JPH0518085U - Heat dissipation device for electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] Even when a large number of pins 2 of an electronic component 1 mounted on a printed circuit board 4 are formed in a fence shape with respect to the electronic component 1, they contact the pins 2. The purpose is to effectively dissipate the heat generated from the electronic component 1 to the outside by the heat dissipation plate 3 attached to the printed circuit board 4 without performing the heat generation. A window hole 6 is formed in a portion of the printed circuit board 4 facing the mounting position of the electronic component 1, and a heat radiating plate 3 which is thermally coupled to a chassis 5 is attached to the lower surface of the printed circuit board 4 to form the window hole. A heat conductor 7 that thermally connects the electronic component 1 and the heat dissipation plate 3 is inserted in the inside of 6.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat dissipation device for electronic parts, which is suitable for application to electronic devices such as television receivers, audio equipment, and various measuring instruments.

[0002]

[Prior Art]

 A printed circuit board on which many electronic components are mounted is used for electronic equipment.Since electronic components generally generate heat during use, heat radiation is applied to those that generate particularly large amounts of heat to prevent overheating. Avoids damage caused by. For example, as shown in FIG. 2, in the case of an electronic component 1 such as an integrated circuit (IC) in which a large number of pins (electrodes) 2 are led out only on both side surfaces in the longitudinal direction, it is shown in FIGS. As described above, the heat sink 3 extending in the longitudinal direction of the electronic component 1 (particularly hatched in FIG. 3) is arranged on the electronic component mounting surface of the printed board 4, and the heat sink 3 is attached to the printed board 4. The heat generated from the electronic component 1 is conducted to the chassis 5 from the heat dissipation plate 3 to be dissipated to the outside by thermally connecting to the chassis 5 (which is made of a metal material) for fixing the . Reference numeral 8 is a printed wiring.

[0003]

[Problems to be solved by the device]

 However, if the electronic component 1 has a large number of pins 2 on both sides as shown in FIG. 2, even if the heat sink 3 is provided on the electronic component mounting surface of the printed circuit board 4, the heat sink 3 will not There is no problem because it can be placed so that it does not come into contact with the pin 2 of the component 1, but as shown in FIG. 5 as the electronic component 1, a large number of pins 2 are fence-shaped from the bottom surface (or side surface) of the electronic component 1. In the case where it projects, the heat radiating plate 3 comes into contact with any of the pins 2 in the configuration shown in FIG. 3, so this means cannot be adopted. The present invention provides a heat dissipation device for electronic parts, which can effectively dissipate heat even for electronic parts 1 having pins 2 formed in a fence shape as shown in FIG.

[0004]

In order to solve the above-mentioned problems, in the present invention, a window hole 6 is provided at a position facing the electronic component mounting portion of the printed circuit board 4 and the electronic component mounting surface of the printed circuit board 4 is provided. The heat radiation plate 3 is attached to the opposite surface, the heat radiation plate 3 is thermally coupled to the electronic component 1 through the heat conductor 7 in the window hole 6, and the heat radiation plate 3 is thermally coupled to the chassis 5.

[0005]

[Action]

 The heat generated from the electronic component 1 is conducted to the chassis 5 through the heat conductor 7 and the heat radiating plate 3 which are in contact with each other through the window hole 6 and is radiated.

[0006]

【Example】

 Next, an example of a heat dissipation device for electronic parts according to the present invention will be described with reference to FIG. The parts corresponding to those in FIGS. 3 to 5 are designated by the same reference numerals. A window hole 6 is formed in a portion of the printed circuit board 4 corresponding to the mounting position of the electronic component 1, and a heat radiating plate 3 is attached to the surface of the printed circuit board 4 opposite to the electronic component mounting surface (the lower surface in the figure). A heat conductor 7 for thermally connecting the heat dissipation plate 3 and the electronic component 1 is interposed in the hole 6.

In this case, since the printed wiring 8 is formed on the lower surface of the printed board 4, the heat sink 3 and the printed wiring 8 are arranged so as to avoid each other. Further, the heat sink 3 is manufactured at the same time when the printed wiring 8 is manufactured (when the copper plate is etched). In FIG. 1, the thickness of the heat dissipation plate 3 is exaggerated to be thicker than the printed wiring 8. Although the heat conductor 7 is formed separately from the heat dissipation plate 3 in FIG. 1, both the heat conductor 3 and the heat radiator 3 may be integrally formed in advance.

The heat dissipation plate 3 is attached together with the printed circuit board 4 to a chassis 5 made of metal (heat conductive material) for fixing the printed circuit board 4 by a mounting tool 9 such as a screw, so that the heat dissipation plate 3 and the chassis 5 are heated. Are linked together. Therefore, the heat generated from the electronic component 1 is conducted to the chassis 5 through the heat conductor 7 and the heat dissipation plate 3, and the chassis 5 generally has a large area, so that the heat is effectively dissipated to the outside. Moreover, even if the pins 2 are projected on the bottom surface of the electronic component 1 like a fence, there is no problem because the heat sink 3 does not come into contact with these pins 2.

The printed circuit board 4 in the above example may be replaced with a printed circuit board having a multilayer structure. In this case, the heat dissipation plate 3 is formed on the lowermost printed circuit board.

[0010]

[Effect of the device]

 According to the heat dissipation device for electronic parts according to the present invention, even if the pins are projected from the bottom surface (or side surface) of the electronic parts in the shape of a fence, the heat dissipation plate does not come into contact with them, so there is no problem. It has the effect of sufficiently achieving the purpose of heat dissipation.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example of a heat dissipation device according to the present invention.

FIG. 2 is a perspective view showing an example of an electronic component.

3 is a plan view showing a conventional heat dissipation device when the electronic component shown in FIG. 2 is mounted on a printed board.

4 is a cross-sectional view taken along the line AA of FIG.

FIG. 5 is a perspective view showing another example of an electronic component.

[Explanation of symbols]

 1 electronic component 2 pin 3 heat sink 4 printed circuit board 5 chassis 8 printed wiring

Claims (1)

[Scope of utility model registration request] 1. A window hole is formed in a portion facing a mounting position of an electronic component mounted on one surface of a printed circuit board, and is thermally coupled to the electronic component through the window hole on the other surface of the printed circuit board. A heat dissipation device for electronic parts, characterized in that a heat dissipation plate is provided for releasing heat generated from the electronic parts from the chassis to the outside.