JPH0518113U - Micro strip antenna - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To simplify the structure of the line from the feeding point to the connection point and reduce the number of assembly steps. A conductor film 14 is formed in the through hole of the dielectric substrate 10, which is connected to the radiation electrode 11 and is also connected to the conductor film 13 around the through hole on the back surface, and the conductor film 13 on the back surface is connected to the wiring board 17. The wiring pattern 18 is directly connected. The ground electrode 12 and the ground pattern can be connected at the same time. The wiring pattern 18 may be drawn out to the back surface of the wiring board 17 and connected to the circuit element.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a microstrip antenna used in a navigation system or the like, and relates to a structure for drawing out a line from a radiation electrode.

[0002]

[Prior Art]

 In a GPS navigation system or the like, a small antenna that receives signals from satellites is required, and the use of a microstrip antenna is being considered as one of them.

In this microstrip antenna, a radiation electrode having a size of ½ of the wave length of a received electric wave is provided on the surface of a dielectric substrate, and a ground electrode is formed on the entire back surface. There are two types of feed electrodes, square and circular, and by devising the shape of the feed electrodes, the reception frequency can be broadened.

FIG. 2 is a front cross-sectional view showing an example of the structure of such a conventional microstrip antenna, showing a mounting structure on a printed circuit board. A radiation electrode 21 is formed on the front surface of the dielectric substrate 20, and a ground electrode 22 is formed on the back surface. The conductor 23 is drawn out from the 50 ohm point of the radiation electrode 21 to the back surface through the through hole formed in the dielectric substrate 20. This conductor is connected to the wiring pattern of the printed board 27 via the connector 26. On the printed board 27, a circuit element 28 for forming an amplifier, a filter, etc. is mounted.

[0005]

[Problems to be solved by the device]

 In the microstrip antenna, the conductor is connected to the 50 ohm point as described above, but when forming a line from this point to the connection point on the printed circuit board, the connector is required as described above, and the radiation electrode is also used. It is necessary to solder the conductor. Therefore, the size of the device is increased and the number of assembly steps is increased.

The present invention provides a line structure from the radiation electrode to the connection point, which has a simple structure and is easy to assemble.

[0007]

[Means for Solving the Problems]

 The present invention solves the above problems by forming a conductor film in a through hole of a dielectric substrate, drawing it out to the back surface, and directly connecting it to the wiring pattern of the wiring substrate.

That is, the front surface of the dielectric substrate is provided with a radiation electrode having a size of ½ of the wavelength and the back surface is provided with a ground electrode, and is led to the back surface from a feeding point of the radiation electrode through a through hole formed in the dielectric substrate. The microstrip antenna has a conductor film in its through-hole, which is electrically connected to the radiation electrode and to the conductor film formed around the through-hole on the back surface of the dielectric substrate. It is characterized in that it is mounted and the conductor film formed around the through hole on the back surface of the dielectric substrate and the wiring pattern on the wiring substrate are connected.

[0009]

[Action]

 The radiation electrode and the wiring pattern are connected at the shortest distance by the conductor film formed in the through hole, and the radiation electrode and the wiring pattern can be connected only by mounting the antenna body on the wiring board.

[0010]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front sectional view showing an embodiment of the present invention. The dielectric substrate 10 is Teflon (registered trademark) (ε = 2.3) or another dielectric material. If a material with a dielectric constant (ε) of about 20 is used, it will be about 18 mm square when used in the 1.575 GHz band. Can be downsized. If Teflon is used, 55mm square will be required. A radiation electrode 11 having a size of λ / 2 is formed on the front surface, and a ground electrode 12 is formed on the entire surface on the back surface. A line from the feeding point of 50 ohms to the wiring pattern of the printed board 17 is formed, and the conductor film 14 in the through hole is used for this line.

Inside the through hole, on the back surface of the dielectric substrate, there is formed a conductor film 14 which is conducted around the through hole and a conductor film 14 which is conducted, and the conductor film 14 is also conducted with the radiation electrode 11. ing. The conductor film 13 may be formed around the through hole so as to be concentric with the through hole. Of course, it must be formed so as to be insulated from the ground electrode 12.

The back surface of the dielectric substrate 10 is mounted on the front surface of the printed circuit board 17, and the conductor film 13 and the wiring pattern 18 formed on the surface of the printed circuit board 17 are connected to each other, and the ground electrode 12 and the ground wiring are connected. Connect with the pattern. Connections can be made using solder or other conductive adhesive. It is preferable that the wiring pattern 18 on the front surface of the printed board is drawn out to the wiring pattern on the back surface by the conductor film in the through hole 19 formed on the printed board. Although not shown, circuit components constituting an amplifier and a filter are mounted and fixed on the back surface of the printed circuit board 17, and a predetermined circuit is constituted by the wiring pattern.

[0014]

[Effect of the device]

 According to the present invention, it is possible to connect from the feeding point to the connecting point with a simple structured line, and the number of assembling steps can be significantly reduced.

Further, since it is not necessary to use a connector or the like and the antenna can be mounted on the printed circuit board or the like as it is, it is also advantageous in terms of downsizing of the device.

[Submission date] February 14, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

In this microstrip antenna, a radiation electrode having a size of ½ of the wave length of a received electric wave is provided on the surface of a dielectric substrate, and a ground electrode is formed on the entire back surface. There are square and circular radiating electrodes, and by devising the shape of the radiating electrode, the receiving frequency can be broadened.

[Brief description of drawings]

FIG. 1 is a front sectional view of an embodiment of the present invention.

FIG. 2 is a front sectional view of a conventional example.

[Explanation of symbols]

 10 Dielectric substrate 11 Radiation electrode 12 Ground electrode 13 Conductor film 14 Conductor film

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuyoshi Takano 828 Hinohara, Tamagawa, Hama-gun, Hiki-gun, Saitama Prefecture Toko Co., Ltd. Tamagawa factory

Claims (3)

[Scope of utility model registration request] 1. A dielectric substrate is provided with a radiation electrode having a size of half the wavelength on the front surface and a ground electrode on the back surface, and is led out to the back surface from a feeding point of the radiation electrode through a through hole formed in the dielectric substrate. In the microstrip antenna, a conductor film is provided in the through hole, which is electrically connected to the radiation electrode, and is electrically connected to the conductor film formed around the through hole on the back surface of the dielectric substrate. The dielectric substrate is mounted on the wiring board. A microstrip antenna characterized in that the conductor film formed around the through hole on the back surface of the dielectric substrate is connected to the wiring pattern on the wiring substrate. 2. A micro-electrode provided with a radiation electrode having a size of ½ of the wavelength on the front surface of a dielectric substrate and a ground electrode on the back surface, and led out from the radiation electrode feeding point to the back surface through a through hole formed in the dielectric substrate. In the strip antenna, a conductor film is provided in the through hole, the conductor film being electrically connected to the radiation electrode and the conductor film formed around the through hole on the back surface of the dielectric substrate, and the dielectric substrate is mounted on the wiring substrate. In addition, the conductor film formed around the through hole on the back surface of the dielectric substrate and the ground electrode on the back surface of the dielectric substrate are connected to separate wiring patterns on the wiring board, respectively. antenna. 3. A wiring pattern of a wiring board, wherein a through hole is formed in a wiring board at a position opposed to the through hole of the dielectric board, and the conductive film formed around the through hole on the back surface of the dielectric board is electrically connected to the conductor film. 3. The microstrip antenna according to claim 1, wherein the microstrip antenna is drawn out to the opposite surface of the wiring board through a conductor film formed in the through hole.