JPH05175260A - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor deviceInfo
- Publication number
- JPH05175260A JPH05175260A JP3356503A JP35650391A JPH05175260A JP H05175260 A JPH05175260 A JP H05175260A JP 3356503 A JP3356503 A JP 3356503A JP 35650391 A JP35650391 A JP 35650391A JP H05175260 A JPH05175260 A JP H05175260A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- sealing material
- semiconductor chips
- printing
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は半導体装置の製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device.
【０００２】[0002]
【従来の技術】半導体チップを回路基板上に実装する場
合、例えば図６に示すように、フリップチップボンディ
ング等により半導体チップ１のバンプ電極２を回路基板
３上の電極パッド（図示せず）に接続することにより、
半導体チップ１を回路基板３上に搭載し、この後、外周
雰囲気からの汚染や破損から半導体チップ１を保護する
ために、射出器４を用いたポッティング法により液状粘
稠性樹脂からなる封止材５を一定量滴下して半導体チッ
プ１を封止するようにしている。2. Description of the Related Art When a semiconductor chip is mounted on a circuit board, bump electrodes 2 of the semiconductor chip 1 are connected to electrode pads (not shown) on the circuit board 3 by flip chip bonding or the like, as shown in FIG. By connecting,
The semiconductor chip 1 is mounted on the circuit board 3, and thereafter, in order to protect the semiconductor chip 1 from contamination and damage from the outer peripheral atmosphere, a potting method using an injector 4 is used to seal the liquid viscous resin. A certain amount of the material 5 is dropped to seal the semiconductor chip 1.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
このような半導体装置の製造方法では、射出器４を用い
たポッティング法であるので、個々の半導体チップ１に
対して個別に処理することとなり、したがって特に回路
基板３上に半導体チップ１が複数搭載されている場合、
生産性が悪いという問題があった。また、半導体チップ
１と回路基板３との間に隙間があるため射出器４を用い
たポッティング法ではこの隙間に封止材５が進入してい
くことになり、このためこの隙間の空気を強制的に排除
することができず、この隙間に進入した封止材５中に気
泡が残存することがあり、ひいては耐湿性等の信頼性が
低下するという問題があった。この発明の目的は、生産
性を向上させることができ、また耐湿性等の信頼性を向
上させることのできる半導体装置の製造方法を提供する
ことにある。However, in the conventional method of manufacturing such a semiconductor device, since the potting method using the injector 4 is used, each semiconductor chip 1 is processed individually. Therefore, especially when a plurality of semiconductor chips 1 are mounted on the circuit board 3,
There was a problem of poor productivity. Further, since there is a gap between the semiconductor chip 1 and the circuit board 3, the potting method using the injector 4 causes the sealing material 5 to enter this gap, which forces the air in this gap. However, there is a problem that air bubbles may remain in the sealing material 5 that has entered this gap, and that reliability such as moisture resistance is reduced. An object of the present invention is to provide a method of manufacturing a semiconductor device capable of improving productivity and also improving reliability such as moisture resistance.
【０００４】[0004]
【課題を解決するための手段】請求項１記載の発明は、
回路基板上にフリップチップボンディング等により搭載
された複数の半導体チップを印刷マスクに形成された開
口部内に配置させた後、液状粘稠性樹脂からなる封止材
を印刷して前記半導体チップを封止するようにしたもの
である。請求項２記載の発明は、請求項１記載の発明に
おいて、回路基板の半導体チップと対応する部分に空気
逃げ孔を設けたものである。The invention according to claim 1 is
After placing a plurality of semiconductor chips mounted on the circuit board by flip chip bonding or the like in the opening formed in the print mask, a sealing material made of a liquid viscous resin is printed to seal the semiconductor chips. It was designed to stop. According to a second aspect of the invention, in the first aspect of the invention, an air escape hole is provided in a portion of the circuit board corresponding to the semiconductor chip.
【０００５】[0005]
【作用】請求項１記載の発明によれば、印刷用マスクを
用いて液状粘稠性樹脂からなる封止材を印刷して半導体
チップを封止しているので、回路基板上に半導体チップ
が複数搭載されていても、一度の印刷ですべての半導体
チップを封止することができ、したがって生産性を向上
させることができる。請求項２記載の発明によれば、回
路基板の半導体チップと対応する部分に空気逃げ孔を設
けているので、半導体チップと回路基板との間の隙間に
封止材が進入していく際、この隙間の空気を回路基板の
空気逃げ孔を介して強制的に排除することができ、した
がってこの隙間に進入した封止材中に気泡が残存しない
ようにすることができ、ひいては耐湿性等の信頼性を向
上させることができる。According to the first aspect of the invention, since the semiconductor chip is sealed by printing the sealing material made of the liquid viscous resin by using the printing mask, the semiconductor chip is mounted on the circuit board. Even if a plurality of semiconductor chips are mounted, all the semiconductor chips can be sealed by printing once, and therefore productivity can be improved. According to the invention of claim 2, since the air escape hole is provided in the portion of the circuit board corresponding to the semiconductor chip, when the sealing material enters the gap between the semiconductor chip and the circuit board, The air in this gap can be forcibly removed via the air escape hole of the circuit board, so that it is possible to prevent air bubbles from remaining in the sealing material that has entered this gap, which in turn prevents moisture resistance and the like. The reliability can be improved.
【０００６】[0006]
【実施例】図１はこの発明の半導体装置の製造方法で用
いられる封止材印刷機の一例の要部を示したものであ
る。この封止材印刷機は、回路基板１１を載置するため
の印刷用ステージ１２を備えている。回路基板１１の上
面の所定の４個所には、図２にも示すように、フリップ
チップボンディング等により半導体チップ１３のバンプ
電極１４が回路基板１１上の電極パッド（図示せず）に
接続されていることにより、４つの半導体チップ１３が
搭載されている。また、搭載された４つの半導体チップ
１３の各中央部に対応する部分における回路基板１１の
各所定の個所には、図２にも示すように、円形の空気逃
げ孔１５が設けられている。一方、回路基板１１の４つ
の空気逃げ孔１５に対応する部分における印刷用ステー
ジ１２の各所定の個所には、回路基板１１の空気逃げ孔
１５よりもある程度大径の空気逃げ孔１６が設けられて
いる。また、封止材印刷機には、液状粘稠性樹脂からな
る封止材１７を印刷するための印刷用マスク１８および
スキージ１９等が備えられている。このうち印刷用マス
ク１８は、図３にも示すように、回路基板１１上に搭載
された４つの半導体チップ１３と対応する部分に、半導
体チップ１３の外形よりもある程度大きめの方形状の開
口部２０が設けられた構造となっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an essential part of an example of an encapsulating material printing machine used in a method of manufacturing a semiconductor device according to the present invention. The encapsulating material printing machine includes a printing stage 12 on which a circuit board 11 is placed. As shown in FIG. 2, bump electrodes 14 of the semiconductor chip 13 are connected to electrode pads (not shown) on the circuit board 11 by flip chip bonding or the like at predetermined four positions on the upper surface of the circuit board 11. As a result, four semiconductor chips 13 are mounted. Further, as shown in FIG. 2, a circular air escape hole 15 is provided in each predetermined portion of the circuit board 11 in a portion corresponding to each central portion of the four mounted semiconductor chips 13. On the other hand, an air escape hole 16 having a diameter somewhat larger than that of the air escape hole 15 of the circuit board 11 is provided at each predetermined portion of the printing stage 12 in a portion corresponding to the four air escape holes 15 of the circuit board 11. ing. Further, the encapsulating material printing machine is provided with a printing mask 18, a squeegee 19 and the like for printing the encapsulating material 17 made of a liquid viscous resin. Of these, as shown in FIG. 3, the printing mask 18 has a rectangular opening, which is somewhat larger than the outer shape of the semiconductor chip 13, at a portion corresponding to the four semiconductor chips 13 mounted on the circuit board 11. 20 is provided.
【０００７】さて、この封止材印刷機を用いて回路基板
１１上に搭載された４つの半導体チップ１３を封止材１
７で封止する場合には、まず、回路基板１１を印刷用ス
テージ１２の上面に位置合わせして、つまり回路基板１
１の各空気逃げ孔１５が印刷用ステージ１２の各空気逃
げ孔１６の中央部に位置するようにして、載置する。次
に、印刷用マスク１８を回路基板１１の上面に位置合わ
せして、つまり印刷用マスク１８の各開口部２０内の中
央部に各半導体チップ１３が位置するようにして、載置
する。次に、スキージ１９で液状粘稠性樹脂からなる封
止材１７を印刷用マスク１８の各開口部２０内に印刷す
る。すると、印刷された液状粘稠性樹脂からなる封止材
１７は、印刷用マスク１８の開口部２０の壁面と半導体
チップ１３の外側面との間の隙間を通って半導体チップ
１３と回路基板１１との間の隙間に進入しながら、これ
らの隙間の空気をすべて回路基板１１の空気逃げ孔１６
を介して印刷用ステージ１２の空気逃げ孔１６内に強制
的に排除し、印刷用マスク１８の開口部２０の壁面と半
導体チップ１３の外側面との間の隙間および半導体チッ
プ１３と回路基板１１との間の隙間に順次充満された
後、回路基板１１の空気逃げ孔１６内に進入する。そし
て、印刷された液状粘稠性樹脂からなる封止材１７が硬
化すると、図４に示すように、この硬化した封止材１７
によって半導体チップ１３が封止されることになる。Now, using this encapsulant printer, the four semiconductor chips 13 mounted on the circuit board 11 are encapsulated with the encapsulant 1.
In the case of sealing with 7, the circuit board 11 is first aligned with the upper surface of the printing stage 12, that is, the circuit board 1
The air escape holes 15 of No. 1 are placed so that they are located at the central portions of the air escape holes 16 of the printing stage 12. Next, the printing mask 18 is aligned with the upper surface of the circuit board 11, that is, each semiconductor chip 13 is placed in the center of each opening 20 of the printing mask 18 and placed. Next, the squeegee 19 prints the sealing material 17 made of a liquid viscous resin in each opening 20 of the printing mask 18. Then, the printed sealing material 17 made of a liquid viscous resin passes through the gap between the wall surface of the opening 20 of the printing mask 18 and the outer surface of the semiconductor chip 13 and the semiconductor chip 13 and the circuit board 11. All the air in these gaps is introduced into the gap between the circuit board 11 and the air escape hole 16 of the circuit board 11.
Is forcedly removed into the air escape hole 16 of the printing stage 12 via the gap between the wall surface of the opening 20 of the printing mask 18 and the outer surface of the semiconductor chip 13 and the semiconductor chip 13 and the circuit board 11. After being filled in the gap between and, it enters into the air escape hole 16 of the circuit board 11. Then, when the printed sealing material 17 made of the liquid viscous resin is cured, the cured sealing material 17 is cured as shown in FIG.
Thus, the semiconductor chip 13 is sealed.
【０００８】このように、この半導体装置の製造方法で
は、印刷用マスク１８を用いて液状粘稠性樹脂からなる
封止材１７を印刷して半導体チップ１３を封止している
ので、回路基板１１上に半導体チップ１３が複数搭載さ
れていても、一度の印刷ですべての半導体チップ１３を
封止することができ、したがって生産性を向上させるこ
とができる。また、回路基板１１の半導体チップ１３と
対応する部分に空気逃げ孔１５を設けているので、半導
体チップ１３と回路基板１１との間の隙間に封止材１７
が進入していく際、この隙間の空気を回路基板１１の空
気逃げ孔１５を介して強制的に排除することができ、し
たがってこの隙間に進入した封止材１７中に気泡が残存
しないようにすることができ、ひいては耐湿性等の信頼
性を向上させることができる。As described above, in this method of manufacturing a semiconductor device, the semiconductor chip 13 is encapsulated by printing the encapsulating material 17 made of a liquid viscous resin using the printing mask 18, and thus the circuit board is formed. Even if a plurality of semiconductor chips 13 are mounted on the substrate 11, all the semiconductor chips 13 can be sealed by printing once, and therefore productivity can be improved. Further, since the air escape hole 15 is provided in the portion of the circuit board 11 corresponding to the semiconductor chip 13, the sealing material 17 is provided in the gap between the semiconductor chip 13 and the circuit board 11.
When entering, the air in this gap can be forcibly removed via the air escape hole 15 of the circuit board 11, so that no air bubbles remain in the sealing material 17 entering this gap. Therefore, it is possible to improve reliability such as moisture resistance.
【０００９】なお、上記実施例では、図３にも示すよう
に、印刷用マスク１８として、回路基板１１上に搭載さ
れた４つの半導体チップ１３と対応する部分に、半導体
チップ１３の外形よりもある程度大きめの方形状の開口
部２０が設けられたものを用いているが、回路基板１１
上に実装される他の電子部品に支障を来さない場合に
は、図５に示すように、４つの半導体チップ１３の搭載
エリアよりもある程度大きめの１つの方形状の開口部２
１が設けられたものを用いるようにしてもよい。また、
印刷用ステージ１２の空気逃げ孔１６をチューブを介し
て真空ポンプに連結し、封止材１７を印刷するとき、回
路基板１１の空気逃げ孔１５を真空ポンプで吸引するよ
うにしてもよい。このときは、封止材１７を印刷すると
き、半導体チップ１３と回路基板１１との間の隙間の空
気を回路基板１１の空気逃げ孔１５を介して強制的に排
除することができるので、半導体チップ１３と回路基板
１１との間の隙間に封止材１７を進入させやすく、この
ため封止材１７の材料として高粘度樹脂を使用すること
もできる。さらに、印刷用ステージ１２にヒータを取り
付け、例えば高粘度樹脂からなる封止材１７を印刷する
とき、ヒータにより回路基板１１を介して封止材１７を
加熱し、これにより封止材１７の粘度を下げてもよい。In the above-described embodiment, as shown in FIG. 3, a portion of the printing mask 18 corresponding to the four semiconductor chips 13 mounted on the circuit board 11 has a size larger than that of the semiconductor chip 13. A circuit board 11 is used which has a rectangular opening 20 which is rather large.
As shown in FIG. 5, one square-shaped opening 2 that is somewhat larger than the mounting area of the four semiconductor chips 13 is provided if it does not interfere with other electronic components mounted on the upper side.
You may make it use what was provided with 1. Also,
The air escape hole 16 of the printing stage 12 may be connected to a vacuum pump via a tube, and the air escape hole 15 of the circuit board 11 may be sucked by the vacuum pump when the sealing material 17 is printed. At this time, when the sealing material 17 is printed, the air in the gap between the semiconductor chip 13 and the circuit board 11 can be forcibly removed via the air escape hole 15 of the circuit board 11. The sealing material 17 easily enters the gap between the chip 13 and the circuit board 11. Therefore, a high-viscosity resin can be used as the material of the sealing material 17. Further, when a heater is attached to the printing stage 12 to print the encapsulant 17 made of, for example, a high-viscosity resin, the heater heats the encapsulant 17 via the circuit board 11, thereby increasing the viscosity of the encapsulant 17. May be lowered.
【００１０】[0010]
【発明の効果】以上説明したように、請求項１記載の発
明によれば、印刷用マスクを用いて液状粘稠性樹脂から
なる封止材を印刷して半導体チップを封止しているの
で、回路基板上に半導体チップが複数搭載されていて
も、一度の印刷ですべての半導体チップを封止すること
ができ、したがって生産性を向上させることができる。
また、請求項２記載の発明によれば、回路基板の半導体
チップと対応する部分に空気逃げ孔を設けているので、
半導体チップと回路基板との間の隙間に封止材が進入し
ていく際、この隙間の空気を回路基板の空気逃げ孔を介
して強制的に排除することができ、したがってこの隙間
に進入した封止材中に気泡が残存しないようにすること
ができ、ひいては耐湿性等の信頼性を向上させることが
できる。As described above, according to the first aspect of the invention, the semiconductor chip is encapsulated by printing the encapsulating material made of the liquid viscous resin using the printing mask. Even if a plurality of semiconductor chips are mounted on the circuit board, it is possible to seal all the semiconductor chips by printing once, thus improving productivity.
Further, according to the invention of claim 2, since the air escape hole is provided in a portion of the circuit board corresponding to the semiconductor chip,
When the sealing material enters the gap between the semiconductor chip and the circuit board, the air in this gap can be forcibly removed through the air escape hole of the circuit board, and therefore, it entered the gap. It is possible to prevent bubbles from remaining in the encapsulant, and thus improve reliability such as moisture resistance.
【図１】この発明の半導体装置の製造方法で用いられる
封止材印刷機の一例の要部を示す断面図。FIG. 1 is a sectional view showing a main part of an example of an encapsulating material printing machine used in a method of manufacturing a semiconductor device according to the present invention.
【図２】回路基板およびこれに搭載された半導体チップ
の平面図。FIG. 2 is a plan view of a circuit board and a semiconductor chip mounted on the circuit board.
【図３】印刷用マスクの平面図。FIG. 3 is a plan view of a printing mask.
【図４】封止材で封止した状態の断面図。FIG. 4 is a cross-sectional view of a state in which a sealing material is used for sealing.
【図５】印刷用マスクの他の例の平面図。FIG. 5 is a plan view of another example of the printing mask.
【図６】従来の半導体装置の製造方法の一例を説明する
ために示す断面図。FIG. 6 is a cross-sectional view shown for explaining an example of a conventional method for manufacturing a semiconductor device.
１１ 回路基板 １２ 印刷用ステージ １３ 半導体チップ １５、１６ 空気逃げ孔 １７ 封止材 １８ 印刷用マスク １９ スキージ 11 Circuit Board 12 Printing Stage 13 Semiconductor Chips 15 and 16 Air Evacuation Hole 17 Sealing Material 18 Printing Mask 19 Squeegee
Claims (4)
グ等により搭載された複数の半導体チップを印刷マスク
に形成された開口部内に配置させた後、液状粘稠性樹脂
からなる封止材を印刷して前記半導体チップを封止する
ことを特徴とする半導体装置の製造方法。1. A plurality of semiconductor chips mounted on a circuit board by flip chip bonding or the like are arranged in an opening formed in a print mask, and a sealing material made of a liquid viscous resin is printed. A method of manufacturing a semiconductor device, which comprises encapsulating the semiconductor chip.
する部分には空気逃げ孔が設けられていることを特徴と
する請求項１記載の半導体装置の製造方法。2. The method of manufacturing a semiconductor device according to claim 1, wherein an air escape hole is provided in a portion of the circuit board corresponding to the semiconductor chip.
の空気逃げ孔を真空ポンプで吸引することを特徴とする
請求項２記載の半導体装置の製造方法。3. The method for manufacturing a semiconductor device according to claim 2, wherein when printing the encapsulating material, the air escape holes of the circuit board are sucked by a vacuum pump.
を加熱することを特徴とする請求項１記載の半導体装置
の製造方法。4. The method of manufacturing a semiconductor device according to claim 1, wherein the circuit board is heated when the sealing material is printed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3356503A JPH05175260A (en) | 1991-12-25 | 1991-12-25 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3356503A JPH05175260A (en) | 1991-12-25 | 1991-12-25 | Manufacturing method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05175260A true JPH05175260A (en) | 1993-07-13 |
Family
ID=18449347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3356503A Pending JPH05175260A (en) | 1991-12-25 | 1991-12-25 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05175260A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6770547B1 (en) * | 1999-10-29 | 2004-08-03 | Renesas Technology Corporation | Method for producing a semiconductor device |
| US6805541B1 (en) | 1999-02-15 | 2004-10-19 | Kabushiki Kaisha Toshiba | Resin encapsulating apparatus used in a manufacture of a semiconductor device |
-
1991
- 1991-12-25 JP JP3356503A patent/JPH05175260A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6805541B1 (en) | 1999-02-15 | 2004-10-19 | Kabushiki Kaisha Toshiba | Resin encapsulating apparatus used in a manufacture of a semiconductor device |
| US6770547B1 (en) * | 1999-10-29 | 2004-08-03 | Renesas Technology Corporation | Method for producing a semiconductor device |
| US7057283B2 (en) | 1999-10-29 | 2006-06-06 | Hitachi, Ltd. | Semiconductor device and method for producing the same |
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