JPH05191007A - Wiring board with interlayer connecting member having plural core conductors - Google Patents

Abstract

PURPOSE:To provide the title wiring board on which the desired electric connection can be conducted between the conductor circuit forming layers on the different wiring boards provided in a vertical positional relation with each other without substantially increasing the size as a whole. CONSTITUTION:In the title wiring board with an interlayer connection body 1 having a plurality of core conductors 1, the interlayer connection body 1, which is provided on the right part of the wiring board, is used to obtain the desired electric connection between the formed layers of the conductor circuits 21 and 81 on the different wiring boards provided in such a manner that they have the vertical positional relations with each other. The interlayer connection body 1 has a columnar shape, and the prescribed outer circumferential conductor 13 is provided on its outer circumferential part. Also, a plurality of core conductors 12 are arranged in such a manner that they are electrically insulated with each other in their internal axial direction, and a plurality of independent conductor circuits, on one layer of the prescribed conductor circuit forming layer, are constituted in such a manner that they can be connected to the plurality of core conductors 12 arranged on the outer circumferential conductor of the interlayer connection body 1 or in the interlayer connection body 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board with an interlayer connector having a plurality of core conductors, and more particularly, to a conductor circuit forming layer on different wiring boards provided in a vertical positional relationship with each other. The present invention relates to a wiring board that enables desired electrical connection without significantly increasing the overall size.

[0002]

2. Description of the Related Art Conventionally, in order to make desired electrical connection between conductor circuit forming layers on different wiring boards provided in a vertical positional relationship with each other, a wiring having conductor pins to be external connection terminals is provided. Boards are used.

[0003]

However, in the conventional wiring board having the conductor pins as described above, for example, a plurality of independent wirings (for example, a plurality of independent wirings provided on one layer of a predetermined conductor circuit forming layer) are provided. In order to electrically connect (2) conductor circuits with the corresponding conductor circuits provided on the conductor circuit forming layer of a wiring board different from this, the number corresponding to the number of conductor circuits It is necessary to prepare the conductor pins of the above, and for this reason, in order to form the required interlayer connection body on the conductor circuit forming layer as described above, it is necessary to make the area correspondingly large. Met.
Further, in the wiring board having through-hole plating for connecting the conductor pins as described above, as one of the improvement measures for reducing the area required for forming a required interlayer connector, concentric circles with different diameters are used. Of forming through holes on the conductor circuit forming layer are disclosed. However, although such a technique is effective for a conductor circuit on a plurality of conductor circuit forming layers, a plurality of independent conductor circuits on one layer of the conductor circuit forming layer are formed on each plated through hole. It is impossible to connect to the same plane. Moreover, the development of conductor pins that can be reliably and easily connected to such multiple through holes has been delayed.

According to the present invention, when connecting a plurality of independent conductor circuits on one layer of the conductor circuit forming layer to a plurality of independent conductor circuits on the conductor circuit forming layer of another wiring board, the conductor circuit forming layer is formed on the conductor circuit forming layer. Therefore, it is an object of the present invention to solve the problem in the above-mentioned conventional technique, which requires a large area for forming the interlayer connector.

[0005]

A wiring board with an interlayer connector having a plurality of core conductors according to the present invention has been made in order to achieve the above-mentioned object, and is provided at an appropriate position of the wiring board. The interlayer connector is for making desired electrical connection between conductor circuit forming layers on different wiring boards provided in a vertical positional relationship with each other, and the interlayer connector has a columnar outer shape. The outer peripheral portion is provided with a predetermined outer peripheral conductor, and a plurality of core conductors are arranged so as to be electrically insulated from each other in the axial direction inside thereof, and are arranged on one layer of a predetermined predetermined conductor circuit forming layer. It is characterized in that a plurality of independent conductor circuits can be connected to the outer peripheral conductor of the interlayer connector or the plurality of core conductors arranged in the interlayer connector.

[0006]

In the wiring board with an interlayer connector having a plurality of core conductors according to the present invention, the interlayer connectors provided at appropriate places on the wiring board are provided on different wiring boards having a vertical positional relationship with each other. For making a desired electrical connection between the conductor circuit forming layers, wherein the interlayer connector has a columnar outer shape and a predetermined outer peripheral conductor on the outer peripheral portion thereof, and a plurality of core conductors. Are arranged so as to be electrically insulated from each other in the axial direction inside thereof, and a plurality of independent conductor circuits on one layer of a predetermined conductor circuit formation layer are connected to the outer peripheral conductor of the interlayer connector or the interlayer connection. It is characterized in that it is connectable to the plurality of core conductors arranged in the body, and has a columnar outer shape and a predetermined outer peripheral conductor in the outer peripheral portion thereof,
An integrally formed interlayer connector in which a plurality of core conductors are electrically insulated from each other in the axial direction of the columnar outer shape is used as an interlayer connector of a plurality of conductor circuit forming layers formed in different wiring boards. Therefore, it is possible to guide a plurality of conductor circuits between layers with an area equal to or slightly larger than the area occupied by one conventional interlayer connection body on the conductor circuit formation layer. Also,
Since the inter-layer connection body has the above configuration, it is possible to connect, on the same plane, the plurality of independent conductor circuits on one layer of the conductor circuit forming layer to the plurality of core conductors arranged in the integrated inter-layer connection body. it can.

[0007]

EXAMPLES The present invention will be specifically described with reference to some examples.

(Embodiment 1) This embodiment 1 is a case in which the present invention is applied to an external connection terminal portion of an electronic component mounting package, and will be described below with reference to FIGS. 1 to 5.
The first embodiment will be described. First, FIG. 1 shows an interlayer connector (1) used in the first embodiment, which has, for example, a cylindrical outer shape with a diameter of 2 mm and a height of 3 mm, and has a required material. The outer circumference is surrounded by the outer circumference conductor (13) made of the above material. The outer peripheral conductor (13) provides a kind of shielding effect to the interlayer connector (1) and also enables conduction between conductor circuits in different layers. Also, for example, a plurality of required materials such as copper, kovar or phosphor bronze (here, 4
Core) (12) are electrically insulated from each other in the axial direction of the columnar outer shape of the interlayer connector (1) and are made of a suitable material such as fluorine resin, epoxy resin or polyimide resin. It is integrally formed by filling it with an insulator (11). Although not shown in FIG. 1, the insulator (11) is divided into a structure for individually covering each core conductor (12) and another structure for integrating the core conductors individually covered. It has a separate structure, and each structure uses resins made of different materials. This interlayer connector (1) has a core conductor upper end (12
1) is exposed, and the lower end of the core conductor (122) is exposed at its lower end. Here, particularly regarding the lower end portion (122) of the core conductor, the purpose of facilitating the connection via the connection conductor as will be performed later and ensuring the electrical insulation between the core conductors adjacent to each other. Therefore, the insulator (11) is left between the core conductor lower end portions (122) exposed as described above. As a method of partially removing the insulator (11) by leaving only the lower end portion (122) of the core conductor in this way, it is exposed after the peripheral conductor (13) is partially removed by etching. A suitable laser chosen depending on the material of the insulator (11) may be used. Also, for the partial removal of the peripheral conductor (13), an appropriate laser selected according to the material of this conductor may be used. 2 and 3 show required manufacturing steps in the first embodiment. That is, on the substrate (4) (in this example, a metal substrate having a high heat dissipation property is used) in which the interlayer connector (1) is adhered or pressure-bonded to a predetermined through hole, and the interlayer connector (1) is placed on the same plane in the through hole. Of a package for mounting electronic parts, in which a wiring board (2) having one end of a conductor circuit (21) (only two of which are shown in FIGS. 2 and 3) protruding is adhered via an adhesive layer (3). The manufacturing process is shown. Further, by using an appropriate connecting conductor (5) such as solder paste, the above four conductor circuits (21) and the corresponding four core conductor upper end parts (12) are connected.
It is electrically connected to 1). As described above, the outer peripheral conductor (13) provides a kind of shielding effect to the interlayer connector (1) and also enables conduction between conductor circuits in different layers.
FIG. 4 shows a process in which required electronic components (6) are mounted on the wiring board (2) and sealed with an appropriate sealing resin (7). At this time, simultaneously with the sealing of the electronic component (6), the connecting portion between the core conductor upper end portion (121) and the conductor circuit (21) is also sealed with the sealing resin (7). Here, as the sealing resin (7) for sealing the electronic component (6), it is preferable to select a material having a high heat transfer effect on the metal substrate (4). In the package shown in FIG. 5, a package on which required electronic components are mounted is provided with four electrically independent conductor circuits (81) on one plane of the mother board (8) (two conductor circuits in FIG. 5 are used). Is present) is connected and mounted using an appropriate connection conductor (5) such as solder paste.

(Second Embodiment) FIGS. 6 and 7 show a second embodiment according to the present invention. Differences between the second embodiment and the first embodiment are as follows. That is, the wiring board (2) shown in FIG.
(Two are shown in FIG. 6 and four are shown in FIG. 7) are formed on the same plane on the substrate, and the conductor circuit (21)
The shape of the connecting portion with the core conductor upper end portion (121) is ring-shaped, the shape of the tip portion of the outer peripheral conductor connecting conductor circuit (213) is also ring-shaped, and in the vicinity of the connecting portion,
There is a difference in that a gas vent hole (22) capable of releasing gas generated at the time of connection is formed on the base material. The gas vent hole (22) can also be used as an injection hole for the sealing resin. By making such changes, the degree of freedom in positioning the four conductor circuits is improved, the connection with the upper end portion (121) of the core conductor is facilitated, and the solder paste used for this connection, etc. It is also possible to prevent the connection conductor (5) part of the above from flowing out between the adjacent conductor circuits (21). In addition, the provision of the outer peripheral conductor (13) brings about a unique effect.

(Third Embodiment) FIG. 8 shows a third embodiment according to the present invention. Differences between the third embodiment and the second embodiment are as follows. That is, in the wiring board (2), plated through-holes (9) are formed at the tips of four conductor circuits (21) (two are shown in FIG. 8), and Connection conductors (5) such as solder paste in the plated through holes (9)
Is the difference between the third embodiment and the second embodiment. By making such changes, it becomes easier to confirm the electrical connection between the four conductor circuits and the core conductor upper end portion (121), and the reliability is improved. Furthermore, a unique effect is provided by providing the outer peripheral conductor (13).

Fourth Embodiment FIGS. 9 and 10 show a fourth embodiment according to the present invention. Differences between the fourth embodiment and the first embodiment are as follows. That is, in the fourth embodiment, the inner layer conductor circuit (4
A wiring board provided with 1) is used, which is adapted to be connected to the peripheral conductor (13). Also, for the purpose of facilitating the connection via the connecting conductor as will be performed later also on the upper end portion (121) of the core conductor, and ensuring the electrical insulation between the core conductors adjacent to each other. In addition, the insulator (11) is left between the exposed upper end portion (121) of the core conductor, which is the difference from the first embodiment. In this way, the core guide upper and lower ends (121)
In order to partially remove the insulating material (11) while leaving only the remaining material, as in the case of the first embodiment, a suitable material selected according to the material of this insulating material (11) is used. A laser can be used. By making such a change, four conductor circuits (21) (two of which are shown in FIG. 9) having one end protruding on the same plane in the through hole of the wiring board (2) and the above four The electrical connection work with the upper end portion (121) of the core conductor of the book is facilitated, the connection state is easily confirmed, and the reliability thereof is significantly improved.
In addition, the provision of the outer peripheral conductor (13) brings about a unique effect.

[0012]

As described in detail above, in the wiring board with an interlayer connector having a plurality of core conductors according to the present invention, the interlayer connectors provided at appropriate positions of the wiring board are located above and below each other. It is for making desired electrical connection between conductor circuit forming layers on different wiring boards provided in a relationship, and the interlayer connecting body has a columnar outer shape and a predetermined outer peripheral conductor on its outer peripheral portion. In addition, a plurality of core conductors are arranged so as to be electrically insulated from each other in the axial direction inside thereof, and a plurality of independent conductor circuits on one layer of a certain predetermined conductor circuit forming layer are provided. The structure is characterized in that it is connectable to the outer peripheral conductor of the interlayer connector or the plurality of core conductors arranged in the interlayer connector, and one conventional interlayer connector is a conductor. On the circuit forming layer A plurality of conductor circuits can be guided between the layers in an area equal to or slightly larger than the area to be filled, and a plurality of independent conductor circuits on one layer of the conductor circuit forming layer are arranged in the integrated interlayer connection body. Since the plurality of core conductors can be connected on the same plane, the independent conductor circuits on one layer of the conductor circuit forming layer can be reliably connected to the independent conductor circuits on the conductor circuit forming layer of another wiring board. It is possible to easily connect, and it is possible to achieve an extremely great effect of making an integrated module composed of a plurality of wiring boards compact.

[Brief description of drawings]

FIG. 1 is a perspective view of an interlayer connector according to a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view of an essential part showing the manufacturing process according to the first embodiment.

FIG. 3 is an enlarged sectional view of an essential part showing the manufacturing process according to the first embodiment.

FIG. 4 is an enlarged sectional view of an essential part showing the manufacturing process according to the first embodiment.

FIG. 5 is an enlarged sectional view of an essential part showing the manufacturing process according to the first embodiment.

FIG. 6 is an enlarged sectional view of an essential part showing a main part of a second embodiment of the present invention.

FIG. 7 is an enlarged plan view of an essential part when the AA cross section of FIG. 6 is viewed from the arrow direction.

FIG. 8 is an enlarged sectional view of an essential part showing a main part of a third embodiment of the present invention.

FIG. 9 is an enlarged sectional view of an essential part showing a main part of a fourth embodiment of the present invention.

FIG. 10 is an enlarged plan view of an essential part when the BB cross section of FIG. 9 is viewed from the arrow direction.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Interlayer connector 11 Insulator 12 Core conductor 121 Core conductor upper end 122 Core conductor lower end 13 Outer conductor 2 Wiring board 21 Conductor circuit 213 Outer conductor connecting conductor circuit 22 Gas vent hole 3 Adhesive layer 4 Substrate 41 Inner layer conductor circuit 4A Through hole 5 Connection conductor 6 Electronic component 7 Sealing resin 8 Motherboard 81 Conductor circuit 9 Through hole

Claims (1)

[Claims] 1. An inter-layer connection body provided at an appropriate position of a wiring board is an inter-layer connection for making desired electrical connection between conductor circuit forming layers on different wiring boards provided in a vertical positional relationship with each other. In a wiring board with an interlayer connector in which a body is provided in an appropriate place, the interlayer connector has a columnar outer shape and a predetermined outer peripheral conductor on an outer peripheral portion thereof, and a plurality of core conductors are provided inside the inner peripheral connector. A plurality of independent conductor circuits that are electrically insulated from each other in the axial direction of the predetermined conductor circuit forming layer, and that are independent of the predetermined conductor circuit forming layer. An interlayer connection having a plurality of core conductors, wherein the plurality of corresponding conductor circuits above are connected to the outer peripheral conductor of the interlayer connector or the plurality of core conductors arranged in the interlayer connector. With body Wiring board.