JPH0517798Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a clamp device provided on a wafer stand of a disk in an ion implantation device for a semiconductor manufacturing line.

[Prior art] Conventionally, this type of wafer clamping device
As shown in FIG. 9, a loading groove for a vacuum chuck 19' for loading or unloading a wafer 5' is provided in the stand body 2' of the disk 1'.
Since the wafer 5' on this loading groove cannot come into contact with the stand main body 2', the cooling effect is poor, leading to a temperature rise reaching 150° C. or more during ion implantation.

This temperature rise causes deterioration and damage to the resist film applied to process the fine patterns of LSI, resulting in a decrease in the yield of LSI, or the inability to increase the beam current due to the temperature rise, resulting in decreased productivity. It also caused a decline. Furthermore, since the swinging mechanism is provided on the wafer loading surface side, dust generated here tends to adhere to the wafers, resulting in a decrease in yield.

In order to improve the above-mentioned drawbacks, a clamping device is also known which is equipped with a holding pin 12'' capable of holding a wafer 5'' on a stand main body 2'', as shown in FIGS. 10 and 11.

In this device, a bracket 23'' is provided with a pin 12'' that holds the wafer 5'' and a clamp arm 8'' that clamps the wafer 5'' via a rod 20''. By moving up and down perpendicular to the top surface, the wafer 5'' is supported from below when clamped or unclamped, thereby solving the above drawback.However, when the wafer 5'' is clamped or unclamped, When supporting the clamp rod from below, the clamp rod 20'' slides relative to the through hole 22'', so it may not operate smoothly, resulting in a decrease in productivity.

Moreover, dirt is generated due to uneven friction on the sliding surfaces.
This also led to a decrease in product yield.

In addition, since the entire device is designed to slide vertically relative to the disk surface, the space in the disk chamber that covers the device becomes large, making it difficult to create a vacuum inside the disk chamber or return it from a vacuum to the atmosphere. This required a long time, leading to a decrease in productivity.

[Problems that the invention aims to solve] In the semiconductor manufacturing process, variations in wafer temperature and dust significantly reduce the yield of wafers, and unsmooth movement of equipment and increased equipment size increase product costs. Therefore, all of the above conventional examples have problems.

The present invention has been made in order to avoid the above-mentioned problems in the prior art.

[Means for Solving the Problems] Therefore, in the clamp device of the present invention, a clamp arm and a lever are pivotably attached to the back side of a disk having a wafer stand, and penetrate through the disk to hold the wafer. A plurality of clamps are provided on the clamp arm, a plurality of pins are provided on the lever that penetrate the wafer stand and hold the wafer, and a spring is interposed between the clamp arm and the disk, and a spring stronger than the spring is provided. A spring with force is interposed between the clamp arm and the lever.

[Example] The structure of the present invention is shown in the attached drawings (Figures 1 to 7).
This will be explained in detail using the examples shown in .

Reference numeral 1 denotes a disk, and a plurality of stand bodies 2 are provided on the upper surface of the disk in the circumferential direction. Reference numerals 3 and 4 denote an inner protrusion and an outer stopper, which hold the wafer 5 in rotation even when the disk 1 rotates at high speed during ion implantation, and two of each are provided around the base body 2.

6 is a bearing, and a clamp arm 8 is attached to the bearing part.
The shaft 7 on which the lever 9 is pivotally mounted is pivotally supported, and its mounting position is on the bottom surface of the disk 1 and on the base body 2.
near the outer periphery of the disk. Reference numeral 8 denotes a clamp arm having a larger external shape than the shape of the base body 2, and its base side is pivotally attached to both ends of the shaft 7.
The open side will be the peripheral side of the disk. An opening 8a is formed on the open side of the clamp arm 8, and a pin 12
I try not to get in the way. Two outer clamps 10 and two inner clamps 11 for clamping the wafer 5 are provided on both sides of the open side and near the base side of the clamp arm 8, and their tips are connected to the base body 2 of the disk 1. It passes through a hole 16 drilled nearby. The tips of the outer clamp 10 and the inner clamp 11 are formed into an L-shape, and are arranged to overlap with the upper surface of the base body 2.

Reference numeral 9 denotes a lever, the base side of which is pivotally connected to the shaft 7, and the open side of the lever located near the disk 1. A pin 12 that passes through a hole 17 formed in the stand main body 2 and holds the wafer 5 is fixed at its tip.

A spring 13 is attached between the disk 1 and the clamp arm 8 and provides a clamping force for clamping the wafer 5 to the clamp arm 8. A stopper 14 is attached to the clamp arm 8, and when the clamp arm 8 is pushed upward, it hits the disk 1 and prevents the clamp arm 8 from opening any further. 15 is spring 1
A spring with a spring force greater than 3 is mounted between the clamp arm 8 and the lever 9.
18 is a bracket to prevent the clamp arm 8 and lever 9 from opening beyond a certain distance;
Its shape is L-shaped, and its tip is hooked on the lower surface of the lever 9, and the base portion is attached to the clamp arm 8.

Although the bracket 18 is attached to the clamp arm 8 in the embodiment, it may also be attached to the lever 9.

The present invention is constructed as described above, and the case where the wafer 5 is placed on the stand main body 2 using this construction will be described with reference to FIGS. 6 and 7.

First, the lever 9 is pushed upward by a clamp lifter (not shown). At this time, since the spring force of the spring 13 is weaker than that of the spring 15, only the spring 13 is compressed, and the clamp arm 8 and the lever 9 rotate as a unit around the shaft 7.

When the stopper 14 attached to the clamp arm 8 hits the disk 1, the outer clamp 10 and the inner clamp 11 are opened.
(See FIG. 6) At this time, the pushing up of the clamp lifter is stopped, and the wafer 5 that has been sucked by the vacuum chuck 19 (wafer loading device) is loaded onto the table main body 2.

Then, when the lever 9 is pushed upward again with the clamp lifter, only the spring 15 is compressed, and only the lever 9 rotates around the shaft 7, and the wafer 5 is held by the pin 12 provided at the tip of the lever 9. be done. (See Fig. 7) Next, when the vacuum chuck 19 is retreated and the clamp lifter is lowered downward, first, only the lever 9 rotates around the shaft 7.
The wafer 5 is placed on the stand main body 2. Then, when the tip of the bracket 18 is caught on the lever 9, the clamp arm 8 also rotates around the shaft 7 in the same way as the lever 9, and rotates until the outer clamp 10 and the inner clamp 11 hold the wafer 5. do.

Then, when the clamp lifter leaves the lever 9, the wafer 5 is clamped by the outer clamp 10 and the inner clamp 11 by the spring force of the spring 13.

Conversely, when taking out the wafer 5 from the stand main body 2, push up the lever 9 using the clamp lifter, operate the clamp lifter until the wafer 5 is at the position indicated by the imaginary line in FIG. 7 by the pin 12, and then, The wafer 5 is sucked by the vacuum chuck 19 and taken out from the stand main body 2. Then, the clamp lifter is lowered to return the clamp arm 8, lever 9, etc. to the position shown in FIG. 1.

[Effects of the invention] As described above, in the device of the invention, the wafer is held by pins from the bottom of the wafer table, and the rotating and swinging parts of the clamp arm and lever are provided on the back side of the wafer loading surface of the disk, and the disk and wafer are By interposing a spring between each of the clamp arm and lever and using a single opening/closing mechanism for the clamp and lever in a two-stage operation, there is no cutout of the vacuum chuck from the wafer loading surface, and this part At the same time, it is possible to solve the problems of dust generation associated with direct-acting clamps and decreased productivity associated with increased capacity of vacuum containers.

[Brief explanation of the drawing]

Fig. 1 is a front view of the device of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a bottom view of Fig. 1, Fig. 4 is a sectional view of Fig. 1, and Fig. 5 is a Figure 6 is a cross-sectional view of the wafer being loaded into the device of the present invention;
FIG. 7 is a diagram showing a state in which the wafer is held by the pins of the device of the present invention. Fig. 8 is a front view of the conventional technology (wafer stand notch type), Fig. 9 is a plan view of Fig. 8, Fig. 10 is a front view of the conventional device (clamp arm sliding type), and Fig. 11 is the front view of the conventional device (clamp arm sliding type). FIG. 10 is a plan view of FIG. 1, 1', 1''...Disk, 2, 2', 2''...
Stand body, 5, 5', 5''...Wafer, 8, 8''...
...Clamp arm, 9...Lever, 10...Outer clamp, 11...Inner clamp, 12,12''
...Pin, 13...Spring, 15...Spring, 19,
19', 19''... Bakyumu chuck, 20''...
...Clamp rod, 21'...Wafer clamp.

Claims (1)

[Scope of utility model registration request] A clamp arm and a lever are pivotably attached to the back side of a disk having a wafer holder, and the clamp arm is provided with a plurality of clamps that penetrate the disk and hold the wafer, and the clamp arm is provided with a plurality of clamps that penetrate the wafer holder and hold the wafer. A plurality of pins for holding the wafer are provided on the lever, a spring is interposed between the clamp arm and the disk, and a spring having a stronger spring force than the spring is interposed between the clamp arm and the lever. A special feature is the clamp device installed on the wafer stand of the disk.