JPH0517575Y2 - - Google Patents

Description

[Detailed description of the invention] <Industrial field of application> The present invention relates to a device that evaporates and cools objects to be cooled by reducing the pressure in a cooling chamber and evaporating cooling water. The present invention relates to the structure of a cooling chamber in a device in which a cooling chamber is formed. Examples of the above-mentioned vacuum vaporization cooling equipment include cooling equipment for various reaction vessels, equipment for drying foods, and the like.

<Prior Art> As a conventional reduced pressure evaporative cooling device, there is a reaction vessel evaporative cooling device shown in FIG. In the figure, 1 is a reaction vessel as a container for objects to be cooled, and has a raw material inlet 2, a product outlet 3, and a stirrer 4. A jacket portion 5 serving as a cooling chamber is formed on the outside of the reaction vessel 1. A cooling water supply pipe 6 for supplying cooling water is connected to the jacket part 5, and a fluid outlet 7 is provided at the lower part of the jacket part 5 and is connected to a vacuum pump 8.

When the reaction vessel 1 is to be cooled, the inside of the jacket portion 5 is brought into a predetermined reduced pressure state using the vacuum pump 8, and cooling water is supplied from the cooling water supply pipe 6, whereby the cooling water is evaporated and evaporative cooling is performed. The vaporized steam is sucked and discharged from the fluid outlet 7 by the vacuum pump 8.

<Problem to be solved by the invention> Since the above-mentioned conventional evaporative cooling device simply supplies cooling water from the cooling water supply pipe into the cooling chamber, it is difficult to cool the outer wall surface of the container to be cooled, especially the bottom outer wall surface. Due to the low adhesion efficiency of water, a sufficient cooling effect cannot be achieved, and the temperature distribution becomes uneven, resulting in uneven cooling, making it difficult to maintain a constant product quality.

Therefore, the technical problem of the present invention is to increase the adhesion efficiency of cooling water to the entire outer wall surface of a container to be cooled in a reduced pressure evaporation cooling device.

<Means for solving the problem> The technical means of the present invention taken to solve the above problem is to form an evaporative cooling chamber in contact with the object container to be cooled, allow cooling water to flow into the evaporative cooling chamber, In a device that reduces the pressure in the evaporative cooling chamber with a vacuum pump to evaporatively cool the object to be cooled, the cooling water supply pipe that causes the cooling water to flow into the evaporative cooling chamber is connected at least to the bottom outer wall of the object to be cooled container and to the evaporative cooling chamber. and the outer wall of the container to be cooled so as to allow the flow to flow in the direction of reflection sequentially.

<Effect> The operation of the above technical means is as follows.

The cooling water supplied from the cooling water supply pipe is reflected sequentially between the bottom outer wall surface of the container to be cooled and between the cooling chamber and the outer wall of the container to be cooled. It adheres in the form of a thin film over a wide area due to reflection not only on walls but also on other external wall surfaces. Therefore, evaporative cooling is performed on the entire outer wall of the object to be cooled container, and a sufficient cooling effect can be achieved, and the temperature distribution is also uniform, so that uneven cooling does not occur.

<Example> An example showing a specific example of the above technical means will be described (see FIG. 1).

In this embodiment, an example is shown in which a vacuum pump combined with an ejector is used, which can adjust the degree of pressure reduction by adjusting the temperature of circulating water.

In FIG. 1, 11 is a reaction vessel as a container for objects to be cooled similar to the conventional technology, 22 is a pump device, 26 is a valve device for adjusting the amount of cooling water, and 24 is for adjusting the temperature of the circulating water of the pump device 22. This is the water temperature control section.

The reaction vessel 11 has a raw material inlet 12, a product outlet 13, and a stirrer 14, and a jacket part 15 as a vaporization cooling chamber is formed on the outside thereof. A cooling water injection nozzle 18 is attached to the lower part of the jacket portion 15 and a cooling water supply pipe 16 is connected thereto. The injection nozzle 18 has injection nozzles in multiple directions, some of which are injected into the reaction pot 11.
Cooling water is injected onto the bottom outer wall surface of the reactor, and the other part is sequentially reflected between the inner wall of the jacket part 15 and the outer wall of the reaction vessel 11 (in the direction shown by the two-dot chain line in FIG. 1).

In the pump device 22, a pump 30 has a suction side connected to a tank 31, a discharge side connected to a nozzle 33 of an ejector 32, and a differential user 34 of the ejector 32.
is connected to the upper space of the tank 31. The suction port 35 of the ejector 32 and the upper part of the jacket portion 15 are connected via a communication passage 21. This pump device 22 is configured to supply water in a tank 31 to an ejector 32 by operation of a pump 30, to cause a suction action, and to return the water to the tank 31.

The water temperature control section 24 is provided to control the water temperature in the tank 31, and is designed to perform control by supplying cooling water into the tank 31. Cooling water supply pipe 40 connected to tank 31
An automatic valve 70 is provided in the middle of the tank, and is opened and closed by a signal from a temperature sensor 41 that detects the water temperature in the tank.

Reference number 25 is a means for discharging excess water, and an automatic valve 71 is attached to a part of the pump device 22.
The water level in the tank 31 is maintained within a predetermined range by signals from water level sensors 42a and 42b in the tank 31.

Each valve 26, 70, 71 is opened and closed by a signal from the control section 29.

When the reaction vessel 11 is to be cooled, the valve device 26 is opened in response to a signal from the control section 29, and a portion of the circulating water from the pump 30 is supplied as cooling water to the jacket section 15 through the cooling water supply pipe 16. At this time, the cooling water is injected onto the bottom outer wall surface and the outer peripheral wall surface of the reaction pot 11 by the injection nozzle 18, so that it is efficiently attached to the entire outer wall surface of the reaction pot 11. Inside the jacket part 15 is an ejector 32.
A predetermined reduced pressure state is maintained by the suction action of the reaction vessel 11, and the supplied cooling water is rapidly vaporized by the heat of the raw materials and the reduced pressure, thereby cooling the raw materials in the reaction vessel 11.
Steam vaporized by cooling passes through the communication path 21 and is sucked into the ejector 32 and reaches the tank 31.

When the water level in the tank 31 rises, the upper limit water level sensor 42a detects it, and the automatic valve 71 opens to discharge excess water and maintain the water level within a predetermined range.

The degree of pressure reduction in the jacket portion 15 can be adjusted by controlling the water temperature in the tank 31.

Further, in this embodiment, the jacket portion 15
Furthermore, by connecting the heating steam supply pipe 27 via the valve device 23, steam heating and reduced pressure evaporation cooling can be repeatedly performed using the same device.

<Effects of the invention> As described above, according to the present invention, the adhesion efficiency of cooling water to the entire outer wall surface of the container to be cooled is improved, so the cooling effect can be enhanced and uneven cooling can be prevented. This allows the product quality to be maintained at a constant level.

Furthermore, since the cooling effect can be enhanced, the amount of cooling water can be saved.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing a general configuration of an embodiment of a reduced pressure evaporative cooling device of the present invention, and FIG. 2 is a schematic block diagram showing an example of a conventional reduced pressure evaporative cooling device. 11... Reaction pot, 15... Jacket part, 16
... Cooling water supply pipe, 18 ... Injection nozzle, 22 ...
...Pump device, 24...Water temperature control section.

Claims (1)

[Scope of utility model registration request] A device that forms an evaporative cooling chamber in contact with a container for the object to be cooled, allows cooling water to flow into the evaporative cooling chamber, and reduces the pressure in the evaporative cooling chamber with a vacuum pump to evaporatively cool the object to be cooled. A reduced pressure evaporative cooling device in which a cooling water supply pipe flowing into a chamber is connected so as to flow at least in the direction of the bottom outer wall of a container to be cooled and in the direction of reflection between the evaporative cooling chamber and the outer wall of the container to be cooled.