JPH0519241B2 - - Google Patents
Info
- Publication number
- JPH0519241B2 JPH0519241B2 JP58120463A JP12046383A JPH0519241B2 JP H0519241 B2 JPH0519241 B2 JP H0519241B2 JP 58120463 A JP58120463 A JP 58120463A JP 12046383 A JP12046383 A JP 12046383A JP H0519241 B2 JPH0519241 B2 JP H0519241B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- silver
- metal
- crosslinked polymer
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 18
- 229920006037 cross link polymer Polymers 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000011247 coating layer Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 230000005484 gravity Effects 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 239000011231 conductive filler Substances 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 7
- 239000003973 paint Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- -1 etc.) Chemical compound 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- 239000004923 Acrylic lacquer Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical group 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Description
【発明の詳細な説明】 本発明は導電性樹脂フイラーに関する。[Detailed description of the invention] The present invention relates to a conductive resin filler.
従来より塗料、接着剤その他各種の樹脂もしく
はゴムに導電性フイラーを配合してなる導電性塗
料、導電性接着剤、導電性プラスチツク、導電性
ゴムなどの分散系導電性組成物はよく知られてお
り、その導電性フイラーとしては銀、銅、ニツケ
ルなどの金属粉がよく知られている。 Dispersed conductive compositions such as conductive paints, conductive adhesives, conductive plastics, and conductive rubbers, which are made by blending conductive fillers with paints, adhesives, and other various resins or rubbers, are well known. Metal powders such as silver, copper, and nickel are well known as conductive fillers.
しかしながら、これら金属粉は導電性能はすぐ
れるが比重が大きく、マトリツクスとなる高分子
性物質との比重差が大きいために、導電性組成物
として均一な分散状態とすることが困難となる問
題があり、特に塗料や接着剤の場合には金属粉が
短時間で沈降、分離し易く、その使用に際しての
作業性に問題があるのみならず、組成物中に金属
粉が偏在して導電性が不良となるなどの不都合が
生じる。 However, although these metal powders have excellent electrical conductivity, they have a large specific gravity and a large difference in specific gravity from the polymeric material that forms the matrix, making it difficult to form a uniformly dispersed state as a conductive composition. Particularly in the case of paints and adhesives, metal powder tends to settle and separate in a short period of time, which not only causes problems in workability when using them, but also causes problems with conductivity due to uneven distribution of metal powder in the composition. Inconveniences such as defects may occur.
また、他の導電性フイラーとしてカーボンブラ
ツク、グラフアイトなども知られているが、これ
らは金属粉に比べて導電性が低く、耐湿性に劣る
という欠点がある。 Other conductive fillers such as carbon black and graphite are also known, but these have the drawbacks of having lower conductivity and poorer moisture resistance than metal powder.
更に銀コートされたガラスビーズ(特開昭56−
92956号公報)も知られているが、これも比重が
比較的大きいため(比重約2.5)に均一分散性に
問題がある。また十分なる導電性を得るためには
多量添加しなければならないが、ガラスビーズを
多量に添加することはマトリツクスである高分子
性物質が本来有する軽量性という利点を損うとい
う問題がある。 Furthermore, silver-coated glass beads
92956) is also known, but this also has a problem with uniform dispersibility because it has a relatively high specific gravity (specific gravity of about 2.5). Furthermore, in order to obtain sufficient conductivity, a large amount of glass beads must be added, but there is a problem in that adding a large amount of glass beads impairs the inherent advantage of light weight of the polymeric material that is the matrix.
このようなことから、本発明者らはかかる従来
の導電性フイラーのもつ問題を解決すべく鋭意検
討の結果、特定の粒径の特定の球状架橋重合体の
表面に導電性金属を被覆せしめてなる樹脂ビーズ
が導電性フイラーとして非常にすぐれた効果を示
すことを見出し、本発明に至つた。 For this reason, the present inventors have conducted extensive studies to solve the problems of conventional conductive fillers, and have coated the surface of a specific spherical crosslinked polymer with a specific particle size with a conductive metal. The present inventors have discovered that resin beads exhibit excellent effects as conductive fillers, leading to the present invention.
すなわち本発明は、平均粒子径が1〜50μの球
状でスチレンを主体とする架橋重合体の表面に、
平均層厚が200Å以上の導電性金属被覆層を有し
てなることを特徴とする導電性樹脂フイラーを提
供するものである。 That is, in the present invention, on the surface of a spherical crosslinked polymer mainly composed of styrene and having an average particle diameter of 1 to 50μ,
The present invention provides a conductive resin filler characterized by having a conductive metal coating layer having an average layer thickness of 200 Å or more.
本発明の導電性樹脂フイラーは、スチレンを主
体とする球状架橋重合体を基体とするものである
が、かかる球状架橋重合体は比重が約1であつ
て、金属粉やガラスビーズに比べてはるかに小さ
く、分散系導電性組成物のマトリツクスである高
分子性物質の比重に近似しているため、かかる球
状架橋重合体を基体とする本発明の導電性樹脂フ
イラーを塗料、接着剤等に配合しても分散性が良
好であり、均一な組成の導電性組成物を得ること
ができる。また、かかる球状架橋重合体は不融性
であつて、耐溶剤性、耐熱性に優れており、これ
を基体とする本発明の導電性樹脂フイラーは巾広
い温度条件下にて使用することができる。 The conductive resin filler of the present invention is based on a spherical cross-linked polymer mainly composed of styrene, but this spherical cross-linked polymer has a specific gravity of approximately 1, which is much higher than that of metal powder or glass beads. The conductive resin filler of the present invention, which is based on such a spherical crosslinked polymer, can be incorporated into paints, adhesives, etc. because its specific gravity is close to that of the polymeric substance that is the matrix of the dispersed conductive composition. It is possible to obtain a conductive composition with good dispersibility and a uniform composition. In addition, such spherical crosslinked polymers are infusible and have excellent solvent resistance and heat resistance, and the conductive resin filler of the present invention using this as a base material can be used under a wide range of temperature conditions. can.
かかる球状架橋重合体において、その平均粒子
径は重要な要素であつて、平均粒子径が1μより
小さいと粒子が凝集し易くなつたり、金属を被覆
するに際して表面積が大きくなり、導電性とする
ための金属の使用量が増大して経済的に不利にな
る他、粒子の比重が小さいという利点を損うこと
から好ましくない。 In such spherical cross-linked polymers, the average particle size is an important factor; if the average particle size is smaller than 1μ, the particles tend to aggregate, and the surface area increases when coating metal, making it conductive. This is not preferable because it increases the amount of metal used, which is economically disadvantageous, and also impairs the advantage that the specific gravity of the particles is small.
また、平均粒子径が50μを越えると、得られる
導電性組成物の表面平滑性が損われたり、機械的
強度が低下するといつた問題を生じ易くなり、特
に塗料や接着剤の場合には塗布時の作業性の低下
や密着性が低下して塗面の剥離、脱落を生じ易く
なるなどの点で好ましくない。 Furthermore, if the average particle size exceeds 50μ, problems such as impaired surface smoothness and reduced mechanical strength of the resulting conductive composition tend to occur, especially in the case of paints and adhesives. This is undesirable because it reduces workability and reduces adhesion, making it easier for the coated surface to peel or fall off.
このようなことから、本発明においては平均粒
子径が1〜50μ、好ましくは3〜30μ、より好ま
しくは5〜20μの球状架橋重合体が使用される。 For this reason, in the present invention, a spherical crosslinked polymer having an average particle diameter of 1 to 50 microns, preferably 3 to 30 microns, more preferably 5 to 20 microns is used.
ここで、スチレンを主体とする球状架橋重合体
とは、主要成分としてのスチレンと少量の多官能
性単量体との共重合による架橋重合体であつて、
スチレンの多くとも30重量%はこれと共重合し得
る他のエチレン性不飽和単量体たとえばアクリル
酸エステル(メチルアクリレート、エチルアクリ
レートなど)、メタクリル酸エステル(メチルメ
タクリレート、エチルメタクリレートなど)、不
飽和カルボン酸(アクリル酸、メタクリル酸な
ど)、ニトリル(アクリロニトリル、メタクリロ
ニトリルなど)ジエン(ブタジエン、イソプレン
など)などで置き換えることができる。 Here, the spherical crosslinked polymer mainly composed of styrene is a crosslinked polymer formed by copolymerizing styrene as a main component and a small amount of a polyfunctional monomer, and
At most 30% by weight of styrene may be copolymerized with other ethylenically unsaturated monomers such as acrylic esters (methyl acrylate, ethyl acrylate, etc.), methacrylic esters (methyl methacrylate, ethyl methacrylate, etc.), unsaturated It can be replaced with carboxylic acids (acrylic acid, methacrylic acid, etc.), nitriles (acrylonitrile, methacrylonitrile, etc.), dienes (butadiene, isoprene, etc.), etc.
多官能単量体はスチレンと共重合して架橋重合
体を形成するものであつて、たとえばジビニルベ
ンゼン、多価アルコールのジまたはトリ(メタ)
アクリル酸エステル(エチレングリコールジアク
リレート、エチレングリコールジメタクリレート
など)が例示されるが、特に好適なものとしてジ
ビニルベンゼンが挙げられる。多官能性単量体の
使用量は単量体混合物中の含量として0.5重量%
以上、好ましは2〜10重量%である。0.5重量%
未満では十分な架橋が得られず、耐溶剤性、耐熱
性が乏しいことから好ましくない。 Polyfunctional monomers are those that copolymerize with styrene to form crosslinked polymers, such as divinylbenzene, di- or tri(meth) of polyhydric alcohols, etc.
Examples include acrylic esters (ethylene glycol diacrylate, ethylene glycol dimethacrylate, etc.), and divinylbenzene is particularly preferred. The amount of polyfunctional monomer used is 0.5% by weight in the monomer mixture.
The above content is preferably 2 to 10% by weight. 0.5% by weight
If it is less than this, sufficient crosslinking will not be obtained and solvent resistance and heat resistance will be poor, which is not preferable.
かかる球状架橋重合体は上記単量体混合物を水
分散して懸濁重合することにより得られ、より具
体的には、たとえば上記単量体混合物およびラジ
カル重合開始剤の混合溶液を、懸濁安定剤を加え
た水に添加し、デイスパーザーあるいはホモジナ
イザー等の名称で呼ばれる剪断力の大きい攪拌機
にて油滴が所望の大きさになるまで攪拌混合し、
次に通常の攪拌条件下に加熱重合することにより
製造することができる。 Such a spherical crosslinked polymer can be obtained by dispersing the above monomer mixture in water and subjecting it to suspension polymerization. The oil is added to the water containing the oil droplet and stirred and mixed using a stirrer with a large shearing force called a disperser or homogenizer until the oil droplets reach the desired size.
Next, it can be produced by heating and polymerizing under normal stirring conditions.
尚、本発明においては、このような球状架橋重
合体を分解、劣化せしめない範囲でクロル化、ス
ルホン化、ニトロ化したものであつてもよい。 In the present invention, such spherical crosslinked polymers may be chlorinated, sulfonated, or nitrated as long as they do not decompose or deteriorate.
このようにして得られる球状架橋重合体は真球
に近い球状であり、比表面積が最小であることか
ら、金属を被覆するに際して、その使用量をより
少ないものとすることができる。 The spherical crosslinked polymer obtained in this way has a spherical shape close to a true sphere and has the smallest specific surface area, so that the amount used can be reduced when coating a metal.
係る球状架橋重合体に金属を被覆せしめる方法
については特に限定されず、たとえば化学的湿式
法すなわち無電解メツキまたは物理的乾式法とし
ての真空蒸着法などにより有効に行うことができ
る。 The method for coating such a spherical crosslinked polymer with metal is not particularly limited, and can be effectively carried out by, for example, a chemical wet method, ie, electroless plating, or a vacuum evaporation method, which is a physical dry method.
金属としては導電性のあるものであればよく、
無電解メツキ法においては金、銀、銅、ニツケル
等が、また真空蒸着法においては金、銀、銅、ア
ルミニウム等が挙げられる。 Any metal is sufficient as long as it is conductive.
Gold, silver, copper, nickel, etc. are used in the electroless plating method, and gold, silver, copper, aluminum, etc. are used in the vacuum evaporation method.
被覆方法としては、たとえば無電解メツキによ
る方法では、金属塩水溶液たとえば硝酸銀、シア
ン化銀等の銀含有水溶液にナトリウム塩やアンモ
ニア水を加えた水溶液に、必要に応じて酸処理、
活性化などの前処理を施した球状架橋重合体を充
分に分散させ、次に還元剤たとえば酒石酸塩、ホ
ルマリン、ブドウ糖などを添加、混合して重合体
粒子の表面に銀を析出付着させればよい。 As a coating method, for example, in the method using electroless plating, a metal salt aqueous solution, such as a silver-containing aqueous solution such as silver nitrate or silver cyanide, to which sodium salt or aqueous ammonia is added, is treated with an acid, if necessary.
If the spherical crosslinked polymer that has undergone pretreatment such as activation is sufficiently dispersed, then a reducing agent such as tartrate, formalin, glucose, etc. is added and mixed to precipitate and adhere silver to the surface of the polymer particles. good.
本発明における金属を被覆して球状架橋重合体
において、金属被覆層は平均層厚が200Å以上で
あることが好ましく、200Åより小さいと充分な
導電性が得られない。 In the spherical crosslinked polymer coated with metal in the present invention, the metal coating layer preferably has an average layer thickness of 200 Å or more, and if it is smaller than 200 Å, sufficient conductivity cannot be obtained.
かくして、本発明の導電性樹脂フイラーは導電
性の塗料、接着剤、プラスチツク、ゴムなどの分
散系導電性組成物における導電性フイラーとして
用いられ、マトリツクスとなる高分子性物質との
比重差が小さいために配合時の分散性に優れ、沈
降、分離といつた問題を生じることなく均一に分
散された導電性組成物を与え、優れた導電性を付
与することができる。 Thus, the conductive resin filler of the present invention can be used as a conductive filler in dispersed conductive compositions such as conductive paints, adhesives, plastics, and rubbers, and has a small difference in specific gravity from the polymeric substance that forms the matrix. Therefore, it has excellent dispersibility during blending, and can provide a conductive composition that is uniformly dispersed without causing problems such as sedimentation and separation, and can impart excellent conductivity.
次に、実施例をもつて本発明を説明する。 Next, the present invention will be explained with examples.
但し、例中部とあるのは重量部を表わす。 However, "example middle part" indicates parts by weight.
実施例 1
平均粒子径5μの架橋ポリスチレン〔ジビニル
ベンゼン:スチレン=4:96(重量比)〕粒子を濃
硫酸中、80℃にて10分浸漬し、水洗後、0.05重量
%の塩化パラジウム酸性水溶液に分散する。温室
にて0.2重量%の塩化スズ酸性水溶液を添加し、
架橋ポリスチレン粒子にパラジウムを微量付着さ
せ、活性化を行つた。Example 1 Cross-linked polystyrene [divinylbenzene:styrene = 4:96 (weight ratio)] particles with an average particle diameter of 5 μm were immersed in concentrated sulfuric acid at 80°C for 10 minutes, and after washing with water, 0.05% by weight palladium chloride acidic aqueous solution was added. dispersed into Add 0.2% by weight tin chloride acidic aqueous solution in a greenhouse,
A trace amount of palladium was attached to crosslinked polystyrene particles for activation.
活性化前処理された架橋ポリスチレン10gを硫
酸銀15.7g、28%アンモニア水溶液15mlを含む水
溶液300に分散させた。次いで7重量%ホルマ
リン水溶液100mlを添加して銀メツキを施した。
ロ過、水性をくり返し、乾燥後、平均して銀の厚
みが約900Å、比重1.8の導電性樹脂フイラーを得
た。 10 g of preactivated crosslinked polystyrene was dispersed in 300 g of an aqueous solution containing 15.7 g of silver sulfate and 15 ml of a 28% ammonia aqueous solution. Next, 100 ml of a 7% by weight formalin aqueous solution was added to perform silver plating.
After repeating filtration and aqueous coating and drying, a conductive resin filler with an average silver thickness of about 900 Å and a specific gravity of 1.8 was obtained.
得られた導電性フイラーをアクリルラツカー
(クリヤー、固形分30重量%)の固形分100部に対
し、100部配合混合して導電性塗料を得た。 100 parts of the obtained conductive filler was mixed with 100 parts of solid content of acrylic lacquer (clear, solid content: 30% by weight) to obtain a conductive paint.
フイラーの分散安定性は良く、24時間放置後わ
ずかに沈降物が認められるのみであつた。またこ
の塗料を塗布乾燥後得られた塗膜の体積固有抵抗
は1×10-2Ωcmであつた。更に塗膜の外観は平滑
なものであつた。 The dispersion stability of the filler was good, and only a slight amount of sediment was observed after standing for 24 hours. Further, the volume resistivity of the coating film obtained after coating and drying this coating material was 1×10 -2 Ωcm. Furthermore, the appearance of the coating film was smooth.
実施例 2
平均粒子径が15μの架橋ポリスチレン〔ジビニ
ルベンゼン:スチレン=4:96(重量比)〕粒子へ
の銀の真空蒸着を行つた。Example 2 Silver was vacuum-deposited onto crosslinked polystyrene [divinylbenzene:styrene=4:96 (weight ratio)] particles having an average particle diameter of 15 μm.
抵抗架熱型蒸着法により、試料を冷却しなが
ら、高真空槽内(10-4Torr)にて加熱炉に入れ
た銀を蒸気化させた。蒸着後、粒子の顕微鏡観察
を行つたところ、ほぼ均一に被覆されており、架
橋ポリスチレン100部に対し、銀が約24部蒸着さ
れ、比重は1.3であつた。また蒸着された銀の厚
みは約0.1μであつた。 Using a resistance heating vapor deposition method, the silver placed in a heating furnace was vaporized in a high vacuum chamber (10 -4 Torr) while the sample was being cooled. After the deposition, microscopic observation of the particles revealed that they were coated almost uniformly, with approximately 24 parts of silver deposited per 100 parts of crosslinked polystyrene, and a specific gravity of 1.3. The thickness of the deposited silver was about 0.1 μm.
得られた導電性フイラー110部、不飽和ポリエ
ステル樹脂100部(日本ユピカ4007A)、硬化助剤
(ユピカPR−M)0.7部およびアセチルアセトン
パーオキシド1部を混合した。 110 parts of the obtained conductive filler, 100 parts of unsaturated polyester resin (Japan U-Pica 4007A), 0.7 parts of curing aid (U-Pica PR-M), and 1 part of acetylacetone peroxide were mixed.
この混合物を室温で硬化後、100℃にて2時間
加熱した。 This mixture was cured at room temperature and then heated at 100°C for 2 hours.
硬化物の体積固有抵抗を測定したところ1×
10-3Ωcmであつた。 When the volume resistivity of the cured product was measured, it was 1×
It was 10 -3 Ωcm.
Claims (1)
体とする架橋重合体の表面に、平均層厚が200Å
以上の導電性金属被覆層を有してなることを特徴
とする導電性樹脂フイラー。1. An average layer thickness of 200 Å is applied to the surface of a spherical crosslinked polymer mainly composed of styrene with an average particle diameter of 1 to 50 μ.
A conductive resin filler comprising the above conductive metal coating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12046383A JPS6012603A (en) | 1983-07-01 | 1983-07-01 | Conductive resin filler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12046383A JPS6012603A (en) | 1983-07-01 | 1983-07-01 | Conductive resin filler |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6012603A JPS6012603A (en) | 1985-01-23 |
JPH0519241B2 true JPH0519241B2 (en) | 1993-03-16 |
Family
ID=14786785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12046383A Granted JPS6012603A (en) | 1983-07-01 | 1983-07-01 | Conductive resin filler |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6012603A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08225625A (en) * | 1994-10-28 | 1996-09-03 | Sekisui Finechem Co Ltd | Elastic microparticle, its production, and elastic conductive microparticle |
US20130277621A1 (en) * | 2010-10-29 | 2013-10-24 | Conpart As | Polymer particle |
US9093196B2 (en) | 2006-09-29 | 2015-07-28 | Nisshinbo Holdings, Inc. | Conductive particles and method of preparing the same |
US9840762B2 (en) | 2010-10-29 | 2017-12-12 | Conpart As | Process for the surface modification of a polymer particle |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH072938B2 (en) * | 1986-04-16 | 1995-01-18 | 松下電器産業株式会社 | Anisotropic conductive adhesive |
JP3561748B2 (en) * | 1994-10-14 | 2004-09-02 | 綜研化学株式会社 | Anisotropic conductive adhesive |
JP3587398B2 (en) * | 1995-05-25 | 2004-11-10 | 綜研化学株式会社 | Conductive particles and anisotropic conductive adhesive |
JP5998018B2 (en) * | 2012-11-12 | 2016-09-28 | 株式会社日本触媒 | Conductive fine particles and anisotropic conductive material using the same |
JP5998032B2 (en) * | 2012-12-06 | 2016-09-28 | 株式会社日本触媒 | Conductive fine particles and anisotropic conductive material using the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48101455A (en) * | 1972-04-03 | 1973-12-20 | ||
JPS5187548A (en) * | 1975-01-30 | 1976-07-31 | Matsushita Electric Works Ltd | JUSHI SEIBUTSU |
JPS59102953A (en) * | 1982-12-03 | 1984-06-14 | Rin Kagaku Kogyo Kk | Electrically conductive synthetic resin composition |
-
1983
- 1983-07-01 JP JP12046383A patent/JPS6012603A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48101455A (en) * | 1972-04-03 | 1973-12-20 | ||
JPS5187548A (en) * | 1975-01-30 | 1976-07-31 | Matsushita Electric Works Ltd | JUSHI SEIBUTSU |
JPS59102953A (en) * | 1982-12-03 | 1984-06-14 | Rin Kagaku Kogyo Kk | Electrically conductive synthetic resin composition |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08225625A (en) * | 1994-10-28 | 1996-09-03 | Sekisui Finechem Co Ltd | Elastic microparticle, its production, and elastic conductive microparticle |
US9093196B2 (en) | 2006-09-29 | 2015-07-28 | Nisshinbo Holdings, Inc. | Conductive particles and method of preparing the same |
US20130277621A1 (en) * | 2010-10-29 | 2013-10-24 | Conpart As | Polymer particle |
US9214250B2 (en) * | 2010-10-29 | 2015-12-15 | Conpart As | Polymer particle |
US9840762B2 (en) | 2010-10-29 | 2017-12-12 | Conpart As | Process for the surface modification of a polymer particle |
Also Published As
Publication number | Publication date |
---|---|
JPS6012603A (en) | 1985-01-23 |
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