JPH0518112U - Micro strip antenna - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To simplify the structure of the line from the feeding point to the connection point and reduce the number of assembly steps. [Structure] A conductor film 14 connected to a power supply electrode is formed in a through hole of a dielectric substrate 10, and an elastic metal piece 13 is inserted from the back surface into the through hole. One end of the metal piece 13 is connected to the wiring pattern of the printed board 17, and a line for connection is formed by inserting the metal piece 13 into the through hole of the dielectric substrate 10 of the antenna body.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a microstrip antenna used in a navigation system or the like, and relates to a structure for drawing out a line from a radiation electrode.

[0002]

[Prior Art]

 In a GPS navigation system or the like, a small antenna that receives signals from satellites is required, and the use of a microstrip antenna is being considered as one of them.

In this microstrip antenna, a radiation electrode having a size of ½ of the wavelength to be received is provided on the surface of a dielectric substrate, and a ground electrode is formed on the entire back surface. There are two types of power supply electrodes, rectangular and circular. By devising the shape of the electrodes, the reception frequency can be broadened.

FIG. 3 is a front cross-sectional view showing an example of the structure of such a microstrip antenna, and shows a mounting structure on a printed circuit board. A radiation electrode 21 is formed on the front surface of the dielectric substrate 20, and a ground electrode 22 is formed on the back surface. From the 50 ohm point of the radiation electrode 21, the conductor 23 is drawn out to the back surface through the through hole formed in the dielectric substrate 20. This conductor is connected to the wiring pattern of the printed board 27 via the connector 26. A circuit element 28 for forming an amplifier, a filter, etc. is mounted on the printed board 27.

[0005]

[Problems to be solved by the device]

 In the microstrip antenna, the conductor is connected to the 50 ohm point as described above, but when forming a line from this point to the connection point on the printed circuit board, the connector is required as described above, and the feeding electrode is also required. It is necessary to solder the conductor. Therefore, the size of the device becomes large and the number of assembly steps increases.

The present invention provides a line structure from the feeding electrode to the connection point, which has a simple structure and is easy to assemble.

[0007]

[Means for Solving the Problems]

 The present invention solves the above problems by forming a conductor film in a through hole of a dielectric substrate and contacting it with an elastic metal piece. That is, the front surface of the dielectric substrate is equipped with a radiation electrode having a size of ½ of the wavelength and the back surface is provided with a ground electrode. In the microstrip antenna that is introduced in Fig. 1, a conductor film that is in conduction with the radiating electrode is provided in the through hole, and an elastic metal piece is inserted into the through hole from the back surface of the dielectric substrate to form the conductor film in the through hole. It is characterized in that it is brought into contact with and connected to the radiation electrode.

[0008]

[Action]

 The metal piece inserted into the through hole is fixed to the printed circuit board by soldering, etc., and the radiation electrode and the wiring pattern can be connected simply by inserting the metal piece into the through hole.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front sectional view showing an embodiment of the present invention. The dielectric substrate 10 is Teflon (registered trademark) (ε = 2.3) or another dielectric material. If a material with a dielectric constant (ε) of about 20 is used, it will be about 18 mm square when used in the 1.575 GHz band. Can be downsized. If Teflon is used, 55mm square will be required. The radiation electrode 11 is formed with a size of λ / 2 on the front surface, and the ground electrode 12 is formed on the entire surface on the back surface. A line from the feeding point of 50 ohms to the wiring pattern of the printed board 17 is formed, and the metal piece 13 and the conductor film 14 in the through hole are used for this line.

A conductor film 14 which is not exposed on the back surface of the dielectric substrate is formed in the through hole, and the conductor film 14 is electrically connected to the feeding electrode 11. The metal piece 13 has a structure in which a portion inserted into the through hole has elasticity to press the conductor film 14. One end of the metal piece 13 is connected to the conductor pattern of the printed board 17, and at the same time, soldering or the like is performed to fix it to the printed board.

The back surface of the dielectric substrate 10 may be mounted on the front surface of the printed circuit board 17 and connected to the ground electrode 12 and the ground wiring pattern. Circuit parts constituting an amplifier, a filter, etc. are mounted and fixed on the back surface of the printed circuit board 17, and a predetermined circuit is constituted by the wiring pattern.

The structure of the metal piece may be any structure as long as it elastically contacts the conductor film formed on the surface of the through hole as described above. Figure 2 shows an example of this, so (a) is equipped with two dogleg-shaped tongues, and a collar that serves as a stopper when it is inserted into the printed circuit board and the dielectric board of the antenna body. Is shown. Further, (b) is a cylindrical shape with slits (slits) formed, and its outer diameter is made slightly larger than the inner diameter of the through hole.

[0014]

[Effect of the device]

 According to the present invention, it is possible to connect from the feeding point to the connecting point with a simple structured line, and the number of assembling steps can be significantly reduced.

Further, since it is not necessary to use a connector or the like and the antenna can be mounted on the printed circuit board or the like as it is, it is also advantageous in terms of downsizing of the device.

[Submission date] February 14, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

In this microstrip antenna, a radiation electrode having a size of ½ of the wavelength to be received is provided on the surface of a dielectric substrate, and a ground electrode is formed on the entire back surface. Discharge morphism electrode squareness, there are round ones, broadband reception frequency is scaled by devising the shape.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction content]

[0005]

[Problems to be solved by the device]

In the microstrip antenna, the conductor is connected to the 50 ohm point as described above, but when forming a line from here to the connection point on the printed circuit board, the connector is required as described above, and the radiation electrode is also used. soldering is required between the conductor and. Therefore, the size of the device is increased and the number of assembly steps is increased.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction content]

The present invention provides a line structure from the radiation electrode to the connection point, which has a simple structure and is easy to assemble.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

A conductor film 14 not exposed on the back surface of the dielectric substrate is formed in the through hole, and the conductor film 14 is electrically connected to the radiation electrode 11. The metal piece 13 has a structure in which a portion inserted into the through hole has elasticity to press the conductor film 14. One end of the metal piece 13 is connected to the conductor pattern of the printed board 17, and at the same time, soldering or the like is performed to fix it to the printed board.

[Brief description of drawings]

FIG. 1 is a front sectional view of an embodiment of the present invention.

FIG. 2 is a perspective view of an example of a metal piece used in the present invention.

FIG. 3 is a front sectional view of a conventional example.

[Explanation of symbols]

 10 Dielectric substrate 11 Radiation electrode 12 Ground electrode 13 Metal piece 14 Conductor film

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuyoshi Takano 828 Hinohara, Tamagawa, Hama-gun, Hiki-gun, Saitama Prefecture Toko Co., Ltd. Tamagawa factory

Claims (4)

[Scope of utility model registration request] 1. A dielectric substrate is provided with a radiation electrode having a size of ½ of the wavelength on the front surface and a ground electrode on the back surface, and a conductor is penetrated from a radiation electrode feeding point into a through hole formed in the dielectric substrate. In the microstrip antenna that is led out to the back surface, a conductor film that is electrically connected to the radiation electrode is provided in the through hole,
A microstrip antenna, characterized in that an elastic metal piece is inserted into the through hole from the back surface of the dielectric substrate, brought into contact with the conductor film in the through hole, and connected to the radiation electrode. 2. A dielectric substrate is provided with a radiation electrode having a size of ½ of the wavelength on the front surface and a ground electrode on the back surface, and a conductor is penetrated from a feeding point of the radiation electrode into a through hole formed on the dielectric substrate. In the microstrip antenna which is led out to the back surface, a conductor film electrically connected to the radiation electrode is provided in the through hole, and an elastic metal piece inserted into the through hole from the back surface of the dielectric substrate is attached to the printed board. A microstrip antenna characterized by being brought into contact with a conductor film in a through hole and connected to a radiation electrode. 3. The microstrip antenna according to claim 1, wherein the metal piece comprises a plurality of V-shaped metal pieces having a central portion protruding outward. 4. The microstrip antenna according to claim 1, wherein the metal piece is a cylindrical metal piece having a split.