electronic component holder, only the Ag film 8a comes first.
Etched on. However, as shown in Table 1,
In the electronic component holders of Conventional Examples 1 and 2, the Ni-based alloy film 7a is
Perhaps because of the blocking of the etching solution, the Ag film
It took 9 minutes or more to complete the etching. this
On the other hand, when the electronic component holders of Examples 1 and 2 are used
Within 3 minutes, the Ag film 8a should be removed by etching.
Completed.

Therefore, in the electronic component holders of Examples 1 and 2, as shown in the enlarged view of FIG. 1, on the surface 1a of the electronic component holder 1, the Ni-based alloy film and the Ag-based film were formed along the unevenness.
Since a film is to be formed, a large number of microcracks A are generated, and it is considered that the etching solution entered each microcrack A and the Ag film was rapidly etched.

[0015]

As described above, according to the present invention, at least the surface on which the film formed by the dry thin film forming method has a center line average roughness Ra value of 0.5 μm or more. Since it is configured as described above, even if the film formation by the dry thin film formation method is repeated, peeling of the thin film attached to the surface of the holder is less likely to occur, and thus it is possible to form the thin film more times than in the conventional example. Become. In addition, since film peeling does not easily occur, the frequency of film removal by etching is reduced. Further, since microcracks are easily generated in the adhered film, etching is effectively performed by entering the etching solution into the microcracks, and as a result, the etching time is shortened. Therefore, by using the thin-film forming electronic component holder of the present invention, it is possible to reduce the number of times of etching and also shorten the time required for one etching, thereby effectively reducing adverse effects on the health of the worker. It becomes possible.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view showing a state in which a film is attached to a surface of an electronic component holder for a thin film forming method according to an embodiment.

FIG. 2 is a perspective view for explaining the structure of an electronic component holder for a thin film forming method.

FIG. 3 is a partially cutaway sectional view showing a state in which a thin film is formed by inserting an electronic component body into an electronic component holder for a thin film forming method.

FIG. 4 is a partially cutaway cross-sectional view showing a state in which thin films are laminated on the surface of an electronic component holder in a conventional example.

FIG. 5 is a view showing an example of Ni on the surface of the electronic component holder in the example.
FIG. 3 is a partially cutaway cross-sectional view for explaining a state in which a laminated film including a system alloy film and an Ag film is formed a plurality of times.

[Explanation of Codes] 1 ... Electronic component holder for thin film formation 1a ... Surface 7a ... Ni-based alloy film 8a ... Ag film A ... Micro crack

Claims (1)

[Claims] 1. A center line average roughness Ra value of 0.5 μ at least on a surface to which a film formed by a dry thin film forming method adheres.
An electronic component holder for a dry thin film forming method, which has a surface roughness of m or more.