JPH05175631A - Manufacture of hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To provide a manufacturing method of a hybrid integrated circuit which is capable of setting a hybrid integrated circuit board in any arbitrary width dimensions. CONSTITUTION:A hybrid integrated circuit composite board 1 made in a first process is coupled with a plurality of hybrid integrated circuit boards 2 horizontally by way of a disposal board portion 9 respectively. The width dimensions of the disposal board portion 9 can be set arbitrarily within a specified range. Therefore, it is possible to set the width dimensions to a certain arbitrary extent irrespective of a lead pitch 'a' and the number 'n' of a lead terminal 6. It is, therefore, possible to obtain a hybrid integrated circuit device having a hybrid integrated circuit board 2 whose width dimensions can be arbitrarily set without determining its width dimensions uniformly based on the lead span 'a' and the number 'n' of the lead terminals to be used, if each hybrid integrated circuit board 2 is separated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention attaches a lead terminal to a hybrid integrated circuit aggregate substrate in which a plurality of hybrid integrated circuit substrates are assembled, and separates the hybrid integrated circuit substrates into individual hybrid integrated circuit devices to manufacture a hybrid integrated circuit device. On how to do.

[0002]

2. Description of the Related Art In recent years, a hybrid integrated circuit device has been improved in the degree of integration on its circuit board, has been downsized, and has been improved in its manufacturing and assembling methods, thus improving its productivity.
As a specific example thereof, a method of manufacturing a hybrid integrated circuit device as shown in FIGS. 7 and 8 is disclosed, which will be described with reference to the drawings. A hybrid integrated circuit aggregate substrate is formed by connecting a plurality of hybrid integrated circuit substrates vertically and horizontally through a cutting line, and a circuit pattern is printed and electronic components are mounted in units of such an aggregate substrate. After that, the hybrid integrated circuit collective substrate is divided along a horizontal cutting line, and the individual hybrid integrated circuit substrates are separated into the hybrid integrated circuit collective substrates which are horizontally arranged in a row. On the upper side of FIG. 7, there is shown a hybrid integrated circuit assembly substrate in which the hybrid integrated circuit substrates are arranged side by side in a row. As shown in FIG. 7, lead lands 4 are formed on the hybrid integrated circuit aggregate substrate 1 along the edges thereof at regular intervals. Also, on the lower side of FIG.
A lead frame 5 is shown, on which lead terminals 6 are led out in a comb-like shape at the same intervals as the lead lands 4. A clip 7 branched into two or more branches is formed at the tip of the lead terminal 6. As shown in FIG. It is attached so as to sandwich the edge of the collective substrate 1. Further, the clip 7 and the lead land 4 are joined by solder. Thereafter, the lead terminals 6 are separated from the frame 8 along the line AA ′ in FIG. 8 and the individual hybrid integrated circuit boards 2 are separated along the cutting line 3. As a result, individually separated hybrid integrated circuit devices are obtained, and if necessary, an insulating protective coating is applied to the portion of the hybrid integrated circuit board 2.

The manufacturing method using such a series of hybrid integrated circuit collective substrates 1 is effective when the circuit configurations of the hybrid integrated circuit devices are all the same, and is suitable for a mass production method of the hybrid integrated circuit devices. There is.

[0004]

However, in the hybrid integrated circuit aggregate substrate 1 used in the above-mentioned conventional technique, the individual hybrid integrated circuit substrates 2 are connected through the cutting line 3, and the hybrid integrated circuit substrate 2 Since the distance between the lead lands 4 printed on the upper surface corresponds to the distance between the lead terminals 6 formed integrally with the lead frame 5, the width dimension of the hybrid integrated circuit board 2 (in the arrangement direction of the lead lands 4). The term "dimensions" is determined by the number of lead terminals 6 and the pitch thereof required for the printed integrated circuit. That is, assuming that the required number of lead terminals 6 is n and the spacing between the lead terminals 6, that is, the lead pitch is a, the width dimensions of the individual hybrid integrated circuit boards 2 are uniformly n × a in the above-described manufacturing method. Become.

Generally, there are various kinds of circuits printed on the hybrid integrated circuit board 2 of various sizes, and the size of the hybrid integrated circuit board 2 and the number of lead terminals 6 are different depending on the type of the hybrid integrated circuit device and the electronic parts to be mounted. It is determined by the type and the number. On the other hand, the lead pitch a, which is the interval between the lead terminals of the lead frame, is defined by the standard. Therefore,
The hybrid integrated circuit device manufactured by the above method has a drawback that it is not flexible because it is uniformly determined by the lead pitch a of the lead frame 5 used and the required number n of lead terminals 6. In particular, the distance from the lead land 4 at the end to the edge of the end of the hybrid integrated circuit board 2 is uniformly set to a / 2, and there is a problem that the circuit design is restricted.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a hybrid integrated circuit in which the hybrid integrated circuit substrate can be set to have an arbitrary width dimension.

[0007]

That is, the gist of the present invention for achieving the above-mentioned object of the present invention is to provide a set for a hybrid integrated circuit in which a plurality of hybrid integrated circuit boards are connected in a horizontal direction through a cutting line. A step of making a board; a step of joining lead terminals arranged in the longitudinal direction of the lead frame at equal intervals to lead lands provided at equal intervals along the edge of the hybrid integrated circuit board; A method of manufacturing a hybrid integrated circuit device, comprising: cutting the hybrid integrated circuit collective substrate along the cutting line along with cutting to a predetermined length, and separating each hybrid integrated circuit board into individual hybrid integrated circuit boards. The step of producing the hybrid integrated circuit aggregate substrate is a step of producing a hybrid integrated circuit substrate in which a plurality of hybrid integrated circuit substrates are connected in a lateral direction through a discard substrate. Separating the formed integrated circuit each substrate is a method for manufacturing a hybrid integrated circuit device characterized by comprising the step of separating each hybrid integrated circuit board along the line of each side of the discarded substrate.

[0008]

[Operation] According to the above-described method for manufacturing a hybrid integrated circuit device of the present invention, the hybrid integrated circuit collective substrate formed in the first step first has a plurality of hybrid integrated circuit substrates disposed side by side through the discarded substrates. Although they are connected in the same direction, the width dimension of this waste substrate can be arbitrarily set within a predetermined range. Therefore, the width dimension of the hybrid integrated circuit substrate is set regardless of the lead pitch a and the number of lead terminals n used. It can be of some arbitrary size. Specifically, the distance from the end lead land of the hybrid integrated circuit substrate 2 to the end of the substrate 2 is not necessarily a.
It is not necessary to set the distance to / 2, and the distance can be set to be a / 2 or more or less. Therefore, if each hybrid integrated circuit board is separated by cutting lines on both sides of the waste substrate, the width is not uniformly determined by the lead pitch a and the number of lead terminals n to be used, but a hybrid integrated circuit board having an arbitrary width. A hybrid integrated circuit device having is obtained.

[0009]

EXAMPLES Examples of the present invention will be described in detail below with reference to the drawings. 1 and 2 are diagrams showing an embodiment of the present invention and are diagrams corresponding to FIGS. 7 and 8 for explaining a conventional example. Here, the collective substrate 1 for a hybrid integrated circuit has a waste substrate 9 formed between a plurality of hybrid integrated circuit substrates 2 which are continuous in the lateral direction, and both ends of the waste substrate 9 are left and right via cutting lines 3 as shown in the figure. Are respectively connected to the hybrid integrated circuit boards 2. The lead lands 4 formed by printing on the hybrid integrated circuit board 2 are formed at equal intervals a along the edge of the hybrid integrated circuit aggregate board 1. In this embodiment, the width b of the abandoned substrate 9 is smaller than the interval a of the lead lands 4 and has a relation of a> b, and between the lead lands 4 at the end of adjacent hybrid integrated circuit boards. Is formed in.

The lead frame 5 is formed by leading the lead terminals 6 from the frame 8 at regular intervals, and has a clip 7 at the tip of the lead terminal 6. Lead Land 4 above
Are formed at intervals between the lead terminals 6 of the lead frame 5, that is, at intervals equal to the lead pitch a. Then, as shown in FIG. 2, the clip 7 of the lead terminal 6 is formed.
The portion of the lead land 4 of the hybrid integrated circuit aggregate substrate 1 is clipped, and then the clip 7 is soldered to the lead land 4. After that, the lead terminals 6 are cut along the dotted line AA ′ in FIG. 2 to separate them from the connecting portion 8, and at the same time, the respective cutting lines 3 are cut, and the abandoned substrate 9 is removed. A plurality of independent hybrid integrated circuit devices 10 as shown are simultaneously completed.

In this way, when forming a series of hybrid integrated circuit aggregate substrates 1, a waste substrate having a width b is provided in advance, so that the hybrid integrated circuit substrate 2 of the completed hybrid integrated circuit device 10 shown in FIG. 3 is formed. Has a width of n × a−b.
However, n is the number of lead terminals 6 attached to one hybrid integrated circuit board 2, and a is the lead pitch of the lead terminals 6. This makes it possible to reduce the width of the hybrid integrated circuit board 2 by at least the width of the waste substrate 9 as compared with the conventional hybrid integrated circuit device manufactured by the manufacturing method without providing the waste substrate. Moreover, in the conventional method, the distance from the end of the hybrid integrated circuit board 2 to the lead land 4 at the end is uniformly determined as a / 2.
-B) / 2. This dimension can be set to an arbitrary value by changing the width dimension b of the waste substrate 9. Specifically, the hybrid integrated circuit device 1
In addition to downsizing the entire 0, restrictions on circuit design can be reduced.

4 and 5 are views showing another embodiment of the present invention, the procedure of the manufacturing method shown here is basically the same as the procedure shown in FIGS. Therefore, if the description is omitted and only the differences are described, in the embodiment shown in FIGS. 4 and 5, the waste substrate 9 has a width including at least one lead land 4. That is, the waste substrate 9 shown in FIG. 4 is set to be wider than the width of the lead land 4 and narrower than twice the pitch a of the lead terminals 6 and 2a, and one lead land 4 ′ and 4 ″ is provided for each. Includes each.
The lead terminals 6 ′ and 6 ″ connected to the lead lands 4 ′ and 4 ″ on the discarded substrates 9 and 9 are not actually used and are discarded together with the discarded substrates 9 and 9. That is, as shown in FIG. 5, the lead terminal 6 is cut along the line AA ′ indicated by a dotted line, the hybrid integrated circuit aggregate substrate 1 is cut along the cutting line 3, and the lead terminal 6 ′ is disposed together with the discarded substrate 9. , 6 ″ are discarded. As a result, a plurality of independent hybrid integrated circuit devices 10 as shown in FIG. 6 are simultaneously completed.

As described above, the width dimension of the hybrid integrated circuit substrate 2 becomes a (n + 1) -b by providing the above-mentioned waste substrate 9 at the position including the lead land 4. That is, if b <a here, when the number n of lead terminals 6 and the lead pitch a are the same, the hybrid circuit of the hybrid integrated device manufactured by the embodiments shown in FIGS. 4 and 5. As for the width of the substrate 2, the width of the hybrid integrated circuit substrate 2 can be made wider than that of the hybrid integrated circuit device manufactured by the conventional example shown in FIGS. 7 and 8. On the contrary, if b> a, the width of the hybrid circuit board 2 of the hybrid integrated device manufactured by the embodiments shown in FIGS. 4 and 5 is the same as that of the conventional example shown in FIGS. The width of the hybrid integrated circuit board 2 can be reduced as compared with the hybrid integrated circuit device to be manufactured. In this way, by changing the width of the waste substrate 9, the width of the hybrid integrated circuit substrate 2 of the obtained hybrid integrated circuit device is a
The hybrid integrated circuit device can be made narrower or wider than × n, and a hybrid integrated circuit device having a hybrid integrated circuit substrate of an arbitrary width can be manufactured through substantially the same steps as conventional ones. It does not require any special process to adjust the width of the.

[0015]

As described above, a hybrid integrated circuit device having hybrid integrated circuit boards of various width dimensions can be manufactured without requiring a special step of adjusting the width of the hybrid integrated circuit board. Become.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an example of a method for manufacturing a hybrid integrated circuit device according to the present invention.

FIG. 2 is a diagram showing a state in which the collective substrate for the hybrid integrated circuit shown in FIG. 1 and a lead frame are joined together.

FIG. 3 is a diagram showing a state when a hybrid integrated circuit device is completed by the manufacturing method according to the present invention.

FIG. 4 is an explanatory view showing another embodiment of the method for manufacturing the hybrid integrated circuit device according to the present invention.

FIG. 5 is a view showing a state where the collective substrate for the hybrid integrated circuit shown in FIG. 5 and a lead frame are joined.

FIG. 6 is a diagram showing a state when a hybrid integrated circuit device is completed by another manufacturing method of the present invention.

FIG. 7 is an explanatory diagram illustrating a conventional method for manufacturing a hybrid integrated circuit device.

FIG. 8 is a diagram showing a state in which the collective substrate for the hybrid integrated circuit shown in FIG. 8 and a lead frame are joined together.

[Explanation of symbols]

 1 Hybrid Integrated Circuit Assembly Board 2 Hybrid Integrated Circuit Board 3 Cutting Line 4 Lead Land 5 Lead Frame 6 Lead Terminal 9 Discarded Board 10 Hybrid Integrated Circuit Device

Claims (1)

[Reference number] 0030497-01 [Claims] 1. A step of producing a hybrid integrated circuit aggregate substrate in which a plurality of hybrid integrated circuit substrates are connected in a horizontal direction through a cutting line, and lead terminals arranged at equal intervals in a longitudinal direction of a lead frame are provided. A step of joining to lead lands provided at equal intervals along the edge of the hybrid integrated circuit board, cutting the lead terminals to a predetermined length, and cutting the hybrid integrated circuit aggregate board along the cutting line. In the method of manufacturing a hybrid integrated circuit device, which comprises a step of cutting and separating each hybrid integrated circuit board, in the step of producing the hybrid integrated circuit collective substrate, a plurality of hybrid integrated circuit boards are disposed via a waste substrate. This is a step of making a substrate for a hybrid integrated circuit that is continuous in the lateral direction. The step of separating the hybrid integrated circuit collective substrate into individual hybrid integrated circuit substrates is performed by cutting lines on both sides of the discarded substrate. Basis A method of manufacturing a hybrid integrated circuit device, comprising the step of separating the plates.