JP2684284B2 - Decompression evaporative cooling equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for evaporating and cooling supplied cooling water in a cooling chamber to vaporize and cool an object to be cooled, and more particularly to a cooling water injection structure. Examples of the reduced pressure evaporative cooling device include cooling devices for various reaction kettles and cooling devices for foods and various fibers.

[0002]

2. Description of the Related Art As a conventional reduced pressure evaporative cooling device, for example, there is one shown in Japanese Utility Model Laid-Open No. 3-48684. This is a partition that fixes the outer periphery to the upper part of the evaporative cooling chamber, arranges an annular elastic plate member having an inner periphery as a free end, and installs a cooling water supply pipe that allows cooling water to flow into the evaporative cooling chamber. The cooling water supplied from the cooling water supply pipe deforms the elastic plate member due to the water pressure and flows down uniformly from the deformed portion to the outer periphery of the object to be cooled, thereby cooling the object to be cooled. The entire surface of the container can be efficiently cooled.

[0003]

However, the above-mentioned conventional evaporative cooling apparatus has a problem that a sufficient cooling effect cannot be exhibited. It is necessary for the cooling water to flow down as uniformly as possible over the entire surface of the cooled object container in order to perform effective evaporative cooling, but in the conventional deformation of the elastic plate member due to the hydraulic pressure of the cooling water, the initial use is In the above, it can be made to flow down uniformly over the entire surface of the object to be cooled, but it becomes impossible to flow down evenly as the use time elapses. This is because the elastic force of the elastic plate member partially changes with the lapse of time, the elastic force varies, and the cooling water preferentially flows down from the portion where the elastic force is reduced.

Therefore, a technical object of the present invention is to increase the efficiency of evaporative cooling in a reduced pressure evaporative cooling apparatus by allowing cooling water to flow down uniformly over the entire surface of a container to be cooled over a long period of time.

[0005]

The structure of the reduced pressure evaporative cooling device of the present invention is as follows. A vaporization cooling chamber is formed in contact with a container to be cooled, cooling water is introduced into the vaporization cooling chamber, and the vaporization cooling chamber is decompressed by a vacuum pump to vaporize and cool the substance to be cooled. A supply nozzle for supplying the chamber is provided, temperature detecting means for detecting the temperature of the surface of the object to be cooled is attached, and water amount adjusting means for adjusting the amount of water passing through the cooling water supply nozzle is provided by a signal from the temperature detecting means. It is a thing.

[0006]

By mounting the temperature detecting means, it is possible to detect whether or not the cooling water adheres to the surface of the object container to be cooled in the form of a water film. That is, if the cooling water does not adhere to the surface of the object to be cooled in the form of a water film, the surface temperature detected by the temperature detecting means becomes a very high value compared to the temperature of the cooling water, and the temperature of the object to be cooled is Although the values are close to each other, if the cooling water adheres in the form of a water film, the detected surface temperature becomes a value close to the cooling water temperature, which is a temperature value considerably lower than the temperature of the object to be cooled. In evaporative cooling, the temperature of the cooling water during evaporative cooling is lower than in ordinary water cooling because the object to be cooled is cooled by the latent heat of vaporization of water under reduced pressure. As the temperature detecting means, conventionally known ones such as various thermocouples, thermistors and radiation thermometers can be used. If the cooling water does not adhere to the surface of the container to be cooled in the form of a water film, the cooling water can be reliably adhered by increasing the amount of water passing through the cooling water supply nozzle via the water amount adjusting means. By mounting the temperature detecting means on the surface of the object-to-be-cooled container where cooling water does not easily adhere, the cooling water can be uniformly adhered to the entire surface of the object-to-be-cooled container in the form of a water film. Since the annular elastic member is not used unlike the conventional evaporative cooling, it is possible to maintain a uniform cooling water flow even during long-term use.

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. In the present embodiment, as the vacuum pump, an example is shown in which a vacuum pump in which an ejector is combined and whose degree of pressure reduction can be adjusted by adjusting the water temperature of the circulating water is used. In FIG.
Reactor kettle 11 as a container to be cooled, cooling water supply nozzles 16 and 17, and temperature sensor-1 as a temperature detecting means-1,
2, 3 and the pump device 22, the valve devices 8 and 26 for adjusting the amount of cooling water, and the water temperature control unit 24 for adjusting the water temperature of the circulating water of the pump device 22 constitute a decompression evaporation cooling device.

The reaction vessel 11 has a raw material inlet 12 and a product outlet 1
3. A stirrer 14 is provided, and a jacket portion 15 as an evaporative cooling chamber is provided outside the stirrer 14. A plurality of cooling water supply nozzles 16 and 17 are attached to the upper portion of the jacket portion 15 and connected to the valve devices 26 and 8. The cooling water supply nozzles 16 and 17 are
A plurality of reaction vessels 11 are attached to the entire outer surface so that cooling water can be supplied.

In the pump device 22, the pump 30 has the tank 3
1, the suction side is connected, the discharge side is connected to the nozzle 33 of the ejector 32, and the diffuser 34 of the ejector 32 is connected to the upper space of the tank 31. The suction port 35 of the ejector 32 and the fluid discharge port 18 of the jacket portion 15 are connected via a communication passage 21. The pump device 22 supplies the water in the tank 31 to the ejector 32 by the operation of the pump 30 to cause the ejector 32 to suck the water, and then returns the water to the tank 31. A part of the water circulating in the pump device 22 passes through the water pipe 19 and the valve devices 8 and 26, and the nozzle 1
It can reach 6,17.

The temperature sensors-1, 2 and 3 are attached to the outer surface of the reaction vessel 11 above, in the center and below. Temperature sensor
1, 2, 3 are connected to the control unit 29. It is desirable that the temperature sensors-1, 2 and 3 are also attached to a portion where cooling water is not easily sprayed due to the shape of the supply nozzles 16 and 17, such as an intermediate portion of the supply nozzle.

The water temperature control section 24 is provided to control the temperature of the water in the tank 31. The water temperature control section 24 controls the temperature of the circulating water of the pump device 22 by supplying cooling water into the tank 31. I have. An automatic valve 70 is provided in the middle of the cooling water supply pipe 40 connected to the tank 31, and is opened and closed by a signal from a temperature sensor 41 for detecting the temperature of water in the tank. The cooling water supply pipe 40 is also connected to the valve devices 8 and 26 via the branch pipe 5 and the valve 6. Reference numeral 25 is a surplus water discharging means, which is provided with an automatic valve 71 in a part of the pump device 22 and keeps the water level in the tank 31 within a predetermined range by signals from the water level sensors 42 and 43 in the tank 31. Is. Each valve 6, 8, 26, 70, 71 is a control unit 2
The signal from 9 opens and closes. Control part 29
The cooling water supply pipe 40 and the valves 8 and 26 form a water amount adjusting means.

When the reaction kettle 11 as a container to be cooled is cooled, the valve devices 8 and 26 are opened by a signal from the control part 29, and the cooling water from the cooling water supply pipe 40 is supplied to the nozzles 16 and 17. Supply to. The cooling water sprayed from the nozzles 16 and 17 adheres to the outer surface of the reaction vessel 11 to form a water film and evaporate and evaporate while flowing down to cool the object to be cooled in the reaction vessel 11. The temperature of the reaction kettle 11 is detected by the temperature sensors-1, 2 and 3, and whether the cooling water film is formed or not is determined depending on whether the temperature of the cooling water is close to that of the object to be cooled. Detected, if the water film is not formed,
A signal from the control section 29 increases the opening of the valve 8 or 26 to supply more cooling water from the nozzles 16 and 17 into the jacket section 15.
It is possible to form a uniform water film over the entire surface.

The cooling water and the vaporized steam that have not completely vaporized are
The fluid is discharged from the fluid outlet 18 to the ejector 32, and the tank 3
To 1. When the water level in the tank 31 rises, the upper limit water level sensor 42 detects it, and the automatic valve 71 opens to discharge surplus water and keep the water level within a predetermined range.

The degree of pressure reduction of the jacket portion 15 is determined by the tank 31.
The water temperature of the pump 30 can be adjusted by controlling the water temperature of the pump 16, and the circulating water of the pump 30 can be used as the cooling water for the nozzles 16 and 17 without using the water from the cooling water supply pipe 40.
Can also be supplied via valves 8 and 26. Further, in the present embodiment, an example using three temperature sensors-1, 2, 3, is shown, but one may be used depending on the shape of the object container to be cooled,
It is also possible to attach a large number of temperature sensors.

In this embodiment, the jacket portion 15
Further, by connecting the steam supply pipe 27 for heating through the valve device 23, the steam heating and the reduced pressure evaporative cooling can be repeatedly performed by the same device.

[0016]

The adhering condition of the cooling water is detected by the temperature detecting means, and the passing water amount of the cooling water supply nozzle is adjusted by the water amount adjusting means, so that the cooling water is evenly distributed over the entire surface of the object to be cooled. It can be attached and the cooling efficiency can be improved, thus enhancing the cooling effect.

Further, by mounting the temperature detecting means on the surface of the object to be cooled, it is possible to detect the adhering condition of the cooling water and also to detect the temperature on the surface of the object to be cooled at the same time. The control can be performed more accurately.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of a reduced pressure evaporative cooling device of the present invention.

[Explanation of symbols]

 1, 2 and 3 Temperature sensor 8 Valve device 11 Reaction kettle 15 Jacket part 16 and 17 Cooling water supply nozzle 22 Pump device 26 Valve device 29 Control part 31 Tank 32 Ejector 33 Nozzle 40 Cooling water supply pipe

Claims (1)

(57) [Claims] 1. A vaporization cooling chamber is formed in contact with a container to be cooled, cooling water is introduced into the vaporization cooling chamber, and the vaporization cooling chamber is decompressed by a vacuum pump to vaporize and cool the substance to be cooled. Provided with a supply nozzle that supplies cooling water to the evaporative cooling chamber,
A decompression evaporative cooling device provided with a temperature detecting means for detecting the temperature of the surface of a container to be cooled and provided with a water amount adjusting means for adjusting the amount of water passing through the cooling water supply nozzle according to a signal from the temperature detecting means.