JPH05175621A - Manufacture of cutting type throughhole board and printed circuit board - Google Patents

Abstract

PURPOSE:To make it possible to cut down a useless wiring portion on a board by means of an automatic cutter and prepare a high density circuit board even in a circuit design division having no board production division by forming a circuit pattern preliminarily on the board based on a through hole and film exposure. CONSTITUTION:A plurality of through holes 7 are bored at the same span on the whole surface of an insulation board 3. A main wiring 12 is printed vertically and horizontally in the shape of a lattice between these through holes 7. A circuit pattern of a through hole board based on a cutting down system on which a sub wiring 13, which is designed to couple printed through hole lands 14 which the main wiring 14, is printed in a radius manner. This circuit pattern is indicated on a display of a CAD. A cutting position of the wiring is set through monitoring the display. This signal is output to an automatic cutter where a board 11 is set to a fixing jig. Useless portions of the main wiring 12 of the board 11 and the sub wiring 13 are cut by moving a cutting drill, thereby forming this printed circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a through-hole board on which printed wiring is preliminarily printed and a method for manufacturing a printed circuit board by cutting an unnecessary portion of the printed wiring to form a circuit.

[0002]

2. Description of the Related Art Generally, when manufacturing a printed circuit board, a through hole is first formed in an insulating board having copper on its surface based on a design circuit diagram, and then an inner wall surface of the through hole is plated with copper. A photosensitive etching resist is provided on the surface. After that, a negative film having a circuit pattern photographed thereon is placed on an etching resist, exposed to expose the circuit pattern, and then developed to melt copper in a portion other than the pattern to expose the insulating substrate. After this,
The etching resist on the remaining copper is peeled off to form a circuit pattern.

However, the conventional etching method is suitable for mass production because it requires a manufacturing cost for producing a negative film and the like, but there is a problem that the cost becomes high in the case of trial manufacture or small quantity production of about 20 units. there were. In particular, when it is necessary to carry out the designing and manufacturing of the board in a short period of time, there is a problem that a small amount of production is not welcomed and the delivery time is delayed because the designing area and the board manufacturing area are different.
For this reason, there has been a demand for a method that allows even a small or medium-sized circuit designer who does not have a board manufacturing department to easily create a circuit board.

Therefore, conventionally, a method of manufacturing a circuit board by a cutting method has been developed in which a computer-aided design device (hereinafter referred to as CAD) and an automatic cutting machine are connected. In this method, a circuit pattern is drawn on a CAD display, and this is connected to an automatic cutting machine 1 that is driven similarly to a plotter as shown in FIG. 6, and an insulating substrate 3 having copper 2 on its surface is connected thereto. The copper 2 on the surface is cut in a streak shape by a cutting drill 5 attached to a three-dimensional guide 4 that moves in the XYZ directions, and wiring 6 is formed as shown in FIG. As shown in FIG. 8, a through-hole pin 8 was fitted into the through-hole 7 and solder 9 was attached to the through-hole 7 for electrical connection with the wiring 6.

In combination with this CAD and the automatic cutting machine 1,
The method of cutting both sides of the insulating substrate 3 having copper 2 on its surface along the circuit pattern is simpler than the etching method and the substrate is easy to prepare, but as shown in FIG.
When two wires 6 of about mm are formed in parallel at a narrow interval of about 0.25 mm, the cutting drill 5 has a thin tip shape and is easily worn. Moreover, the position control of the three-dimensional guide 4 and the bending of the insulating substrate 3 are performed. However, there is a problem that the wiring 6 may be locally thinly cut and broken, and a high-density circuit pattern cannot be created as in the case of printing a circuit pattern by film exposure.

When the wiring 6 is formed by this cutting method, the copper 2 on both sides is cut to form the copper 2 in the central portion, so that it takes time to process and the through hole 7 is formed.
The fact is that the through-hole pin 8 is inserted into the place where the hole is formed and the connection is made with the solder 9 later, so that the process is complicated and the manufacturing of the board is not shortened.

[0007]

SUMMARY OF THE INVENTION The present invention eliminates the above-mentioned drawbacks, forms a circuit pattern by through holes and film exposure on a substrate in advance, and designates a cutting position on a CAD display, and an automatic cutting machine. A cutting method that allows you to easily create high-density circuit boards even by a circuit design department that does not have a board manufacturing department by cutting unnecessary wiring parts on the board and forming circuit patterns leaving only the necessary parts. A through-hole board and a method of manufacturing a printed circuit board using the same are provided.

[0008]

According to a first aspect of the present invention, a plurality of through holes are opened at equal intervals on the entire surface of an insulating substrate, and the through holes are arranged in a grid pattern in the vertical and horizontal directions. A cutting-type through-hole substrate, characterized in that main wiring is printed and printed, and sub-wirings connecting the printed through-hole land and the main wiring are radially printed.

Further, according to a second aspect of the present invention, a plurality of through holes are opened at equal intervals on the entire surface of the insulating substrate, and main wiring is printed and printed in a grid pattern in the vertical and horizontal directions between the through holes. A computer-aided design device that displays the circuit pattern of a cutting method through-hole board that radially prints the sub-wiring connecting the printed through-hole land and the main wiring, and a cutting drill. The automatic cutting machine is provided with a board fixing jig for fixing the cutting through-hole board below the three-dimensional guide that moves in the Z direction, and the circuit pattern of the cutting through-hole board displayed on the display is viewed. While setting the cutting position of the wiring, output this signal from the computer-aided design device to the automatic cutting machine, A main wiring printed printed serial through-hole substrate, a method for manufacturing a printed circuit board and forming a circuit by cutting an unnecessary portion of the auxiliary wiring at a cutting drill.

[0010]

A method for manufacturing a printed circuit board using the cutting through-hole board of the present invention will be described. First, the cutting through-hole board is set and fixed to the board fixing jig of the automatic cutting machine. Then, the circuit pattern is displayed on the CAD display in which the circuit pattern of the cutting-type through-hole substrate is programmed, and the desired cut points of the main wiring and the sub wiring are designated while observing the display. After forming the circuit in this way, output a signal to the automatic cutting machine and move the cutting drill by the three-dimensional guide based on the position signal of the cutting location to cut the main wiring and sub wiring at the specified position. The circuit pattern is formed by cutting off the wiring and leaving the wiring connecting the necessary through holes.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to FIGS. FIG. 1 shows a cutting type through-hole substrate 11. A plurality of through-holes 7 ... Are opened at equal intervals on the entire front and back surfaces of an insulating substrate 3, and two adjacent through-holes 7 ... The main wirings 12 ... Are printed in parallel in a matrix in the vertical and horizontal directions. Further, ring-shaped through-hole lands 14 are printed on the periphery of the opening of the through-holes 7.
The outer periphery of the main wiring 12 formed in a lattice shape surrounding the outer periphery of the ...
Four sub-wirings 13 that connect this to the intersection of
Are printed radially.

The manufacturing method of this cutting type through-hole substrate 11 is manufactured by a commonly used etching method. For example, copper 2 is first formed on the surface based on the circuit pattern of the substrate.
After the through hole 7 is opened in the insulating substrate 3 which is stretched, the inner wall surface of the through hole 7 is plated with copper, and then a photosensitive etching resist is provided on the surface. After this, I took a picture of the circuit pattern.After overlaying the film on the etching resist and exposing it and baking the circuit pattern,
After development, the copper 2 other than the pattern is melted to expose the insulating substrate 3. After that, the resist is peeled off, and then the circuit pattern shown in FIG.

An apparatus for manufacturing a desired circuit board using the cutting through-hole board 11 manufactured as described above will be described. As shown in FIG. 2, it comprises a CAD (Computer Aided Design Device) 15 and an automatic cutting machine 1 connected to it. The CAD 15 is configured so that the circuit pattern 10 of the cutting through-hole substrate 11 is programmed and displayed on the display 16 and the position signal of the cutting position displayed on the display 16 is output to the automatic cutting machine 1. ing.

The automatic cutting machine 1 is driven by a three-dimensional guide 4 which is driven in the same manner as a plotter to move in the XYZ directions.
A spindle 20 driven by a motor 19 is attached, and a cutting drill 5 is provided at the tip of this spindle 20. Below the cutting drill 5, there is a through-hole substrate 11 with a cutting method.
A board fixing jig 22 is provided to fix and position the board.

Next, a method of manufacturing a desired circuit board by using the cutting type through hole board 11 will be described. First, the cutting method through hole substrate 11 is set on the substrate fixing jig 22 of the automatic cutting machine 1 shown in FIG.
Next, the circuit pattern 10 is displayed on the display 16 of the CAD 15 in which the circuit pattern of the cutting method through-hole substrate 11 is programmed, and the desired cutting positions of the main wiring 12 and the sub wiring 13 are designated by key operation while observing the display 16. To go.

After a desired circuit is formed by designating a cutting position in this way, the circuit is stored in the CAD 15 and then a signal is output to the automatic cutting machine 1. In the automatic cutting machine 1, the cutting drill 5 is moved by the three-dimensional guide 4 based on the position signal of the cutting position, and the cutting drill 5 is rotated and lowered by the rotational force transmitted from the motor 19 to the spindle 20,
The main wiring 12 and the sub wiring 13 are cut to cut off the wiring.

As for the cutting point 23, when looking at one through-hole 7, as shown in FIG. 1, vertical and horizontal squares surrounding the through-hole 7 and the sub-wirings 13 radially formed from the through-hole land 14 formed around this. The main wiring 12 arranged in a shape and a space between the adjacent main wirings 12, 12 are cut into a circle.

For example, when connecting the through hole 7 in the upper right corner and the through hole 7 in the lower right corner in the figure as shown in FIG. 3, one main wiring line 12 in the vertical direction and diagonally connected to both ends thereof. The wiring can be connected by cutting the parts on both sides of the remaining main wiring 12 with the other sub wirings 13 ... In this way, the required through holes 7 and 7 are arbitrarily connected, and the unnecessary portion is cut off and the circuit is left as it is.

When the width of the main wiring 12 and the distance between the adjacent main wirings 12 are, for example, 0.25 mm in the state cut by the cutting drill 5 as described above, the main wiring printed in advance is printed. Since it is sufficient to cut 12 surely, the tip shape of the cutting drill 5 is about 0.25 mm to 0.35 mm thick even if the mounting accuracy due to the position control of the three-dimensional guide 4 or the bending of the insulating substrate 3 is slightly poor. A drill can be used, which increases the strength of the drill, reduces the wear of the tip, and has excellent durability.

FIG. 5 shows another embodiment of the present invention.
A plurality of through holes 7 are opened at equal intervals on the entire surface of the insulating substrate 3, and two main wirings 12 are printed in parallel in the vertical and horizontal directions between the through holes 7. Square through-hole lands 14 are printed on the periphery of the openings of the through-holes 7. Between the center of each side of the through-hole lands 14 and the grid-shaped main wirings 12 ... There are many printed sub-wirings 13 ...

In the above-described embodiment, the main wirings 12 are formed on both sides of the insulating substrate 3 in a grid pattern in the vertical and horizontal directions, but the main wirings 12 in the horizontal direction are formed on the upper surface of the insulating substrate 3.
, And the main wiring 12 in the vertical direction is formed on the lower surface to form a grid as a whole.

[0022]

As described above, according to the cutting method through-hole board and the method for manufacturing a printed circuit board using the same according to the present invention, a circuit pattern is formed on the board in advance by an etching method by through-hole and film exposure. Since there is no board manufacturing department, you can specify the cutting location on the CAD display, cut unnecessary wiring on the board with an automatic cutting machine, and form the circuit pattern leaving only the necessary area. The circuit design department can easily create a high-density circuit board. Moreover, since it is only necessary to cut the printed wiring in advance, it is possible to form a high-density circuit pattern even if the mounting accuracy is a little poor due to position control or board bending, or even if a cutting drill with a large tip outer shape is used. Both have excellent durability because the strength of the drill is large and the tip is not easily worn.

[Brief description of drawings]

FIG. 1 is a front view showing a cutting through-hole substrate according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an apparatus for manufacturing a printed circuit board according to the present invention.

FIG. 3 is a plan view showing a state in which through holes are connected by the cutting method through hole substrate shown in FIG.

FIG. 4 is a cross-sectional view showing a state in which a main wiring is cut by a cutting drill.

FIG. 5 is a plan view of a cutting type through hole substrate according to another embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a state in which copper is cut by a conventional cutting method to form a circuit.

7 is a sectional view of a circuit board on which a circuit is formed by the cutting method of FIG.

8 is a sectional view of the circuit board showing a state in which a through hole pin is fitted in the through hole of FIG.

9 is a plan view of a circuit board on which a circuit is formed by the cutting method of FIG.

[Explanation of sign]

 1 Automatic Cutting Machine 2 Copper 3 Insulation Board 4 3D Guide 5 Cutting Drill 6 Wiring 7 Through Hole 8 Through Hole Pin 10 Circuit Pattern 11 Cutting Method Through Hole Board 12 Main Wiring 13 Sub Wiring 14 Through Hole Land 15 CAD 16 Display 22 Board Fixing jig 23 Cutting point

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[Procedure amendment]

[Submission date] February 25, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0004

[Correction method] Change

[Correction content]

Therefore, conventionally, a method of manufacturing a circuit board by a cutting method has been developed in which a computer-aided design device (hereinafter referred to as CAD) and an automatic cutting machine are connected. In this method, a circuit pattern is drawn on a CAD display, and this is connected to an automatic cutting machine 1 which is driven similarly to a plotter as shown in FIG. The copper 2 on the surface is cut in a streak shape by a cutting drill 5 attached to a three-dimensional guide 4 which moves in the X, Y, and Z directions, and wiring 6 is formed as shown in FIG. As shown in FIG. 10, a through hole pin 8 was fitted into the through hole 7 and solder 9 was attached to the through hole 7 for electrical connection with the wiring 6.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction content]

In combination with this CAD and the automatic cutting machine 1,
The method of cutting the both sides of the insulating substrate 3 having the copper 2 on the surface along the circuit pattern is simpler than the etching method and the substrate can be easily prepared, but as shown in FIG.
When two wires 6 of about 25 mm are made in parallel at a narrow interval of about 0.25 mm, the cutting drill 5 has a thin tip shape and is easily worn. Also, the position control of the three-dimensional guide 4 and the insulating substrate 3 are performed.
There is a problem in that the wiring 6 may be locally finely cut and broken due to the mounting accuracy due to the bending of the wiring, and it is not possible to create a high-density circuit pattern such as the circuit pattern printing by film exposure. It was

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Change

[Correction content]

In the above embodiment, the main wirings 12 ... Are formed on both surfaces of the insulating substrate 3 in a grid pattern in the vertical and horizontal directions. However, as shown in FIG. 6, the main wirings in the horizontal direction are formed on the upper surface of the insulating substrate 3. 12 may be formed, and main wirings 12 in the vertical direction are formed on the lower surface of the insulating substrate 3 as shown in FIG.

[Procedure amendment 4]

[Document name to be amended] Statement

[Name of item to be corrected] Brief description of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a front view showing a cutting through-hole substrate according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an apparatus for manufacturing a printed circuit board according to the present invention.

FIG. 3 is a plan view showing a state in which through holes are connected by the cutting method through hole substrate shown in FIG.

FIG. 4 is a cross-sectional view showing a state in which a main wiring is cut by a cutting drill.

FIG. 5 is a plan view of a cutting type through hole substrate according to another embodiment of the present invention.

FIG. 6 is a plan view of a cutting type through hole substrate according to another embodiment of the present invention.

FIG. 7 is a bottom view of the cutting through-hole substrate of FIG.

FIG. 8 is a cross-sectional view showing a state where a circuit is formed by cutting copper by a conventional cutting method.

9 is a cross-sectional view of a circuit board on which a circuit is formed by the cutting method of FIG.

10 is a sectional view of the circuit board showing a state in which a through hole pin is fitted in the through hole of FIG.

11 is a plan view of a circuit board on which a circuit is formed by the cutting method of FIG.

[Explanation of signs] 1 Automatic cutting machine 2 Copper 3 Insulating board 4 Three-dimensional guide 5 Cutting drill 6 Wiring 7 Through hole 8 Through hole pin 10 Circuit pattern 11 Cutting method through hole board 12 Main wiring 13 Sub wiring 14 Through hole land 15 CAD 16 display 22 PCB fixing jig 23 Cutting point

[Procedure Amendment 5]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 6

[Correction method] Change

[Correction content]

[Figure 6]

[Procedure correction 6]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 7

[Correction method] Change

[Correction content]

[Figure 7]

[Procedure Amendment 7]

[Document name to be corrected] Drawing

[Correction target item name] Figure 8

[Correction method] Change

[Correction content]

[Figure 8]

[Procedure Amendment 8]

[Document name to be corrected] Drawing

[Correction target item name] Figure 9

[Correction method] Change

[Correction content]

[Figure 9]

[Procedure Amendment 9]

[Document name to be corrected] Drawing

[Name of item to be corrected] Fig. 10

[Correction method] Added

[Correction content]

[Figure 10]

[Procedure Amendment 10]

[Document name to be corrected] Drawing

[Name of item to be corrected] Fig. 11

[Correction method] Added

[Correction content]

FIG. 11

Claims (2)

[Claims] 1. A plurality of through holes are formed at equal intervals on the entire surface of an insulating substrate, and main wiring is printed in a grid pattern in the vertical and horizontal directions between these through holes, and printed through hole lands are formed. A cutting-type through-hole substrate, wherein sub-wirings connecting to the main wirings are radially printed and printed. 2. A plurality of through holes are formed at equal intervals on the entire surface of the insulating substrate, main wiring is printed and printed in a grid pattern in the vertical and horizontal directions between these through holes, and printed through hole lands are formed. A computer-aided design device for displaying the circuit pattern of a cutting-type through-hole board on which a sub-wiring connecting to the main wiring is radially printed and printed, and a three-dimensional machine for moving a cutting drill in X, Y, Z directions. It consists of an automatic cutting machine that has a board fixing jig that fixes the cutting through hole board below the guide, and sets the cutting position of the wiring while looking at the circuit pattern of the cutting through hole board displayed on the display. Then, this signal is output from the computer-aided design device to the automatic cutting machine, and the signal is output to the through-hole board. Main wiring printed with lint,
A method for manufacturing a printed circuit board, which comprises forming a circuit by cutting unnecessary portions of sub wiring with a cutting drill.