JPH05185152A - Device and method for punching electronic part with guard body - Google Patents

Abstract

PURPOSE:To precisely punch the lead of electronic part having the guard body for guarding the lead. CONSTITUTION:A lower die 26 is moved between a receiving position (a) of an electronic part 100, a punching position (b) and a delivering position (c) to a transferring head 1. An upper die 45 which punches a lead 102 is provided freely movable against the lower die 26 at the upper side of the punching position (b). When the upper die 45 is lowered, a pilot pin 47 made by one body with the upper die 47 is advanced into a pin hole 28 of the lower die 28, at this time, the positioning of the punch 55 of the upper die 45 with the die 27 of the lower die 26 is executed by moving the upper die 45 and the lead 102 is precisely cut with the punch 55 and the die 27. Next, the lower die 26 is moved to the delivering position c, the transferring head 1 picks up the electronic part 100 on the lower die 26, transports and mounts to the base plate 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punching device and punching method for electronic parts with a guard body, and more particularly to cutting a guard body of an electronic part and a transfer head for the electronic part with the guard body cut off. TECHNICAL FIELD The present invention relates to a punching device and a punching method for an electronic component with a guard body, which is capable of delivering and receiving the work with good workability.

[0002]

2. Description of the Related Art Electronic components mounted on a substrate include, for example, QFP and TAB chips in which leads extend outward from a body such as a molded body or a semiconductor chip. In recent years, the number of leads has increased along with the increasing integration of electronic components. For this reason, the leads tend to have a narrower pitch, and inevitably the leads are becoming extremely thin and their strength is reduced.When a tool hits the lead, the lead is easily bent and deformed to become a defective product. There was a problem that it would end up.

As a conventional means for solving such a problem, as shown in FIG. 8, a frame type guard body 103 is formed at the tip of a lead 102 extending from a main body 101 such as a mold body or a semiconductor chip. The lead 102
There has been proposed an electronic component 100 with a guard body that protects the.

[0004]

Forming the guard body 103 has an advantage in that the lead 102 can be prevented from being bent and deformed due to an object hitting the lead 102 during storage or transportation of an electronic component. When mounting electronic parts on a board, the upper and lower molds are used to punch leads to form a guard body 1.
03 must be removed. If the leads are deformed when the leads are punched by the upper die and the lower die, the electronic components cannot be mounted on the substrate. Therefore, the lead must be punched out precisely. Further, since the electronic parts must be mounted on the substrate at a high speed, the leads must be punched out at a high speed.

Therefore, it is an object of the present invention to provide a punching device and a punching method for an electronic component with a guard body, which can punch leads with high precision and good workability.

[0006]

To this end, the present invention provides a lower die, a receiving position for receiving the electronic component from the lower die, a punching position for punching leads, and a receiving head for receiving the electronic component. There are provided a moving means for reciprocating between the delivery / delivery positions, an upper die provided above the punching position for raising and lowering, and an elevating means for raising and lowering the upper die. The upper die is arranged so that it can swing relative to the lower die, and a pilot pin is provided integrally with the upper die, and the pilot pin is provided on the lower die as the upper die descends. The punch provided in the upper die and the die provided in the lower die are aligned by inserting them into the pin holes provided, and then the leads are punched.

[0007]

According to the above construction, when the electronic component is delivered to the lower die at the receiving position, the lower die moves to the punching position. Then, when the upper die is lowered, the pilot pin of the upper die is inserted into the pin hole of the lower die, and the lead is punched and the guard body is cut off by the punch of the upper die and the die of the lower die. At this time, even if the punch and die are misaligned,
When the pilot pin is inserted into the pin hole, the upper die oscillates to align the punch and the die, so that the lead can be punched with high precision to cut off the guard body. Moreover, since this punching is performed during the delivery of the electronic component to the transfer head, the work from the punching of the lead to the delivery of the electronic component to the transfer head can be performed as a series of work with good workability.

[0008]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus.
This electronic component mounting apparatus includes an XY table 3 for moving the transfer head 1 in the X direction and the Y direction, and an electronic component supply device 10 for supplying the transfer head 1 with an electronic component 100 with a guard body.
Made of. The XY table 3 moves the transfer head 1 to the X position.
X table 3A to be moved in the direction and transfer head 1 to Y
The Y table 3B to be moved in the direction is made orthogonal to each other. The transfer head 1 is held at the tip of the Y table 3B, and when the XY table 3 is driven, X
Move in Y direction. The transfer head 1 is an electronic component 100.
Has a nozzle 2 for vacuum adsorbing.

The substrate 4 is conveyed on the mounting line by the conveyor 5. The direction in which the substrate 5 is conveyed by the conveyor 5 is the X direction, and the direction orthogonal to this is the Y direction. An electronic component supply device 10 that supplies the electronic component 100 to the transfer head 1 is provided on the side of the conveyor 5. The electronic component supply apparatus 10 includes a base portion 11, a chute 12 as an electronic component supply portion mounted on the base portion 11, and a punching device 20.
Made of. The chute 12 is a tubular body having a square cross section, and the electronic component 100 is housed therein.
The chute 12 is supported by the support columns 17 and is tilted forward to support the base 1.
1, the electronic component 100 is installed on the chute 12
It slides down inside and is discharged onto a stage 13 provided at the lower end of this chute 12. A camera 14, a laser device 15, and a dump box 16 are provided on the base 11.

The transfer head 1 vacuum-sucks and picks up the electronic component 100, in which the lead 102 is punched by the punching device 20 and the guard body 103 is cut off, to the nozzle 2 and picks up the electronic component 100 above the camera 14. To transfer. Therefore, the camera 14 observes the lead 102 of the electronic component 100, which is vacuum-sucked by the nozzle 2 of the transfer head 1, from below,
The position is detected. A computer (not shown) calculates the positional deviation of the lead 102 based on the positional data detected by the camera 14. Next, the transfer head 1 transfers the electronic component 100 to above the laser device 15. Therefore, the height of the lead 102 is measured by irradiating the lead 102 with laser light from the light emitting portion 15a of the laser device 15 and receiving the reflected light in the light receiving portion 15b. Based on this measured height, the lead 10 is calculated by the computer.
It is determined whether 2 is bent upward.

Next, the transfer head 1 moves above the substrate 4 and mounts the electronic component 100 at a predetermined coordinate position on the substrate 4. In this case, of the positional deviations in the XYθ directions detected by the camera 14, the positional deviations in the θ direction (rotational direction) are
The nozzle 2 is corrected by rotating the nozzle 2 about its axis by a motor (not shown) provided in the transfer head 1. The positional deviation in the X direction is corrected by adjusting the movement stroke of the transfer head 1 in the X direction by driving the X table 3A. The positional deviation in the Y direction is corrected by adjusting the movement stroke of the transfer head 1 in the Y direction by driving the Y table B. Also laser device 1
When the bending amount of the lead 102 measured by 5 is equal to or more than a preset allowable value, the transfer head 1 moves above the dumping box 16 and the vacuum suction state of the electronic component 100 by the nozzle 2 is released there. By doing so, the electronic component 100 is discarded as a defective product in the disposal box 16.

Next, the punching device 20 will be described with reference to FIGS. A ball screw 22 is horizontally arranged in the Y direction on the frame 21. A motor 23 for rotating the ball screw 22 is mounted behind the frame 21. A nut 24 is screwed onto the ball screw 22, and a table 25 is attached to the upper surface of the nut 24. A lower mold 26 is installed on the upper surface of the table 25. A die 27 for punching the leads 102 of the electronic component 100 is provided on the upper surface of the lower mold 26. Further, four pin holes 28 are formed around the die 27. Further, a first collection box 29 is attached to the side surface of the table 25 by a stopper 30. As will be described later, the guard body 103 cut out from the electronic component 100 is temporarily stored in the box 29.

As shown in FIG. 4, a slider 31 is mounted on the lower surface of the side portion of the table 25. This slider 3
Reference numeral 1 is slidably fitted to a guide rail 19 parallel to the ball screw 22. Therefore, in FIG. 3, when the motor 23 is driven and the ball screw 22 rotates, the nut 2
The lower die 26 connected to the electronic component 4 is mounted on the stage 13 along the ball screw 22 and the guide rail 19.
It moves between a receiving position a for receiving 0, a punching position b for punching the lead 102, and a delivery position c for delivering the electronic component 100 to the transfer head 1. The box 29 is also the lower mold 2
6 along with the ball screw 22.

In FIGS. 2 and 5, the left and right plates 32 are provided on the bottom of the box 29. A protrusion 33 is provided on the upper surface of the plate 32. A protrusion 34 is provided on the side surface of the box 29. The protrusion 33 and the protrusion 34 are pivotally attached by a pin 35, and the plate 32 is rotatable about the pin 35. Further, pins 36 are provided on the bottom surfaces of the left and right plates 32 so as to project. The left pin 36 and the right pin 36 are coil springs 3.
Combined at 7. As shown by the solid line in FIG. 5, the plate 32 is normally in the horizontal state by the spring force of the coil spring 37, and the lower surface of the box 29 is closed.

In FIG. 2, an opening 40 is opened at the side end of the frame 21. A second collection box 41 is provided below the opening 40. Cylinders 38 are installed on both sides of the opening 40. The cylinder 38 is located above the recovery box 41. The motor 23 is driven to move the lower mold 26 to the receiving position a.
When moved to, the box 29 moves integrally with the lower mold 26 and stops right above the second box 41. Therefore, FIG.
When the rod 39 of the cylinder 38 protrudes upward in the direction of, the flange 32a at the side end portion of the plate 32 becomes
9, the plate 32 is rotated downward about the pin 35 to be opened, and the guard body 10 on the plate 32 is opened.
3 falls into the second box 41 and is collected.

In FIGS. 2 and 3, a case 42 is provided on the frame 21. A cylinder 43 is provided on the upper surface of the case 42. An upper mold 45 is provided inside the case 42. A metal fitting 46 for coupling is provided on the upper surface of the upper mold 45. The rod 44 of the cylinder 43 enters the inside of the case 42,
The enlarged portion 44a provided at the lower end of the is fitted to the metal fitting 46. The enlarged portion 44a is loosely fitted to the metal fitting 46, so that the upper die 45 can be slightly swung about the enlarged portion 44a. The pin hole 28 is provided at the corner of the upper die 45.
Four pilot pins 47 that are inserted in the The lower end portion 47a of the pilot pin 47 has a pin hole 28
It is tapered so that it can be easily inserted.

Further, four guide rods 48 are vertically provided at the corners of the ceiling surface of the case 42. This guide rod 4
8 is inserted into a bearing 49 provided on the side of the upper mold 45. In the partially enlarged view of FIG. 3, a steel ball 51 is provided inside the bearing 49. This bearing 49 is an upper mold 4
It is held by a mounting body 50 provided on the side portion of No. 5. A fairly large clearance C1 of about 300 μm is ensured between the bearing 49 and the mounting body 50, so that the upper mold 45 can be slightly swung by this clearance C1.

In FIG. 3, a punch 55 is provided at the center of the inside of the upper die 45. A suction hole 52 is formed around the punch 55. The suction hole 52 is connected to the first pneumatic device 54A via a tube 53. An air blower 61 is provided between the punching position b and the delivery position c. The hole 62 formed inside the air blower 61 is connected to the second pneumatic device 5 through the tube 63.
4B, and the air pumped from the pneumatic device 54B is blown out from the hole 62 (see also FIG. 7).
The tubes 53 and 63 are provided with valves 56 and 64 for switching the air pressure. This valve 56, 64
Is controlled by a computer.

In FIGS. 2 and 3, a bracket 71 is attached to the rear surface of the case 42. A head 72 is provided on the front surface of the bracket 71. A stopper 74 provided on the upper portion of the head 72 is pivotally attached to the bracket 71 via a pin 75. Head 72
Has a nozzle 73 for vacuum-sucking the electronic component 100. An actuator 76 is provided on the back surface of the bracket 71. When the actuator 76 operates, the head 72 swings around the pin 75 in the arrow direction. In FIG. 3, when the head 72 rotates clockwise, the nozzle 7
3 has a posture perpendicular to the electronic component 100 on the stage 13 (see the solid line in FIG. 3), and when the nozzle 73 projects from the head 72 and the vacuum suction device (not shown) operates,
The nozzle 73 vacuum-sucks and picks up the electronic component 100 on the stage 13. When the head 72 rotates counterclockwise, the nozzle 73 takes a posture perpendicular to the die 27 on the lower die 25 (see the chain line in FIG. 3), and when the nozzle 73 projects from the head 72 and the vacuum suction state is released. The electronic component 100 is mounted on the die 27.

This apparatus has the above-mentioned structure, and the operation of the whole apparatus will be described below. In FIG. 3, the shoot 12
The electronic component 100 discharged from the stage stops on the stage 13. Then, the actuator 76 drives to drive the head 72.
Rotates clockwise, and the nozzle 73 is connected to the electronic component 100.
Is vacuum-adsorbed and picked up. Next, the head 72 rotates counterclockwise and assumes a vertical posture. At this time, the lower die 26 is on standby at the receiving position a, and the vacuum suction state is released, so that the electronic component 100 is mounted on the die 27.

Next, when the motor 23 rotates forward, the ball screw 22 rotates and the lower die 26 moves to the punching position b. Then, when the rod 44 of the cylinder 43 projects, the upper die 45 descends, the pilot pin 47 enters the pin hole 28, and when the upper die 45 further descends, the lead 102 moves above the punch 55 of the upper die 45 and the lower die 26. It is punched by the die 27. FIG. 6 is an enlarged view at the time of punching, showing the blade edge 55 of the punch 55.
edge E1 of a and edge E2 of cutting edge 27a of die 27
Thus, the lead 102 is punched and formed into an L shape.

By the way, since the leads 102 have an extremely narrow pitch and the thickness of the leads 102 is extremely thin,
The punch 55 and the die 27 are required to have a very strict clearance C2 (see FIG. 6A) of, for example, 2 μm or less. However, the precision of the stop position of the lower die 26 due to the driving of the ball screw 22 is low, and it is generally unavoidable that a stop position error of about 20 to 30 μm occurs.

When the stop position error of the lower die 26 occurs in this way, the pilot pin 47 cannot be completely fitted into the pin hole 28, so that seizure may occur between the pilot pin 47 and the pin hole 28, or in the worst case. Tip is chipped. Therefore, in this means, as described above, the rod 4 of the cylinder 43 is
4 is loosely fitted to the metal fitting 46 on the upper surface of the upper mold 45, and the bearing 49 is provided with a clearance C1 of about 300 μm so that the upper mold 45 is slightly swingable. Even if an error occurs in the stop position of the upper die 45, the pilot pin 47 is easily inserted into the pin hole 28, and the upper die 45 is swung along with the insertion, so that the upper die 45
The lead 55 can be punched out precisely by precisely aligning the punch 55 and the die 27 of the lower mold 26.

When the lead 102 is punched out as described above, the rod 44 of the cylinder 43 is pulled in, and the upper die 45 is drawn.
Rises. At this time, the punched guard body 103 is adsorbed to the lower surface of the upper die 45 by the adsorption holes 52 and rises together with the upper die 45. Next, when the motor 23 rotates in the normal direction, the lower die 26 moves from the punching position b to the delivery position c. At this time, when the box 29 comes directly under the upper die 45, the vacuum of the guard body 103 is reduced. The suction state is released and the guard body 103 falls into the box 29.

Next, when the lower die 26 reaches the delivery position c, the electronic component 100 on the die 27 is vacuum-sucked by the nozzle 2 of the transfer head 1 and picked up. Next, the XY table 3 is driven to move the transfer head 1 above the camera 14, and the camera 14 detects the positional deviation of the lead 102 in the XYθ directions. Next, the transfer head 1 is connected to the laser device 15
The bending of the lead 102 is measured by moving the laser light from the light emitting portion 15a to the lead 102 and receiving the reflected light from the light receiving portion 15b. And
If the lead 102 is extremely bent, the defective box will be discarded.
6 is discarded, and only the good electronic component 100 is mounted on the substrate 4 at the predetermined coordinate position.

Next, when the motor 23 rotates in the reverse direction,
The lower die 26 moves from the delivery position c to the reception position a to receive the next electronic component 100. When the lower die 26 comes under the air blower 61 in the middle of the process, air is blown out from the hole 62 as shown in FIG. 7, and the lead 102 attached to the upper surface of the lower die 26 or the upper surface of the die 27 is removed. Blow away chips and clean. In this case, the lower mold 26 and the air blower 61 may be completely stopped immediately below, and air may be blown for cleaning in that state, or the lower mold 26 may be moved toward the receiving position a while the air is blown. You may spray and clean. The lower die 26 may be blown with air from the air blower 61 to clean it while the lower die 26 is moving from the punching position b to the delivery position c. However, since the electronic component 100 is placed on the die 27 at this time, The electronic component 100 may be blown away by the blown air. Therefore, it is desirable to clean the lower mold 26 and the die 27 after the electronic component 100 is delivered to the transfer head 1, that is, after the electronic component 100 is no longer present on the die 27. The pneumatic device 54
By sucking air by B, the air may be sucked from the hole 62 to clean the upper surface of the die 27.

Next, when the motor 23 rotates in the reverse direction, the lower die 26 moves to the receiving position a. Then, the first box 29 stops right above the second box 41.
Then, when the rod 39 of the cylinder 38 projects, the plate 32 rotates downward as shown in FIG. 5, and the guard body 103 in the first box 29 falls into the second box 41 and is collected. At the same time, the electronic component 100 on the stage 13 is transferred and mounted on the die 27 by the head 72, and the above-described operation is repeated.

[0029]

As described above, according to the present invention, when the pilot pin is inserted into the pin hole even if the punch and the die are misaligned due to the error of the stop position of the lower die at the punching position. In addition, the upper die swings relative to the lower die, so that the two are precisely aligned with each other, so that the lead can be punched out precisely. Moreover, since this punching is performed from the time the lower die receives the electronic component at the receiving position to the time it moves to the delivery position, the work from the punching of the electronic component to the delivery of the electronic component to the transfer head is It can be performed with good workability as a series of operations.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a punching device according to an embodiment of the present invention.

FIG. 3 is a side view of a punching device according to an embodiment of the present invention.

FIG. 4 is a sectional view of a punching device according to an embodiment of the present invention.

FIG. 5 is a sectional view of a recovery device according to an embodiment of the present invention.

FIG. 6 is a sectional view of an essential part of a punching device according to an embodiment of the present invention.

FIG. 7 is a sectional view of an air blower according to an embodiment of the present invention.

FIG. 8 is a perspective view of an electronic component with a guard body according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer head 2 Nozzle 12 Electronic component supply part (shoot) 22 Moving means (ball screw) 23 Moving means (motor) 24 Moving means (nut) 26 Lower die 27 Die 28 Pin hole 29 First collecting means (box) 32 Opening / Closing Body (Plate) 38 Opening Means (Cylinder) 39, 44 Rod 41 Second Collecting Means (Box) 43 Elevating Means (Cylinder) 45 Upper Die 47 Pilot Pin 47a Tapered Lower End 52 Vacuum Adsorption Means (Suction Hole) 54 Pneumatic device 55 Punch 61 Air blowing means (air blower) 62 Hole portion 100 Electronic component 101 Main body 102 Lead 103 Guard body a Receiving position b Punching position c Delivery position

Claims (6)

[Claims] 1. A punching device for punching a lead of an electronic component with a guard body, wherein a guard body for protecting the lead is formed at a tip portion of the lead extending outwardly from a main body, the lower die comprising: A receiving position for receiving the electronic part of the lower die, a punching position for punching the lead, a moving means for reciprocating between the transferring position for delivering the electronic part to a transfer head, and an upper part of the punching position. An upper die for raising and lowering the upper die, and an elevating means for raising and lowering the upper die. The upper die is arranged so as to be relatively swingable with respect to the lower die, and is integrated with the upper die. By installing a pilot pin in the, and by inserting this pilot pin into the pin hole provided in the lower mold as the upper mold descends,
The punch provided in the upper die and the die provided in the lower die are aligned with each other, and the lead is punched by the punch and the die. apparatus. 2. An electronic component with a guard body according to claim 1, wherein the upper die is provided with a suction hole for vacuum-sucking the guard body, and an air pressure device connected to the suction hole is provided. Punching device. 3. A punching device for electronic parts with a guard body according to claim 2, wherein at the punching position, a collecting means for collecting the vacuum-guarded guard body is provided on the lower surface of the upper die. .. 4. A punching device for punching a lead of an electronic component with a guard body, wherein a guard body for protecting the lead is formed at a tip portion of the lead extending outward from the main body, the lower die comprising: A receiving position for receiving the electronic part of the lower die, a punching position for punching the lead, a moving means for reciprocating between the transferring position for delivering the electronic part to a transfer head, and an upper part of the punching position. An upper die for raising and lowering the upper die and an elevating means for raising and lowering the upper die. The upper die is provided between the punching position and the delivery position by blowing air onto the upper die. A punching device for an electronic component with a guard body, which is provided with an air blowing means for cleaning the above. 5. A step of receiving an electronic component with a guard body supplied from an electronic component supply unit on a die provided on an upper surface of a lower mold at a receiving position, and driving the moving means to receive the lower mold at the receiving position. To the punching position, and lowering the upper die at this punching position, punching the lead with the punch of the upper die and the die of the lower die to cut off the guard body, and punching the lower die. The process of moving from the removal position to the delivery position and vacuum picking up the electronic component with the guard removed by the nozzle of the transfer head and picking up the air blown from the air blowing means to the lower die. A die-cutting method for an electronic component with a guard body, which comprises the step of cleaning the die. 6. The electronic component placed on the upper surface of the lower die at the delivery position is vacuum-sucked by a nozzle of a transfer head to be picked up, and then the lower die is moved from the delivery position to the receiving position. 2. The punching method for an electronic component with a guard body according to claim 1, wherein the air blown out from the air blowing means is blown onto the lower die for cleaning.