JPH05189630A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH05189630A JPH05189630A JP4001422A JP142292A JPH05189630A JP H05189630 A JPH05189630 A JP H05189630A JP 4001422 A JP4001422 A JP 4001422A JP 142292 A JP142292 A JP 142292A JP H05189630 A JPH05189630 A JP H05189630A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hole
- card
- gnd
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、ICカードにおける
静電気対策に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to countermeasures against static electricity in IC cards.
【0002】[0002]
【従来の技術】図3〜図5は従来のICカードを示すも
ので、1は基体A、2は基体B、3は回路基板であり、
この回路基板を基体1、2と金属パネル4、5ではさ
み、接着剤等で接合して組立てられている。2. Description of the Related Art FIGS. 3 to 5 show a conventional IC card, in which 1 is a base A, 2 is a base B, 3 is a circuit board,
This circuit board is assembled by scissors between the bases 1 and 2 and the metal panels 4 and 5 with an adhesive or the like.
【0003】即ち、ICカードの主要部である回路基板
3を保護パッケージするために基体1と2ではさみ、接
着剤、接着テープ等を用いて接合される。基体1、2に
は外部電波ノイズの遮断及び、静電気の帯電を防ぐため
に、上下両面から金属パネル4、5が接着されている。
またこの金属パネル4、5は、基体1に設けられた穴10
a、10bに挿入されたバネ8により同電位となるよう接続
されており、又、回路基板3のGND部12と金属パネル
4は、穴11に挿入されたバネ9により接続されている。That is, in order to protect and protect the circuit board 3 which is the main part of the IC card, the substrates 1 and 2 are joined by using scissors, an adhesive, an adhesive tape or the like. Metal panels 4 and 5 are adhered to the bases 1 and 2 from both upper and lower surfaces in order to block external radio wave noise and prevent electrostatic charging.
In addition, the metal panels 4 and 5 have holes 10 formed in the base body 1.
The springs 8 inserted in a and 10b are connected so as to have the same electric potential, and the GND portion 12 of the circuit board 3 and the metal panel 4 are connected by the spring 9 inserted in the hole 11.
【0004】[0004]
【発明が解決しようとする課題】従来装置は以上のよう
に構成されているので、金属パネル4、5及び金属パネ
ル4と回路基板3のGND12を接続させるのに2個のバ
ネ8、9が必要であり、また組立時を考慮すると、部品
の多さ、組立て時間を多く要するなどの問題点があっ
た。Since the conventional device is constructed as described above, two springs 8 and 9 are used to connect the metal panels 4 and 5 and the GND 12 of the circuit board 3 to each other. However, there are problems such as a large number of parts and a long assembling time in consideration of the time of assembling.
【0005】この発明は上記のような問題点を解消する
ためになされたもので、従来装置と同様に外部電波ノイ
ズの遮断及び静電気の帯電を防ぐため、両金属パネル間
及び回路基板GND間を接続することを損うことなく、
しかも部品点数を減らし、かつ組立を容易にして組立時
間をも減少できるICカードを提供することを目的とす
る。The present invention has been made in order to solve the above-mentioned problems, and in order to block external radio wave noise and prevent static electricity from being charged, as in the conventional device, a gap between both metal panels and a gap between the circuit boards GND are provided. Without losing connection
Moreover, it is an object of the present invention to provide an IC card in which the number of parts can be reduced and the assembling can be facilitated to reduce the assembling time.
【0006】[0006]
【課題を解決するための手段】この発明に係るICカー
ドは、回路基板GND部にスルーホールを設け、このス
ルーホールを介して相互の金属パネル及び回路基板GN
Dが接触接続するような構造にしたものである。An IC card according to the present invention is provided with a through hole in a circuit board GND portion, and a metal panel and a circuit board GN are mutually connected through the through hole.
The structure is such that D is contact-connected.
【0007】[0007]
【作用】この発明におけるICカードは、回路基板GN
D部にスルーホールを設け、このスルーホールを介する
ことにより、相互金属パネル及び回路基板GND部を1
つの導通材により導通させるので、部品点数を少なく、
組立工程を少なくすることができる。The IC card according to the present invention is the circuit board GN.
A through hole is provided in the D section, and the mutual metal panel and the circuit board GND section are formed by the through hole.
Since it is conducted by two conducting materials, the number of parts is reduced,
The assembly process can be reduced.
【0008】[0008]
実施例1.以下、この発明の一実施例を図について説明
する。図1において、3、4、5、12は上記従来例のも
のと同一部材を示しており、13は回路基板3に設けられ
たGND部12のスルーホールであり、14はこのスルーホ
ールを貫通し上下でパネル4、5と接触するバネでなる
導通部材である。Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numerals 3, 4, 5, and 12 denote the same members as those in the conventional example, 13 denotes a through hole of the GND portion 12 provided on the circuit board 3, and 14 denotes a through hole. It is a conductive member composed of springs that come into contact with the panels 4 and 5 vertically.
【0009】以上のように構成された装置において、回
路基板3のGND部12に設けたスルーホール13を介して
取付けられた導通用バネ14により、相互の金属パネル
4、5及び回路基板GND部12が電気的に接触接続す
る。In the apparatus constructed as described above, the metal springs 4 and 5 and the circuit board GND portion are mutually connected by the conduction spring 14 attached through the through hole 13 provided in the GND portion 12 of the circuit board 3. 12 makes electrical contact.
【0010】実施例2.なお、上記実施例では、導通部
材にバネを設けたものを示したが、導通部材はバネでな
くても図2に示したような形状の導通部材でもよい。ま
た、上記実施例では、ICカードの場合について説明し
たが、他の電子機器であってもよい。Embodiment 2. In the above embodiment, the conducting member is provided with a spring, but the conducting member may not be a spring but may be a conducting member having a shape as shown in FIG. Further, in the above embodiment, the case of the IC card has been described, but other electronic devices may be used.
【0011】[0011]
【発明の効果】以上のように、この発明によれば、回路
基板GND部に相互の金属パネル及び回路基板GND部
を電気的に接触させるための導通部材を通すスルーホー
ルを設ける構成としたので、相互の金属パネル及び回路
基板GND部を容易に導通させるとともに、部品点数を
減らし、組立工程を容易にする効果がある。As described above, according to the present invention, the circuit board GND portion is provided with the through hole through which the conductive member for electrically contacting the mutual metal panel and the circuit board GND portion is provided. In addition to easily conducting the mutual metal panel and the circuit board GND portion, it is possible to reduce the number of parts and facilitate the assembly process.
【図1】この発明の一実施例によるICカードの断面図
である。FIG. 1 is a sectional view of an IC card according to an embodiment of the present invention.
【図2】この発明の他の実施例を示すICカードの断面
図である。FIG. 2 is a sectional view of an IC card showing another embodiment of the present invention.
【図3】ICカード全体の斜視図である。FIG. 3 is a perspective view of the entire IC card.
【図4】従来のICカードの分解斜視図である。FIG. 4 is an exploded perspective view of a conventional IC card.
【図5】従来のICカードの断面図である。FIG. 5 is a sectional view of a conventional IC card.
3 回路基板 4、5 金属パネル 12 GND部 13 スルーホール 14 導通部材 3 Circuit board 4, 5 Metal panel 12 GND part 13 Through hole 14 Conductive member
Claims (1)
るとともに、このGND部のスルーホールを貫通する導
通部材を備え、この導通部材を介して相対置する金属パ
ネル及び回路基板GND部が同電位となるように電気的
に接触する構成としたことを特徴とするICカード。1. A circuit board GND portion is provided with a through hole, and a conductive member penetrating through the through hole of the GND portion is provided, and a metal panel and a circuit board GND portion which are placed relative to each other through the conductive member have the same potential. An IC card characterized by being configured so as to make electrical contact with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4001422A JPH05189630A (en) | 1992-01-08 | 1992-01-08 | Ic card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4001422A JPH05189630A (en) | 1992-01-08 | 1992-01-08 | Ic card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05189630A true JPH05189630A (en) | 1993-07-30 |
Family
ID=11501029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4001422A Pending JPH05189630A (en) | 1992-01-08 | 1992-01-08 | Ic card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05189630A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9504138B2 (en) | 2013-11-12 | 2016-11-22 | Samsung Electronics Co., Ltd. | Semiconductor device |
-
1992
- 1992-01-08 JP JP4001422A patent/JPH05189630A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9504138B2 (en) | 2013-11-12 | 2016-11-22 | Samsung Electronics Co., Ltd. | Semiconductor device |
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