JPH0518114U - Micro strip antenna - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] The antenna body and wiring board are integrated to enable downsizing and thinning, and to reduce the number of assembly steps. [Structure] An insulator layer 17 is formed on the back surface of the dielectric substrate 10 on the side of the ground electrode 12 via a conductor layer, and a wiring pattern is formed on the surface thereof. A predetermined circuit is formed by mounting the circuit element on the insulating layer 17. The insulating layer 17 is
It can be formed by a method of adhering sheets or a method such as thick film printing. The radiation electrode 11 and the wiring pattern are also connected at the shortest distance.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a microstrip antenna used in a navigation system or the like, and relates to a structure for drawing out a line from a radiation electrode.

[0002]

[Prior Art]

 In a GPS navigation system or the like, a small antenna that receives signals from satellites is required, and the use of a microstrip antenna is being considered as one of them.

In this microstrip antenna, a radiation electrode having a size of ½ of the wave length of a received electric wave is provided on the surface of a dielectric substrate, and a ground electrode is formed on the entire back surface. There are two types of feed electrodes, square and circular, and by devising their shape, the reception frequency can be broadened.

FIG. 2 is a front cross-sectional view showing an example of the structure of such a microstrip antenna, and shows a mounting structure on a printed circuit board. A radiation electrode 21 is formed on the front surface of the dielectric substrate 20, and a ground electrode 22 is formed on the back surface. From the 50 ohm point of the radiation electrode 21, the conductor 23 is drawn out to the back surface through the through hole formed in the dielectric substrate 20. This conductor is connected to the wiring pattern of the printed board 27 via the connector 26. A circuit element 28 for forming an amplifier, a filter, etc. is mounted on the printed board 27.

[0005]

[Problems to be solved by the device]

 In the conventional microstrip antenna, the conductor is connected to the 50 ohm point as described above, but when forming a line from this point to the connection point of the printed circuit board, the connector is required as described above, and the device is As the size increases, so does the number of assembly steps.

The present invention provides a microstrip antenna structure that can be miniaturized and is easy to assemble.

[0007]

[Means for Solving the Problems]

 The present invention solves the above-mentioned problems by forming an insulating layer on the ground electrode side of a dielectric substrate and using it as a wiring substrate.

That is, the front surface of the dielectric substrate is provided with a radiation electrode having a size of ½ of the wavelength, and the back surface is provided with a ground electrode, and the radiation electrode is led to the back surface through a through hole formed in the dielectric substrate from a feeding point. In the microstrip antenna, the insulating layer is formed on the surface of the ground electrode on the back surface of the dielectric substrate, the wiring pattern is formed on the insulating layer, and the radiation electrode and the wiring pattern on the insulating layer are formed on the dielectric substrate. It is characterized in that it is connected by a conductor arranged in the through hole.

[0009]

[Action]

 By using the back surface of the dielectric substrate also as the circuit board, the thickness can be minimized and the radiation electrode and the wiring pattern can be connected at the shortest distance.

[0010]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front sectional view showing an embodiment of the present invention. The dielectric substrate 10 is Teflon (ε = 2.3) or another dielectric material. If a material having a dielectric constant (ε) of about 20 is used, the size can be reduced to about 18 mm square when used in the 1.575 GHz band. If Teflon is used, 55mm square is required. A power supply electrode 11 is formed on the surface with a size of about λ / 2, and a ground electrode 12 is formed on the entire surface on the back surface. A through hole is formed at the feeding point of 50 ohms to form a line up to the wiring pattern of the wiring board.In the present invention, the insulating layer 17 serving as the wiring board is provided on the surface of the dielectric substrate 10 on the side of the ground electrode 12 side. To form directly on.

A wiring pattern is formed of a conductive film on the surface of the insulating layer 17, and the chip component 18 is mounted on the wiring pattern. Usually, circuit components that constitute an amplifier and a filter are mounted. The radiation electrode 11 and the wiring pattern are connected by a conductor 13. Both ends of the conductor 13 can be connected to the radiation electrode 11 and the wiring pattern by soldering using pins made of a metal material. Instead of the conductor 13, a screw or the like can be used.

As the insulating layer 17, it is desirable to use an insulating material having a low dielectric constant. It may be adhered onto the ground electrode 12 of the dielectric substrate 10 or may be formed by thick film printing. In that case, it is possible to form a wiring pattern inside the insulating layer.

There are various methods for forming the insulating layer, and a method such as bonding a substrate having a conductor layer may be used. That is, it is possible to substitute the ground electrode with a conductor film formed on the insulating layer. The ground electrode is drawn to the surface by a through hole or the like in the insulating layer 17 so as to be connected to the ground pattern.

[0015]

[Effect of the device]

 According to the present invention, the antenna body and the wiring board can be integrated, and the number of assembling steps can be significantly reduced.

Further, since it is not necessary to use a connector or the like and the printed circuit board and the like are integrated with the antenna, it is also advantageous in terms of downsizing and thinning of the device. (Note) Teflon is a registered trademark in the detailed description of the device.

[Submission date] February 24, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

In this microstrip antenna, a radiation electrode having a size of ½ of the wave length of a received electric wave is provided on the surface of a dielectric substrate, and a ground electrode is formed on the entire back surface. There are square and circular radiating electrodes, and by devising the shape of the radiating electrode, the receiving frequency can be broadened.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

FIG. 1 is a front sectional view showing an embodiment of the present invention. The dielectric substrate 10 is Teflon (ε = 2.3) or another dielectric material. When a material having a dielectric constant (ε) of about 20 is used, it can be downsized to about 18 mm square when used in the 1.575 GHz band. If Teflon is used, 55mm square is required. A radiation electrode 11 is formed on the surface with a size of about λ / 2, and a ground electrode 12 is formed on the entire surface on the back surface. A through hole is formed at the feeding point of 50 ohms to form a line up to the wiring pattern of the wiring board.In the present invention, the insulating layer 17 serving as the wiring board is provided on the surface of the dielectric substrate 10 on the side of the ground electrode 12 side. To form directly on.

[Brief description of drawings]

FIG. 1 is a front sectional view of an embodiment of the present invention.

FIG. 2 is a front sectional view of a conventional example.

[Explanation of symbols]

 10 Dielectric substrate 11 Radiation electrode 12 Ground electrode 13 Conductor 17 Insulation layer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuyoshi Takano 828 Hinohara, Tamagawa, Hama-gun, Hiki-gun, Saitama Prefecture Toko Co., Ltd. Tamagawa factory

Claims (2)

[Scope of utility model registration request] 1. A dielectric substrate is provided with a radiation electrode having a size of half the wavelength on the front surface and a ground electrode on the back surface, and is led out to the back surface from a feeding point of the radiation electrode through a through hole formed in the dielectric substrate. In the microstrip antenna, an insulating layer is formed on the surface of the ground electrode on the back surface of the dielectric substrate, a wiring pattern is formed on the insulating layer, and the radiation electrode and the wiring pattern on the insulating layer penetrate the dielectric substrate. A microstrip antenna characterized by being connected by a conductor arranged in a hole. 2. A microstrip antenna comprising a radiation electrode having a size of ½ of the wavelength on the surface of a dielectric substrate and being led to the back surface from a feeding point of the radiation electrode through a through hole formed in the dielectric substrate. An insulating layer is formed on the back surface of the dielectric substrate via a conductor layer, a wiring pattern is formed on the insulating layer, and the radiation electrode and the wiring pattern on the insulating layer are arranged in through holes of the dielectric substrate. A microstrip antenna characterized by being connected by different conductors.