JPH05196848A - Clamp device - Google Patents

Abstract

PURPOSE:To improve the wire strength and yield by bringing a wire connection part into contact with a mount surface (fixation surface and workbench surface). CONSTITUTION:This clamp device has the fixation surface 52 where a lead frame L/F is fixed, a fixation member 55 which fixes the lead frame L/F on the fixation surface 52, a positioning groove 51 for positioning an optical operating component E/O on the fixation surface 52, a holding member 53 which holds the optical operating component E/O positioned by the positioning groove 51, and a rotary mechanism 54 which presses the lead pin end part 103 of the optical operating component E/O against the fixation surface 52 by rotating the positioning groove 51 and holding member 53 in one body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a clamp device that clamps an optical actuation component (a light emitting component, a light receiving component, etc.) and a lead frame forming an optical module.

[0002]

2. Description of the Related Art There has been proposed a manufacturing technique of an optical module in which a lead frame in which light-actuated components such as a light-emitting component and a light-receiving component are connected by wires is mounted on a mold and integrally molded using a resin material. FIG. 6 is a perspective view showing a work in which the light actuated component is connected to the lead frame. Lead frame L
As shown in the figure, / F is configured to include a frame portion, an island portion, and lead pin portions (including inner lead pin portions), and electronic circuits such as a light emitting circuit and a light receiving circuit are formed by electronic circuit components mounted on the island portion. The circuit C is configured. The light emitting component E / O, the light receiving component O / E, and the inner lead pin portion are connected to the electronic circuit via a wire W.

The optical module generally has a wiring process for connecting the electronic circuit C to the light emitting component E / O, the light receiving component O / E, and the inner lead pin portion with an Al wire W, and a work to which the wire is connected is made of gold. Mold mounting process to mount on the mold,
It is manufactured through a molding process of injecting a resin material into a mold and integrally molding a work with the resin material.

The clamping device used for wiring is composed of a block body 101 and a mask member 102, as shown in FIG. The block body 101 is formed with a V groove 101a for positioning the light emitting component E / O and the light receiving component O / E, and also has a lead frame L /
A fixing surface 101b for fixing the lead pins of F, the light emitting component E / O, and the light receiving component O / E on the same plane is formed. The V groove 1 of the block body 101 is provided on the mask member 102.
The V groove 102a which is formed at a position corresponding to 01a and holds the light emitting component E / O and the light receiving component O / E, and the wire connection portion (inner lead pin portion of the lead frame, island portion, and lead pin end portion of the optical actuating component) are exposed. Opening 10
2b is formed. The lead frame L / F is sandwiched and fixed by the block body 101 and the mask member 102.

The inner lead pin portion of the lead frame L / F fixed on the same fixing surface 101b and the light emitting component E /
The wire W is connected to the end of the lead pin 103 of O or the light receiving component O / E by a wire bonder using ultrasonic waves (FIG. 8A). The wire bonder destroys the oxide film layer on the bonding surface using ultrasonic vibration energy, and connects the wire W to the lead frame L / F and the lead pin end portion 103.

[0006]

However, in the conventional clamping device, the relative position between the positioning groove and the plane is fixed, so that the optical alignment at the time of assembling the light emitting component E / O or the light receiving component O / E is adjusted. As a result, when the ends of the lead pins 103 were misaligned and welded (FIGS. 8B and 8C), the lead pins 103 could not be clamped in a normal state and wiring was impossible.

For example, when the end portion of the lead pin 103 is displaced upward ((b) in the figure), the lead pin 103 and the fixing surface 1
Since a gap is formed between the wire W and the wire 01b, the wire W cannot be hit with the wire bonder. If the end of the lead pin 103 is displaced downward ((c) in the figure), the mask member 10
In some cases, when the light emitting component E / O or the light receiving component O / E was pressed in 2, the lead pin 103 was bent, and the fixing portion of the lead pin 103 was damaged or the wire W could not be connected.

In addition, the work connected by the wire W (see FIG. 6).
However, there is a drawback in that the wire W is stressed when it is taken out from the clamp device, and the wire W is damaged.

Further, when the wire bonder comes into contact with the wire connecting portion of the lead frame L / F, the mask member 102 cannot fix the vicinity of the wire connecting portion so that the wire bonder does not come into contact with the mask. Therefore, the fixed state of the inner lead pin portion is weakened during wiring, ultrasonic waves generated from the wire bonder are not effectively transmitted to the bonding surface of the wire, and the yield of wire connection is reduced. Therefore, an object of the present invention is to improve the wire strength and the yield by bringing the wire connecting portion into close contact with the mounting surface (fixing surface, processing table surface).

[0010]

In order to achieve the above object, the first invention is a fixing surface for fixing a lead frame,
A fixing member for fixing the lead frame to the fixing surface, a positioning groove for positioning the light actuating component with respect to the fixing surface, a holding member for holding the light actuating component positioned by the positioning groove, and a positioning groove and a holding member The rotating mechanism presses the lead pin end portion of the light actuating component against the fixed surface by rotating the optical operating component.

The second invention has a pallet member, a fixing member and a holding member. Here, the pallet member is formed with a fixing surface for fixing the lead frame, a positioning groove for positioning the light actuated component with respect to the fixing surface, and an inner lead pin portion, an island portion, and an optical portion formed at a position higher than the fixing surface. A working table is provided on which the lead pin ends of the operating parts are arranged, the fixing member fixes the lead frame to the fixing surface, and the holding member holds the light operating part positioned by the positioning groove.

[0012]

According to the first aspect of the invention, the lead pin end of the light actuated component is pressed against the fixed surface by the rotating mechanism, so that the lead pin end of the light actuated component is in close contact with the fixed surface.

Further, according to the second invention, since the wire connecting portions (the inner lead pin portion of the lead frame, the island portion, and the lead pin end portion of the light actuating component) are arranged on the working table one step higher than the fixing portion, these The connection portion of is closely attached to the processed surface, and in particular, the inner lead pin portion of the lead frame can be fixed at a portion closer to the bonding position.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. In the description, the same elements will be denoted by the same reference symbols, without redundant description.

FIG. 1 is a perspective view showing a clamp device according to the first embodiment, and FIG. 2 is a perspective view showing an example of the configuration of an optical module manufacturing apparatus using this clamp device as a carrying pallet.

This clamp device includes a positioning groove 51, a fixing surface 52, a holding member 53, a rotating mechanism 54, and a fixing member 55.
Is configured.

The positioning groove 51 is composed of, for example, a V groove,
The pin portions of the light emitting component E / O and the light receiving component O / E are respectively positioned. The fixed surface 52 is the lead frame L.
The holding member 53 has an L-shaped cross section, and the tip of the holding member 53 has a light emitting component E.
/ O, semicircular groove 53a with which the pin portion of the light receiving component O / E is engaged
Are formed. The holding member 53 presses the light emitting component E / O and the light receiving component O / E against the positioning groove 51,
Secure with screws 57. The rotating mechanism 54 includes a fixed shaft 54a attached to the central portion of the positioning groove 51, a compression coil spring 54b that abuts a lower portion of the positioning groove 51 and urges the positioning groove 51 downward, and the positioning groove 5.
It is configured to include a movable shaft 54c that is attached to one end of the No. 1 and connects the holding member 53. Since the compression coil spring 54b is biased from below against the fixed shaft 54a on the side opposite to the positioning groove 51, the positioning groove 51 and the holding member 53 integrally rotate clockwise. As a result, the lead pin ends of the light emitting component E / O and the light receiving component O / E held by the positioning groove 51 and the holding member 53 are fixed to the fixing surface 5.
Pressed on 2.

Here, the light emitting component E / O and the light receiving component O / E
Since the fixed surface 52 and the positioning groove 51 are formed so that the lead pin 103 is slightly higher than the fixed surface, the tip of the lead pin 103 always contacts the fixed surface.

The fixing member 55 presses the frame portion of the lead frame L / F onto the fixing surface 52, and fixes the lead frame L / F with the screw 56. Since an opening is formed in the fixing member 55 and the bonding position of the lead frame L / F is exposed, there is no problem in wiring by the wire bonder.

Next, an example of an optical module manufacturing apparatus for transporting a pallet incorporating the above-mentioned clamp device will be described.

This manufacturing apparatus includes a setting unit 1, a workpiece automatic clamping unit 2, a wire bonder 13, a suction unit 3, a molding machine 4, and conveying devices 6, 7, 8 for conveying between them.
9 is provided, and the pallet 5 is sent to the above-described workpiece automatic clamping unit 2 using the transfer devices 6, 7, and 8.
With the relative position of the photo-actuated component and the lead frame being maintained, wire bonding of the photo-actuated component and the lead frame and die mounting of the work connected by wire are performed.

Here, positioning pins having narrowed tips are formed in the conveying devices 6, 7 and 8 so as to project in a direction orthogonal to the mounting surface, and the pallet 5 has pin holes into which the positioning pins fit. Are formed at corresponding positions. Therefore, by fitting the positioning pins of the transfer devices 6, 7, and 8 into the pin holes of the pallet 5, the pallet 5 is transferred to the transfer devices 6, 7, and 8.
Can be positioned on top. Therefore, the light emitting component E / O, the light receiving component O / E, and the lead frame L / F
Are transported by the transporting devices 6, 7, 8, 9 while maintaining their relative positions on the pallet 5, and can be wire-bonded and mounted on a mold.

When the pallet 5 is transported to the setting section 1 by the transport device 6, the pallet 5 is fixed at a predetermined position and the components of the optical module are positioned on the pallet 5. Here, the light actuated elements such as the light receiving element and the light emitting element are already built in the light actuated parts positioned on the pallet 5 in the setting section 1, and the lead frame L / F is used.
A plurality of electronic circuit components forming an electronic circuit (reception circuit, transmission circuit) connected to the light actuated element are already mounted on the island portion constituting the. Further, in the setting unit 1, the lead frame L / F is not yet connected to the light emitting component E / O and the light receiving component O / E.

After setting the light emitting component E / O, the light receiving component O / E and the lead frame L / F, the pallet 5 is set.
Is transported to the workpiece automatic clamping unit 2 by the transport device 6. In the work automatic clamp part 2, a wire bonder 13 performs a wire connecting operation to the lead frame L / F, the light emitting component E / O, and the light receiving component O / E positioned on the pallet 5. That is, the lead frame L / F
Wire bonding between the inner lead pin portion and the island portion, and the electronic circuit formed on the island portion and the light emitting component E / O and the light receiving component O / E are performed. When the connection work in the workpiece automatic clamp unit 2 is completed, the pallet 5 is transported to the suction unit 3 by the transport devices 7 and 8. Since the carrier device 8 is located one step higher than the carrier device 7, the pallet 5 carried by the carrier device 7 is lifted to the height of the carrier device 8 by the lift 10. After that, the pallet 5 is transported to the suction unit 3 by the transport device 8, and the work of mounting the lead frame L / F, the light emitting component E / O, and the light receiving component O / E on the molding machine 4 is executed. Prior to this mounting operation, the holding member 53 is lifted, the fixing member 55 is removed, and the work (see FIG. 6) is ready for suction. After the work is mounted on the mold, the pallet 5 is transferred by the lift 11 to the recovery transport device 12 located below and is transported to the setting unit 1. In this embodiment, the clamp device having both the pallet function and the clamp function has been described, but it goes without saying that a pallet separate from the clamp device can be used. In this case, after the wiring is performed by the clamp device, the work is picked up with tweezers or the like, mounted on the pallet 5 in which the clamp device is not incorporated, and transferred to the suction unit 3 by the transfer device.

Next, a clamp device according to a second embodiment of the present invention will be described with reference to FIGS. The difference from the first embodiment is that a pallet separate from the clamp device is used. FIG. 3 is a perspective view showing an essential part of a workpiece automatic clamping unit 2 including a clamping device according to the second embodiment, and FIG. 4 is a perspective view showing an example of the structure of a pallet that can be used in the clamping device according to the second embodiment. is there.

First, the structure of the pallet will be described with reference to FIG. This pallet has a positioning groove 501 and a fixed surface 5.
02, and a processing unit 503. Fixed surface 502
Has a rectangular flat surface portion having a size in which at least the frame portion (see FIG. 6) of the lead frame L / F can be placed, and the positioning groove 501 and the processed portion 503 are formed therein. The positioning groove 501 is composed of a pair of V grooves, and a first rectangular groove 504 is provided between the positioning groove 501 and the processing portion 503.
Are formed. The processed portion 503 has a first rectangular groove 504.
In the second rectangular groove 505 that communicates with, the screw 506 is detachably fixed as an independent component. The lead frame L is formed around these rectangular grooves 504 and 505.
Positioning pins 50 to be inserted into the positioning holes of / F
7 are formed.

As described above, since only the processed portion 503 in which the wire connecting portion is arranged is formed by another component and has a structure to be assembled with a screw or the like, and the processed portion 503 is formed to project from the fixed surface 502, the mask member Is located at the wire connection position, but the processing part 5 is located closer to the wire connection part.
03, the escape of ultrasonic waves is reduced, and the yield is improved. Further, the processed portion 503 in which the wire connecting portion is arranged is easily damaged because it is pressed by the wire bonder. However, if this portion is made small and has a simple shape, the cost for parts replacement can be further reduced.

Next, the clamp device according to the second embodiment will be described. Clamp device is E / O clamper 22, O / E
Clamper 23, linear guide 24, cylinder 25, support member 26 and cylinder 27, compression coil spring 2
8 and the mask member 29, the pallet 5 is transported by the conveyor belt 21 of the transport device 6 to the workpiece automatic clamping unit 2 including the clamping device. Then, the wire W is connected while fixing the light emitting component E / O, the light receiving component O / E, and the lead frame L / F while maintaining their relative positions.

The cylinder 25 is an E / O clamper 22 and an O.
/ E The clamper 23 is moved up and down along the linear guide 24. Therefore, it is possible to control the amount of elevation of the E / O clamper 22 and the O / E clamper 23 by the operation of the cylinder 25. Further, the compression coil spring 28 is the cylinder 2
5, the light emitting component E / O and the light receiving component O are changed by changing the spring constant or the descending amount of the cylinder 25.
The clamping force for pressing the pin portion of / E is adjusted.

Further, below the pallet 500, a support member 26 having positioning pins formed to fit the pin holes of the pallet 5 which is vertically moved by the cylinder 27 is arranged, and the pallet 500 can be pressed against the mask member 29. it can. The mask member 29 is formed with an opening 29a so that the wire connection portion is exposed, and the tip portions of the E / O clamper 22 and the O / E clamper 23 are arranged above the opening 29a. Further, the tip portions of the E / O clamper 22 and the O / E clamper 23 have an L-shaped cross section, and the tip support portion and the pin support portion (processing portion) of the light emitting component E / O and the light receiving component O / E are processed. It is configured such that the pin portion can be pressed against the processing portion 503 by pressing between the portions 503).

When wiring, first the cylinder 2
7 is activated to lift the support member 26. Support member 26
Since the mask member 29 is arranged above, the lead frame L / F is pressed against the mask member 29, and the pallet 500 is positioned and fixed by the positioning pin 30 formed on the support member 26.

Next, the cylinder 25 operates to lower the E / O clamper 22 and the O / E clamper 23. As a result, the light emitting component E / O and the light receiving component O / E are fixed.

FIG. 5 is a side sectional view showing a state in which the lead frame L / F, the light emitting component E / O and the light receiving component O / E are fixed. Here, what is important is that the E / O clamper 22 presses the pin portion of the light emitting component E / O located in the first rectangular groove 504. Therefore, the light emitting component E /
A clockwise moment is applied to O toward the processed portion 503 with the point A as a fulcrum, and the lead pin end of the light emitting component E / O is pressed against the processed portion 503. As a result, the lead pin end portion of the light emitting component E / O comes into close contact with the processed portion 503.

As described above, according to the clamp device of the second embodiment, the work is not directly attached to the clamp device, but the pallet 500 on which the work is placed is attached to the clamp device. ,
Wiring can be performed at another position, and the tact time in continuous work can be significantly reduced.

Further, since it is not necessary to take out the work piece alone, the weight of the light emitting component E / O and the light receiving component O / E
The wire W is not damaged. For that reason,
Wire breakage defects are reduced. Therefore, it is possible to use an Au wire (φ100 μm or less) having a diameter smaller than or smaller than that of a conventional Al wire, and it is possible to achieve cost reduction and high reliability.

The present invention is not limited to the above embodiment,
Modifications and alterations are possible without departing from the spirit of the invention.

For example, in this embodiment, V is used as the positioning groove.
Although the groove is used, it is not limited to the V shape.

[0038]

As described above, according to the present invention, the wire strength and the yield can be improved by bringing the wire connecting portion into close contact with the mounting surface (fixing surface, processing table surface).

Further, if the clamp device is used as a pallet and is incorporated in the transfer line, the wire connection between the optically actuated component and the lead frame is automatically executed, and the wire breakage can be avoided during the transfer process.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of a clamp device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of an optical module manufacturing apparatus using the clamping device according to the first embodiment as a pallet.

FIG. 3 is a perspective view showing an outline of a clamp device according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a structural example of a pallet that can be used in the clamp device according to the second embodiment.

FIG. 5 is a side sectional view showing a state in which the lead frame and the light emitting component are fixed by the clamp device according to the second embodiment.

FIG. 6 is a perspective view showing a work in which a light actuated component is connected to a lead frame.

FIG. 7 is an exploded perspective view showing a clamp device that has been used during wiring.

8 is an explanatory diagram for explaining a problem of the clamp device shown in FIG. 7. FIG.

[Explanation of symbols]

1 ... Setting part, 2 ... Work automatic clamp part, 3 ...
Adsorption part, 4 ... Molding machine, 5 ... Pallet, 6, 7, 8, 9 ...
Transporting device, 10, 11 ... Lift, 12 ... Recovery transporting device, 13 ... Wire bonder, L / F ... Lead frame, E
/ O ... light emitting component, O / E ... light receiving component, W ... wire, C ...
Electronic circuit, A ... E / O / O / E lead pin fixing moment fulcrum, 21 ... Conveyor belt, 22 ... E / O clamper, 23 ... O / E clamper, 24 ... Linear guide, 2
5, 27 ... Cylinder, 26 ... Support member, 28 ... Compression coil spring, 29 ... Mask member, 30 ... Pallet positioning pin, 51 ... Positioning portion, 52 ... Fixing surface, 53 ...
Holding member, 54 ... Rotating mechanism, 55 ... Mask member, 56 ...
Screw, 57 ... E / O / O / E fixing screw, 101 ... Block body, 102 ... Mask member, 103 ... Lead pin, 50
0 ... Pallet, 501 ... Positioning groove, 502 ... Fixed surface,
503 ... Processed portion, 504, 505 ... Rectangular groove, 506 ... Screw, 507 ... Positioning pin.

Claims (4)

[Claims] 1. A clamping device for clamping an optical actuating component and a lead frame constituting an optical module at the time of wiring, a fixing surface for fixing the lead frame, and a fixing member for fixing the lead frame to the fixing surface. A positioning groove for positioning the light actuated component with respect to the fixed surface,
A holding member that holds the light actuated component positioned by the positioning groove, and a rotation mechanism that presses the lead pin end of the light actuated component against the fixed surface by integrally rotating the positioning groove and the holding member. And a clamping device having. 2. The rotating mechanism is equipped with a mechanism for adjusting and keeping the force for pressing the lead pin end of the light actuating component against the fixed surface constant.
The described clamping device. 3. A clamping device for clamping an optical actuating component and a lead frame constituting an optical module during wiring, a fixing surface for fixing the lead frame, and a positioning for positioning the optical actuating component with respect to the fixing surface. A pallet member provided with a groove and a position higher than the fixing surface and provided with an inner lead pin portion, an island portion of the lead frame, and a work table on which the lead pin end portion of the light actuated component is arranged, and the lead frame. A clamping device having a fixing member for fixing the optical element to the fixing surface, and a holding member for holding the light actuated component positioned by the positioning groove. 4. The holding member is equipped with a mechanism for adjusting the force of pressing the lead pin end of the light actuating component against the processing table and keeping it constant.
The described clamping device.