JP2007103973A - Electronic part, electronic part raw material and method of manufacturing electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive, small, and highly reliable leadless package type electronic part, electronic part raw material for manufacturing the electronic part and a method of manufacturing the same. <P>SOLUTION: A leadless package type electronic part has a square substrate 6 provided with a plurality of external electrodes 7 in circumference, an element component 1 mounted on the surface of the substrate 6 under the condition of being electrically connected with the outer electrodes 7, and mold resin 5, with which the element component 1 is molded on the surface of the substrate 6. The surface of the mold resin 5 is flatly formed, and each side surface of the mold resin 5 is formed to be flush with the substrate 6. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component in which an IC chip, an LSI, or the like is mounted on a printed board for use in, for example, a consumer / industrial electronic device, an electronic component material, and an electronic component manufacturing method.

  In recent years, due to remarkable progress in electronics technology, various consumer and industrial electronic devices are rapidly becoming smaller, lighter, thinner and higher performance. Therefore, in order to achieve higher density and higher speed in order to cope with the increase in circuit scale and the increase in electronic parts to be used, the printed circuit board is made thinner and finer, the multilayer structure is adopted, and the electronic parts are downsized. Various mounting techniques for connecting electronic components have been developed. In particular, a chip carrier type electronic component as shown in FIG. 14 is conventionally known as a technique for connecting an IC chip, an LSI or the like to a substrate.

  FIG. 14A is a plan view of a chip carrier type electronic component as viewed from the surface side on which a semiconductor element is mounted. Moreover, FIG.14 (b) is the sectional view on the AA 'line of Fig.14 (a). As shown in FIG. 14B, this electronic component is obtained by die-attaching a semiconductor element 1 onto a substrate 6 that has been cut in a shape that passes in the vicinity of the axial center of the through hole 7 in advance. The wiring pattern 3 is formed by electrically connecting with the wire 2. The wiring pattern 3 is connected to a through hole (external electrode) 7 and a connection land 8 provided on the back surface of the substrate 6. The mother board (not shown) is connected to the through hole 7 and the connection land by normal soldering. 8 is connected. The substrate 6 is usually a printed circuit board, but a ceramic substrate may be used. The semiconductor element 1 die-attached on the substrate 6 is connected to the wiring pattern 3 by wire bonding and then molded with a molding resin 5.

  A mold frame 4 constituting a dam is provided on the peripheral edge of the surface of the substrate 6, and the mold resin 5 is stacked up to the height of the semiconductor element 1 by the mold frame 4, and the mold resin 5 is fed from the through hole 7. It does not flow into the back surface of the substrate 6. When the mold frame 4 is not used, for the same reason, the substrate 6 is designed so that the through hole 7 is kept away from the semiconductor element 1, and the mold resin 5 is also highly thixotropic (thickness ratio is large = Adopted a resin with a little resin flow and good swell.

  However, in the above-described conventional chip carrier type electronic component, since it is necessary to form the mold frame 4 on the substrate 6, an increase in the cost of forming the frame is unavoidable, and the chip frame type is equivalent to the chip frame type. There was a problem that the size of the electronic component would increase.

  Further, when the mold frame 4 is not used, it is necessary to keep the through hole 7 away from the semiconductor element 1, so that the size of the chip carrier type electronic component becomes large and the mold resin 5 having high thixotropy, that is, flow Since it is necessary to use a molding material having poor properties, it becomes difficult for the mold resin 5 to wrap around the gap in the vicinity of the semiconductor element 1 and an unfilled portion of the mold resin 5 is generated, and the reliability of the chip carrier type electronic component Has the problem of lowering.

  Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide an inexpensive, small and reliable leadless package type electronic component, and an electronic component material and a manufacturing method for manufacturing the electronic component. The purpose is that.

  In order to solve the above problems, the electronic component of the present invention is characterized by having the following means. Here, the component parts placed on the following substrate is a concept including an active element typified by a semiconductor element and a so-called passive element such as an inductance element and a capacitive element.

  The electronic component according to claim 1 is a rectangular substrate having a plurality of external electrodes around it, an element component mounted on the surface of the substrate in a state of being electrically connected to the external electrode, and an element component on the surface of the substrate. In a leadless package type electronic component including a mold resin molded in a mold, the mold resin surface is formed flat and each side surface of the mold resin is formed flush with each side surface of the substrate. Features.

  In the electronic component according to claim 1, it is preferable that the external electrode is formed by cutting a through hole in an axial direction.

  In the electronic component according to claim 2, it is preferable that the external electrode is filled with a conductive paste or a metal material having solder wettability.

  In the electronic component according to claim 4, it is preferable that the metal material is solder or gold.

  The electronic component according to claim 2, further comprising a covering member that closes an opening on the mold resin side of the external electrode, the covering member being molded on the surface of the substrate with the mold resin, It is preferable that the end surface be formed flush with the side surfaces of the mold resin and the substrate.

  Preferably, the electronic component according to claim 7 further includes a pad made of the same material as that of the covering member between the substrate and the component component.

  9. The electronic component according to claim 8, wherein the pad has a through-hole penetrating the covering member in the front and back direction, and the through-hole includes a conductive member that conducts between the component part and the wiring region of the substrate. It is preferable.

  In the electronic component according to claim 7, 8 or 9, the covering member is preferably an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate.

  In the electronic component according to any one of claims 1 to 13, it is preferable that the external electrode is provided at a corner of the substrate.

  The electronic component material according to claim 15 surrounds a through-hole in which an external electrode is formed by cutting along a line substantially passing through the axis center on a substrate material arranged on a lattice-like virtual line and a virtual line of the substrate material It is characterized by comprising an element part mounted in the region and a mold resin poured over the entire surface of the substrate material so as to mold the element part.

  The electronic component material according to claim 15 is preferably further provided with a dam at the peripheral edge portion of the substrate material for preventing the poured mold resin from flowing out.

  In the electronic component material according to claim 15 or 16, it is preferable that the substrate material further includes a plating lead connected to each through hole.

  In the electronic component material according to claim 17, it is preferable that the plating leads are disposed on both the front and back surfaces of the substrate material.

  The electronic component material according to any one of claims 15 to 18, wherein each through hole is filled with a conductive paste or a metal material having solder wettability.

  The electronic component material according to claim 20, wherein the metal material is preferably solder or gold.

  It is preferable that the electronic component material according to any one of claims 15 to 18 further includes a covering material molded in a molding resin while closing an opening of each through hole on a surface of the substrate material.

  In the electronic component material according to claim 23, it is preferable that a pad made of the same material as the covering material is further provided between the substrate material and each component.

  The electronic component material according to claim 23 or 24, wherein the covering material is preferably an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate.

  29. The electronic component material according to any one of claims 15 to 28, wherein the through holes are preferably arranged at intersections of lattice-like virtual lines.

  The method of manufacturing an electronic component according to claim 30, wherein a substrate manufacturing step of forming a through hole in which an external electrode is formed by cutting along a line substantially passing through an axis along a lattice-like virtual line in a substrate material, Mounting process for mounting element parts in the area surrounded by imaginary lines of board material, connection process for electrically connecting element parts and corresponding through-holes, and pouring mold resin over the entire surface of board material And a cutting step of cutting the substrate material, the mold resin and the through hole along a virtual line after the mold resin is cured.

  The method for manufacturing an electronic component according to claim 30, further comprising a dam forming step of forming a dam for preventing the poured mold resin from flowing out at a peripheral portion of the substrate material prior to the molding step.

  In the method of manufacturing an electronic component according to claim 31 or 32, it is preferable to use a jig for holding the substrate material horizontally and to cure the mold resin in a state where the substrate material is held horizontally by the jig.

  In the method of manufacturing an electronic component according to claim 32, it is preferable that the mold resin to be poured is controlled by weight.

  34. The method of manufacturing an electronic component according to claim 30, further comprising a filling step of filling each through hole with a conductive paste prior to the molding step.

  In the method of manufacturing an electronic component according to claim 34, it is preferable that the filling step is performed by filling each through hole with a conductive paste and then heat-curing it.

  34. The electronic component manufacturing method according to claim 30, further comprising a filling step of filling each through hole with a metal material having solder wettability prior to the molding step.

  37. The method of manufacturing an electronic component according to claim 36, wherein the metal material is solder, and the filling step is preferably performed by filling each through hole with solder paste and then heating and melting it.

  37. The electronic component manufacturing method according to claim 36, wherein the metal material is solder, and the filling step is preferably performed by bringing the opening of the through hole into contact with the melted and waved solder.

  The method of manufacturing an electronic component according to claim 36, wherein the metal material is solder, and the filling step is performed by immersing the substrate material in molten solder after masking a portion of the substrate material excluding the opening of the through hole. Preferably, it is done.

  The electronic component manufacturing method according to claim 36, wherein the filling step is preferably performed by plating the through hole thickly.

  34. The method of manufacturing an electronic component according to claim 30, wherein the molding resin is hardened before the molding step, and a closing step of closing each through hole opening in the back surface of the substrate material using a closing member. After that, it is preferable to further include an opening step of removing the closing member.

  In the method for manufacturing an electronic component according to claim 41, the closing member is a non-adhesive flat plate member that can cover the entire back surface of the substrate material, and the closing step is performed by pressing the flat plate member against the back surface of the substrate material. Preferably, it is done.

  In the method of manufacturing an electronic component according to claim 42, it is preferable that the flat plate member is silicone rubber.

  42. The electronic component manufacturing method according to claim 41, wherein the closing member is an adhesive sheet that can cover the entire back surface of the substrate material, and the closing step is performed by sticking the sheet to the back surface of the substrate material. Is preferred.

  45. The method of manufacturing an electronic component according to claim 44, wherein the sheet is an ultraviolet curable sheet whose adhesiveness is reduced by irradiation with ultraviolet rays, and the ultraviolet curable sheet is preferably irradiated with ultraviolet rays between the closing step and the opening step. .

  45. The method of manufacturing an electronic component according to claim 44, wherein the sheet is a thermosetting sheet whose adhesiveness is reduced by heating, and the thermosetting sheet is preferably heated between the closing step and the opening step.

  42. The method of manufacturing an electronic component according to claim 41, wherein the closing member is a soluble resin that dissolves in an alkaline aqueous solution, and the closing step is performed by pouring and dissolving the soluble resin in each through hole, and an opening step. Is preferably performed by washing away the soluble resin with an aqueous alkaline solution.

  34. The method of manufacturing an electronic component according to claim 30, further comprising a covering step of attaching a covering material that closes an opening of each through hole to the surface of the substrate material prior to the molding step. preferable.

  49. The electronic component manufacturing method according to claim 48, wherein the covering material is an adhesive sheet, and the covering step is preferably performed by adhering the sheet to the surface of the substrate material.

  49. The electronic component manufacturing method according to claim 48, wherein the covering member is a dry film, and the covering step is preferably performed by sticking the dry film on the surface of the substrate material.

  49. The method of manufacturing an electronic component according to claim 48, wherein the covering member is a glass epoxy molded plate, and the covering step is preferably performed by adhering the molded plate to the surface of the substrate material.

  49. The electronic component manufacturing method according to claim 48, wherein the covering member is a glass epoxy prepreg, and the covering step is preferably performed by heat-pressing the prepreg on the surface of the substrate material.

  49. The electronic component manufacturing method according to claim 48, wherein the covering member is a ceramic forming plate, and the covering step is preferably performed by adhering the forming plate to the surface of the substrate material.

  49. The electronic component manufacturing method according to claim 48, wherein the covering member is a ceramic green sheet, and the covering step is preferably performed by thermocompression bonding the green sheet to the surface of the substrate material.

  55. The method of manufacturing an electronic component according to claim 30, wherein a step of attaching a plane holding means for holding the flatness of the substrate material to the substrate material prior to the molding step, and a step of cutting after curing of the mold resin It is preferable to further include a step of removing the plane holding means before the step.

  55. In the method of manufacturing an electronic component according to claim 55, it is preferable that the substrate material is heated and gradually cooled after the mold resin is cured and before the plane holding means is removed.

  55. The method of manufacturing an electronic component according to claim 30, wherein a step of attaching a plane holding means for holding the flatness of the substrate material to the substrate material after the mold resin is cured and before the cutting step; It is preferable to further include a step of heating and gradually cooling the material and a step of removing the plane holding means.

  The method of manufacturing an electronic component according to claim 55, 56, or 57, wherein the plane holding means includes a plane holding plate applied to the back side of the substrate material, and a clamping member that holds the plane holding plate and the substrate material together. It is preferable to be configured.

  In the method of manufacturing an electronic component according to any one of claims 30 to 58, it is preferable that a plating lead connected to each through hole is integrally formed in the substrate material together with the through hole in the substrate manufacturing step.

  60. In the method of manufacturing an electronic component according to claim 59, prior to the cutting step, the substrate material and the mold resin are cut and the plating lead is separated from the through hole, and the subsequent electrical inspection of the component parts is performed. It is preferable to further include an inspection step.

  The electronic component manufacturing method according to claim 60, wherein the cutting in the half-cutting step is preferably performed along a virtual line.

62. The method of manufacturing an electronic component according to claim 30, further comprising a step of attaching an adhesive sheet to one side of the substrate material prior to the cutting step, and the cutting step completely cuts the sheet. It is preferable that this is done without any problems.
(Function)

  According to the electronic component of the first aspect, since the surface of the mold resin is formed flat, the entire thickness can be made constant. Further, since each side surface of the mold resin is formed flush with each side surface of the substrate, there is no waste of space due to a dam or the like, and the entire planar shape can be formed small.

  According to the electronic component of claim 2, the external electrode is formed by cutting the through hole in the axial direction. For example, if the external electrode is not filled with solder or the like, the external electrode is used as a positioning hole for the probe pin. By using it, electrical inspection becomes easy.

  According to the electronic components of claims 3 and 4, when the external electrode is filled with a conductive paste or a metal material having solder wettability, the handleability is improved, and when soldering to a motherboard or the like In addition, a fillet is easily formed at the lower part of the external electrode on the mother board side, and solderability can be improved. Also, in the molding process, the mold resin does not flow into the external electrode, facilitating the production, omitting members corresponding to conventional dams, and arranging the component parts and the external electrode close to each other. can do. For this reason, while being able to reduce manufacturing cost, the whole can be formed compactly. Moreover, it is possible to use a mold material having low thixotropy, that is, good wraparound.

  According to the electronic components of the fifth and sixth aspects, by using solder or gold as the metal material, it is possible to further improve the solderability to a mother board or the like.

  According to the electronic component of the seventh aspect, the covering member for closing the opening on the mold resin side of the external electrode is provided, and the side end surface of the covering member is formed flush with the side surface of the mold resin and the substrate. Thus, as in the second and third aspects, in the molding step, the molding resin does not flow into the external electrode, the manufacturing cost can be reduced, and the whole can be formed compactly. Moreover, a mold material with low thixotropy can be used.

  According to the electronic component of the eighth aspect, by providing the same pad as the covering member between the substrate and the component component, the component component can be mounted using the pad as a positioning target. In addition, it is possible to prevent a problem such that the end of the element part is mounted on the covering member and the element part is mounted in an inclined state.

  According to the electronic component of claim 9, by forming a through hole in the pad and making the through hole contain a conductive member, in the element component that requires the die pad, the element component and the die pad are electrically connected, The same potential can be obtained.

  According to the electronic component of the tenth to thirteenth aspects, the covering member is made of an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate, so that processing and attachment can be easily performed. In particular, in the case of a dry film or the like, a photo process used in a substrate manufacturing process can be applied, and further processing and attachment can be easily performed.

  According to the electronic component of the fourteenth aspect, since the external electrode is provided at the corner portion of the substrate, the printed pattern of the substrate can be distributed and arranged, and the corner portion of the substrate that tends to be a dead space is formed. It can be used effectively. As a result, the print pattern can be optimized and the entire space can be compactly formed because dead space is eliminated.

  According to the electronic component material of claim 15, a leadless electronic component in which element components are mounted and molded is formed on a substrate having external electrodes around by cutting the material along a virtual line. be able to. In this cut-out electronic component, each side surface of the mold resin and each side surface of the substrate are flush with each other, and an electronic component similar to the second aspect can be manufactured. In this case, an electronic component material that can cut out one electronic component may be used, but an electronic device that can cut out a large number of electronic components by incorporating a large number of electronic component elements in a lattice shape like a semiconductor wafer. It is preferable to use a component material. In this way, it is possible to easily and quickly manufacture a compact electronic component.

  According to the electronic component material of the sixteenth aspect, by providing a dam at the peripheral portion of the substrate material, it is possible to prevent the mold resin from flowing out of the substrate material in the molding process, and the mold resin is poured (applied). Can be performed efficiently, and a molding material with low thixotropy can be used.

  According to the electronic component material of the seventeenth aspect, by further providing a plating lead, a plurality of electronic component elements can be plated in a lump. At this time, since the electronic component elements are arranged in an intensive manner, plating unevenness and waste can be reduced.

  According to the electronic component material of the eighteenth aspect, since the plating leads are arranged on both the front and back surfaces of the substrate material, localization of the plating current is suppressed, and the plating thickness can be made constant in the entire area.

  According to the electronic component material of claims 19 and 20, a plurality of electronic component elements can be obtained by filling a through hole with a conductive paste or a metal material having solder wettability by a printing process or a plating process in the board manufacturing technology. The metal material can be filled at once, and the molding resin does not flow into the through hole in the molding process, and the manufacturing is facilitated. And the through-hole (external electrode) of the cut-out electronic component is filled with said metal material, and the electronic component similar to Claim 3 or 4 can be manufactured.

  According to the electronic component material of claims 21 and 22, by using solder or gold for the metal material, the cut-out electronic component is made an electronic component with good solderability as in the case of claims 5 and 6. be able to.

  According to the electronic component material of claim 23, by providing the covering material that closes the opening portion of the through hole on the surface of the substrate material, it is possible to provide the covering material collectively to a plurality of electronic component elements. In the molding process, the mold resin does not flow into the through hole, and the manufacturing becomes easy. Moreover, the cut-out electronic component can be the same electronic component as in the seventh aspect.

  According to the electronic component material of the twenty-fourth aspect, by providing the same pad as the covering material between the substrate material and each component, it is possible to facilitate the attachment of the pad and improve the yield. it can. Further, the cut-out electronic component can be the same electronic component as in the eighth aspect.

  According to the electronic component material of claims 25 to 28, the covering material can be made of an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate, so that processing and attachment can be easily performed, and The cut out electronic component can be the same electronic component as in the tenth to thirteenth aspects.

  According to the electronic component material of claim 29, the through-hole (external electrode) is provided at the corner of the substrate by providing the through-hole at the intersection of the lattice-like virtual lines. It can be set as the same electronic component.

  According to the electronic component manufacturing method of claim 30, when the mold resin is cured through the substrate manufacturing process, the mounting process, the connection process, and the molding process, the electronic component material similar to that of claim 15 is formed, and the cutting process is further performed. Through this process, the same electronic component as in claim 2 is cut out. For this reason, if a large number of electronic component elements are built in the electronic component material, a large number of electronic components can be manufactured at once. Moreover, the side surface of the mold resin and the side surface of the substrate of each electronic component can be formed completely flush by cutting. The cutting position (line) may be on the virtual line as long as it is along the virtual line, or may be slightly off the virtual line. The cutting method is preferably dicing, but may be braking or the like.

  According to the electronic component manufacturing method of claim 31, by forming a dam in the peripheral portion of the substrate material prior to the molding step, it is possible to prevent the mold resin from flowing out of the substrate material. Casting (coating) can be performed efficiently, and a mold material with low thixotropy can be used. Further, the mold resin can be uniformly applied.

  According to the electronic component manufacturing method of the thirty-second aspect, the mold resin can be applied more uniformly by curing the mold resin in a state where the substrate material is held horizontally using a jig.

  According to the method for manufacturing an electronic component of claim 33, by controlling the mold resin to be poured by weight, the thickness accuracy of the mold resin is markedly improved compared to the conventional method of managing by the discharge time from the supply device. As a result, the thickness of the electronic component can be managed with high accuracy.

  According to the electronic component manufacturing method of claims 34 and 35, an electronic component material similar to that of claim 18 can be formed by filling the through holes with a conductive paste prior to the molding step. By cutting, an electronic component similar to the third aspect can be manufactured.

  According to the electronic component manufacturing method of claim 36, by filling the through hole with a metal material having solder wettability prior to the molding step, an electronic component material similar to claim 19 can be formed, Further, by cutting this, an electronic component similar to the fourth aspect can be manufactured.

  According to the electronic component manufacturing method of the thirty-seventh aspect, after the solder paste is filled into the through hole, the through hole is filled with the solder by heating and melting it. In this method, a substrate manufacturing technique using a stencil, a dry film, or the like can be applied, so that solder can be filled accurately and easily.

  According to the electronic component manufacturing method of the thirty-eighth aspect, by bringing the opening portion of the through hole into contact with the melted and waved solder, the solder enters the through hole by a capillary phenomenon and is filled. In this method, the solder can be quickly filled, and the solder for mounting on the mother board can be supplied to the electronic component in advance.

  According to the electronic component manufacturing method of claim 39, after masking the substrate material, the solder is infiltrated into molten solder so that the solder penetrates only into the through hole and is filled therein. In this method, solder can be filled accurately and easily. If the method of claim 38 is used in combination, solder can be filled accurately and quickly.

  According to the method for manufacturing an electronic component of claim 40, by plating the through hole thickly, the inside of the through hole is filled with the plating, and the through hole is filled with the plating material. In this method, the plating process on the printed pattern of the substrate material can be used together, and the solder can be filled very easily.

  According to the electronic component manufacturing method of claim 41, prior to the molding step, the closing step of closing the opening of the through hole opened on the back surface of the substrate material using the closing member, and the sealing after the mold resin is cured In the molding process, air is sealed in each through hole, and the mold resin is prevented from entering the through hole. For this reason, it is possible to prevent the mold resin from flowing into the through-hole without using a covering member, a filling member, or the like that is built into the electronic component.

  According to the electronic component manufacturing method of claims 42 and 43, all the through holes are collectively closed by pressing the flat plate member so as to cover the entire back surface of the substrate material and performing the closing process. And the opening process can be performed very easily. At that time, the use of silicone rubber as the flat plate member does not impair the adhesiveness against a temperature change or the like, and does not cause troubles such as the enclosed air coming out.

  According to the method for manufacturing an electronic component of claim 44, by forming the closing member with an adhesive sheet that covers the entire back surface of the substrate material, it is possible to maintain desired adhesion without holding it down. And can be easily attached to the substrate material.

  According to the method for manufacturing an electronic component of claims 45 and 46, the sheet is composed of a sheet whose adhesive strength is reduced by ultraviolet light or heat, and after the mold resin is cured, the sheet is irradiated with ultraviolet light. Alternatively, if heat is applied, even a sheet having a strong adhesive force can be easily peeled off.

  According to the method for manufacturing an electronic component of claim 47, preferably, the closing member is made of a resin that is dissolved in an alkaline aqueous solution that is poured into each through-hole to be cured, and preferably after the molding resin is cured. If the post-washing is performed with an aqueous alkaline solution, the closing member can be easily and completely removed from the electronic component.

  According to the method for manufacturing an electronic component of claim 48, when the molding resin is cured by attaching a covering material that closes the through hole to the surface of the substrate material prior to the molding step, the same electronic device as in claim 23 is obtained. An electronic component similar to claim 7 is manufactured by forming a component material and further performing a cutting process.

  According to the electronic component manufacturing method of claims 49 to 54, the covering material is formed of an adhesive sheet, a dry film, a glass epoxy molded plate, or a ceramic molded plate, thereby facilitating processing and mounting. In addition, the cut-out electronic component can be the same electronic component as in the tenth to thirteenth aspects. Further, by using a glass epoxy prepreg or a ceramic green sheet and heat-pressing it to form a covering material, the processing can be further facilitated.

  According to the method of manufacturing an electronic component of claim 55, when the mold resin is cured by attaching a plane holding means for holding the flatness of the substrate material prior to the molding step, the heat of the mold resin and the substrate material is increased. Warping of the substrate material based on the difference in expansion coefficient can be reduced. Thereby, the cut-out electronic component can be made to have good solderability without warping.

  According to the method for manufacturing an electronic component of claims 56 and 57, before removing the plane holding means, the substrate material is reheated and slowly cooled together with the hardened mold resin, whereby the relaxation phenomenon due to the viscous component of the mold resin. (Creep phenomenon) can be generated, and the warpage of the substrate material can be further reduced. In addition, a creep phenomenon can be produced even if a plane holding means is attached after the mold resin is cured and heated and gradually cooled.

  According to the electronic component manufacturing method of claim 58, the plane holding means includes a plane holding plate applied to the substrate material from the back surface side, and a clamping member that holds the plane holding plate and the substrate material together. As a result, the flatness of the substrate material can be maintained simply by attaching the flat holding plate and the clamping member to the substrate material, and the flat surface holding means may be obstructed in the molding process or the like. Absent. However, if the clamping member is formed in a frame shape, the function of the dam can be provided. Moreover, you may make a flat holding plate serve as the flat member of Claim 42.

  According to the electronic component manufacturing method of claim 59, by forming a plating lead on the substrate material, an electronic component material similar to that of claim 17 is formed, and a plurality of electronic component elements are collectively plated. Can do.

  According to the method for manufacturing an electronic component of claim 60, prior to the cutting step, after separating the plating lead from the through hole by half cutting, by performing an electrical inspection of the element component, in the state of the electronic component material, The electronic component elements can be made electrically independent, and each electronic component element can be inspected in this state. Therefore, the inspection process can be simplified.

  According to the method for manufacturing an electronic component of claim 61, the half-cut is performed along a virtual line, whereby the cut line in the half-cutting step and the complete cut line in the cutting step can be made the same. It can be done efficiently.

  According to the method for manufacturing an electronic component of claim 62, by attaching an adhesive sheet to the entire area of one side of the substrate material prior to the cutting step, the electronic device after cutting is similar to the dicing step of the semiconductor wafer. It is possible to prevent the parts from falling apart and to facilitate the post-process.

  Since this invention is comprised as mentioned above, there exists an effect as described below.

  According to the electronic component of the first aspect, since the surface of the mold resin is formed flat, the entire thickness can be made constant and thin. Further, since there is no dam, the structure is simple and the planar shape can be reduced. Furthermore, electrical inspection can be facilitated by using a through hole. For this reason, it can be manufactured inexpensively and in a small size. On the other hand, by filling the through hole with a metal material having solder wettability, a dam is not necessary, solderability can be improved, and miniaturization and improved reliability can be achieved. Similarly, it is possible to achieve downsizing by providing a covering member that closes the opening of the through hole. Further, the size reduction can be achieved by providing the three holes at the corners of the substrate.

  According to the electronic component material of the fifteenth aspect, a large number of electronic component elements that become electronic components by cutting can be manufactured at one time, and the electronic component of the second aspect can be efficiently manufactured (cut out). Further, by providing the substrate material with a dam, the mold resin can be uniformly and satisfactorily applied to each electronic component element. Furthermore, by plating the lead, it is possible to apply plating to each electronic component element at the same time.

  According to the electronic component manufacturing method of claim 30, a large number of electronic components of claim 2 can be manufactured at a time. That is, an inexpensive and small electronic component can be efficiently manufactured. Further, by controlling the mold resin by weight and curing the resin in a horizontally held state, the electronic component can be formed as thin as possible without impairing the reliability of the mold. Further, when the mold resin is cured, by using the plane holding means, the flatness of the substrate can be accurately maintained by a simple method, and the reliability of the electronic component can be improved. Moreover, an electrical inspection can be performed at the stage of the electronic component element before separation as an electronic component, and the inspection process can be simplified.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a structural diagram of a chip carrier type (leadless package type) electronic component according to an embodiment of the present invention. FIG. 1B is a back view of the chip carrier type electronic component as seen from the back side. FIG. 1A is a cross-sectional view taken along the line CC ′ of FIG. As shown in FIG. 1 (a), this electronic component has a semiconductor element 1 placed on a substrate 6 cut in an outer shape passing through the vicinity of the axial center of a through hole (external electrode) 7 filled with solder 9 in advance. In addition to die attachment, the semiconductor element 1 and the wiring pattern 3 formed on the substrate 6 are electrically connected by wires 2.

  Here, the semiconductor element 1 will be described as an example of the element part. However, the element part may be an active element such as a semiconductor element (IC, LSI, etc.) or a so-called passive element such as an inductance element or a capacitor element. In general, those mounted on a substrate are applicable.

  A part of the wiring pattern 3 is structured to be a bonding pad for wire bonding. The wiring pattern 3 is connected to the connection land 8 through the through hole (external electrode) 7, and is usually soldered to a mother board (not shown) and connected through the through hole 7 and the connection land 8. It is done. In this case, the inside of the through hole 7 is filled with solder 9, and it is easy to form a solder fillet (solder skirt) of the through hole (side surface of the electronic component). As a result, the reliability of the electronic component can be improved as is known, and the appearance inspection property in the mounting process of the electronic component can be improved.

The substrate 6 is usually a printed circuit board, but a ceramic substrate may be used. The mold resin 5 is cut into the same outer shape as the substrate 6 by a method described later. The die attach of the semiconductor element 1 is often performed with an epoxy adhesive or a silver paste. The wire 2 is often a gold wire or an aluminum wire and is connected by a known wire bonding method. When the substrate 6 is a printed circuit board, the surface and inside of the wiring pattern 3 and the through hole 7 are often gold-plated on a copper foil. In the case of a ceramic substrate, the wiring pattern 3 is made of copper, silver, tungsten. In many cases, the system paste is gold-plated or formed of a gold paste.
In this case, the through hole 7 may be plated with nickel or gold on copper formed by plating in the same manner as the printed board, or may be filled with the above-described conductive paste.

  In this case, as a material for the conductive paste, a material containing any one of copper, silver, gold and the like may be used. In particular, when an organic substrate is used as the substrate 6, it is preferable to use a material containing copper as a material for the conductive paste from the viewpoint of low firing temperature. It is particularly preferable to use a conductive paste in which copper particles are silver-plated. Also, the method of filling the conductive paste is performed by filling the through hole 7 with the squeegee 24 and then heat-curing the same as in the case of the solder 9 described later with reference to FIG.

  On the other hand, the example in which the solder 9 is filled in the through hole 7 has been described here. However, as long as the metal material has solder wettability, for example, gold or the like may be filled, or a conductive paste may be filled. Also good.

  Next, a method of manufacturing a chip carrier type electronic component having the structure of FIG. 1 will be described with reference to FIG. As shown in FIG. 2A, a substrate (substrate material) 6 in which a through hole 7 is formed in advance in a connection portion of a chip carrier is prepared. Next, the stencils 23 having the small holes 22 corresponding to the through holes 7 are aligned so that the holes overlap with each other, and the cream solder 21 is printed with the squeegee 24 on a table (not shown) that receives the substrate 6. . At this time, by making the hole diameter of the stencil 23 equal to or slightly smaller than the hole diameter of the through hole 7 or by controlling the moving speed and pressing of the squeegee 24, the cream solder 21 is inserted only into the through hole 7. In this case, even if the solder 9 is melted later, only the inside of the through hole 7 can be filled with the solder 9. The stencil 23 generally has a thickness of 100 to 200 μm, but the amount of solder 9 to be filled is determined by the volume of the through hole 7, and the thickness and hole diameter of the stencil 23 are also determined.

  As a method for applying the solder 9, in addition to the above, other known methods used for surface mounting, for example, a method using a dispenser can be used. Next, the through-hole 7 of the substrate 6 is heated by a reflow furnace, hot air, infrared rays or the like to melt the cream solder 21 so that the solder 9 is filled in the through-hole 7. And this is wash | cleaned as needed and the flux contained in the cream solder 21 is removed.

  It is to be noted that if a mask in which only the through hole 7 is opened is formed on one side or both sides of the substrate 6 in advance with a resist, a dry film or the like, and the cream solder 21 is printed on the substrate 6, the solder 9 can be more reliably passed. Only the hole 7 can be filled. Then, after the solder 9 is filled or after the solder 9 is melted, the resist, the dry film, and the like may be removed. Also, with this method, even if the stencil 23 is not used, the cream solder 21 can be filled only in the through hole 7 by placing the cream solder 21 directly on the substrate 6 and rubbing with the squeegee 24.

  Thereafter, as shown in FIG. 2B, the semiconductor element 1 is die-attached, and the die-attached semiconductor element 1 and the wiring pattern 3 formed on the substrate 6 are electrically connected by the wire 2. Further, as shown in FIG. 2C, the mold resin 5 is potted (applied) on the substrate. At this time, since the through hole 7 is filled with the solder 9, the mold resin 5 is formed in the through hole 7. And does not ooze out to the back surface of the substrate 6. Of course, the above-mentioned potting mold that does not require a mold is sufficient even if it is not a transfer mold that requires an expensive mold having a structure in which the through hole 7 is escaped. Even if a transfer mold is used, since the through hole 7 is filled with the solder 9, it is not necessary to adopt a structure for escaping the through hole 7, and it is possible to mold at once including the through hole 7. .

  In the case of a potting mold, the mold resin 5 may not be a thixotropic mold material if the peripheral edge of the substrate 6 is designed to be slightly wider or a dam is provided on the peripheral edge of the substrate 6. For this reason, since the mold resin 5 is satisfactorily introduced into the gap around the semiconductor element 1, an unfilled portion of the mold resin 5 is not generated, and the reliability can be improved. In addition, when vacuum defoaming is used together in the coating process of the mold resin 5, the generation of unfilled portions can be completely prevented. Further, if the surface of the substrate 6 or the surface of the semiconductor element 1 is activated by plasma of oxygen, argon or the like immediately before the application process of the mold resin 5, the adhesion of the mold resin 5 becomes better, and the electronic component Reliability is further improved.

  Next, the mold resin 5 is cured using a curing method such as heating, ultraviolet irradiation, or standing in humidity. The electronic component material is formed by the above process. The electronic component material is configured by mounting a plurality of semiconductor elements 1 on a large substrate (substrate material) 6 in which a through hole 7 is formed, and applying a mold resin 5 thereon. That is, the electronic component element sharing the through hole 7 is structured on the substrate 6. In this case, as shown in the figure, a small number such as two or one electronic component element may be formed, but it is preferable to form a large number in a matrix.

  Finally, as shown in FIG. 2C, the electronic component material is diced along a portion of the through hole 7 which is the outer shape of the chip carrier type electronic component, that is, along an imaginary line passing through substantially the axis of the through hole 7. Cut with the blade 20 to make a single electronic component. The last cutting step may be a breaking step of breaking the substrate 6 without using dicing. In this case, V-grooves, perforations, and the like are formed in advance in the substrate 6 along a virtual line that passes through substantially the axis of the through hole 7.

  As described above, a structure in which a large number of electronic components are taken from a single substrate 6 may be used. In this case, if the positions of the through holes 7 of the adjacent electronic components coincide with each other, the through holes 7 are adjacent to each other. It is preferable to share with. However, if the dicing blade 20 is thick and the through hole 7 is crushed at the time of cutting, the dicing blade 20 is cut at a position slightly deviated from the axis of the through hole 7 so that only one side of the cut is utilized. (See FIG. 13).

  Next, another method for manufacturing a chip carrier type electronic component having the structure of FIG. 1 will be described with reference to FIG. As shown in FIG. 3A, a substrate 6 in which through holes 7 are formed in advance in a chip carrier connection portion is prepared, and a flux application device (not shown) is provided only in the vicinity of the opening of the through hole 7 of the substrate 6. ) Apply flux. Next, the substrate 6 is brought close to the liquid surface of the molten solder 31, and a solder jet 30 is ejected from a nozzle or the like provided corresponding to the through hole 7 to the opening of the through hole 7. The molten solder 31 is brought into contact. In this case, if the diameter of the through hole 7 is about 0.5 mm or less, only the inside of the through hole 7 can be filled with the solder 9 by capillary action.

  In addition, if a mask in which only the through hole 7 is made of resist, dry film or the like is formed on the surface of the substrate 6 where the solder jet 30 is applied, or both surfaces of the substrate 6, the solder 9 can be accurately filled only in the through hole 7. it can. Then, after the solder 9 is filled, the resist, the dry film and the like are removed. If such a manufacturing method is taken, even if the board | substrate 6 is immersed as it is in a solder tank, the solder 9 can be filled only into the through hole 7. FIG. Moreover, the solder 9 can be accurately filled only in the through hole 7 by using a solder resist so that the solder 9 does not spread more than necessary. In such a case, the flux is removed by washing as necessary.

  Subsequent steps are the same as those described in FIG. 2 as shown in FIGS. 3B and 3C. In FIGS. 3B and 3C, since the connection land 8 on the back surface of the substrate 6 is not masked with a resist, a dry film or the like, the solder 9 is supplied to the connection land 8 together with the through hole 7. become. In this way, if the solder 9 is supplied to the connection land 8 in advance, the solderability can be improved when the cut-out electronic component is later soldered to the mother board. In addition, the supply of the solder 9 to the connection land 8 may be performed simultaneously with the printing of the cream solder 21 described with reference to FIG. 2 or may be performed simultaneously with the plating of the through hole 7 described later.

  In addition to the method shown in FIGS. 2 and 3, the through hole 7 may be partially blocked with a solder or gold plating in advance or may be blocked with a conductive paste. However, since the connection with the mother board is generally performed by soldering, it is desirable that the metal material filling the through hole 7 as the connection portion is difficult to oxidize and has good solder wettability. Specifically, as the conductive paste, a gold paste is preferable to a copper paste.

  Further, another embodiment of the present invention will be described. FIG. 4 is a structural diagram of another chip carrier type electronic component according to the present invention. FIG. 4B is a back view of the chip carrier type electronic component as seen from the back side. FIG. 4A is a cross-sectional view taken along line BB ′ of FIG. As shown in FIG. 4, this electronic component has the same structure as that of FIG. 1, except that the through hole (external electrode) 7 of the electronic component of FIG. 1 is not filled with solder 9. Since the solder 9 is not filled in the through hole 7, the structure is simplified and the cost is not increased. In addition, since there is no metal material filled in the through hole 7, the through hole 7 can be used as a positioning hole for a probe pin for inspection during an electrical inspection of an electronic component which is a subsequent process, so that conduction can be ensured. it can.

  Next, a method for manufacturing the chip carrier type electronic component shown in FIG. 4 will be described with reference to FIG. In FIG. 5A, a substrate 6 having through-holes 7 formed in advance in a chip carrier connection portion is prepared, and an adhesive sheet 40 is pasted on the entire back surface of the substrate 6. The pressure-sensitive adhesive sheet 40 may be any material as long as it does not allow air to pass, but the material used in the dicing process of the semiconductor element 1 is reliable because it has few impurities. In addition, the pressure-sensitive adhesive sheet 40 may be one that keeps the pressure-sensitive adhesive property, but a pressure-sensitive adhesive sheet that is easily peeled off in a subsequent process and whose pressure-sensitive adhesive property is lowered by ultraviolet light or heat is preferable. In this state, as shown in FIG. 5B, the semiconductor element 1 is die-attached, and the semiconductor element 1 and the wiring pattern 3 formed on the substrate 6 are electrically connected by the wire 2. .

  Here, the mold resin 5 is potted on the substrate 6. At this time, the mold resin 5 is applied in a state where the opening of the through hole 7 opened on the back side of the substrate 6 is closed with the adhesive sheet 40. . For this reason, air is sealed in the through hole 7 and the flow of the mold resin 5 which is a viscous fluid into the through hole 7 is prevented. Therefore, the mold resin 5 does not flow into the through hole 7 without providing a special lid member. Although the experimental results are not particularly shown, in the case of the mold resin 5 having a viscosity of 20000 to 50000 centipoise that is generally used, the above-mentioned effect is confirmed by the through hole 7 having a diameter of 0.5 mm or less. Even if the through hole 7 has a diameter of 0.5 mm or more, the above effect can be obtained by increasing the viscosity of the mold resin 5.

  In this state, after the mold resin 5 is cured, as shown in FIG. 5C, the adhesive sheet 40 is peeled off, and finally, this is cut along the through-hole (virtual line) 7 with the dicing blade 20. To make a single electronic component. As described above, the pressure-sensitive adhesive sheet 40 is preferably a sheet whose pressure-sensitive adhesive strength is reduced by heat or the like because it is easy to peel off. The molding method may be a potting mold that does not require a mold, and the thixotropy can be used in the same manner as described above with reference to FIG. However, if vacuum degassing is performed after molding by such a manufacturing method, the mold resin 5 may intrude into the through hole 7. Therefore, in order to remove bubbles in the mold resin 5, the mold resin 5 is vacuum degassed before molding. It needs to be stopped to foam.

  By adopting the above manufacturing method, a gold plated through hole (external electrode) 7 is exposed on the side surface of the cut-out electronic component, and a solder fillet is easily formed in the through hole 7 when connected to the motherboard. Thus, the solderability of the electronic component can be improved. Even in the case of a ceramic substrate, in the case of the hollow through hole 7, it is the same as the above-mentioned printed circuit board. Further, when the conductive paste is filled, the structure is the same as that described in FIG.

  Next, another manufacturing method of the chip carrier type electronic component having the structure of FIG. 4 will be described with reference to FIG. As shown in FIG. 6A, a substrate 6 in which a through hole 7 is formed in advance in a chip carrier connecting portion is prepared, and a semiconductor element 1 is die-attached on the substrate 6, and the semiconductor element 1 is attached to the substrate 6. The wiring pattern 3 and the wire 2 formed above are electrically connected. Thereafter, as shown in FIG. 6B, the silicone rubber 50 is pressed against the back surface of the substrate 6 to close the through hole 7, and the mold resin 5 is potted and cured as it is. The mold resin 5 does not flow into the through hole 7 based on the same principle as that when the above-described adhesive sheet 40 is used. The subsequent steps are the same as those described with reference to FIG. 5 as shown in FIG.

  In order to improve the adhesion between the through hole 7 and the silicone rubber 50 and to hold the air in the through hole 7 more reliably, the contact portion of the silicone rubber 50 with the through hole 7 and the connection land 8 are previously provided. The contact portion may be formed in a concave shape complementary to these convex shapes, or a pin-like protrusion that closes the inside of the through hole 7 may be formed on the surface of the silicone rubber 50. Good.

  Further, in order to prevent the mold resin 5 from flowing into the through hole 7, the through hole 7 is closed by a resin hole filling method to the through hole 7 which is a known substrate manufacturing method, and after the dicing process, the blocked resin is removed. May be. In this case, generally, a resin that dissolves in an alkaline aqueous solution is used, and after the dicing step, the resin is removed by washing with an alkaline aqueous solution.

  Further, another embodiment of the present invention will be described. FIG. 7 is a structural diagram of another chip carrier type electronic component according to the present invention. FIG. 7B is a back view of the chip carrier type electronic component as seen from the back side. FIG. 7A is a cross-sectional view taken along the line DD ′ of FIG. As shown in FIG. 7, the electronic component has a through-hole covering member 70 placed on the through-hole (external electrode) 7 in advance, and is cut on an outline that passes through the vicinity of the axial center of the through-hole 7. In addition, the semiconductor element 1 is die-attached, and the semiconductor element 1 and the wiring pattern 3 formed on the substrate 6 are electrically connected by the wire 2.

  The through-hole covering member 70 is provided only on the through-hole 7 and is made of an adhesive sheet, for example, a dry film, a glass epoxy plate, or a ceramic plate used in the substrate manufacturing process. In this case, these through-hole covering members 70 may be formed by punching with a mold or the like so as to be placed on the through-hole 7 and affixing them to the substrate 6. Of course, in the case of a dry film, it is bonded to the entire surface of the substrate 6 and only the necessary through hole 7 is left by a photo process similar to the conventional substrate manufacturing technique.

  In addition, the glass epoxy plate that has already been formed may be bonded to the substrate 6 with an adhesive, or the unformed glass epoxy prepreg is molded into a required shape in advance using a mold, etc. Thereafter, the substrate 6 may be heated and pressed. Further, when the substrate 6 is ceramic, an unsintered green sheet is molded in advance by a mold or the like, and after alignment, the green sheet is heated and pressed together with the substrate 6 to form the substrate 6. The green sheet may be sintered. The basic structure of the portion other than the through-hole covering member 70 is the same as that of the electronic component shown in FIGS.

  Further, another embodiment of the present invention will be described. FIG. 8 is a structural diagram of another chip carrier type electronic component according to the present invention. FIG. 8B is a back view of the chip carrier type electronic component viewed from the back side. FIG. 8A is a cross-sectional view taken along line EE ′ of FIG. As shown in FIG. 8, in this electronic component, the through hole covering member 70 is provided not only in the portion of the through hole (external electrode) 7 but also between the semiconductor element 1 and the substrate 6. That is, the semiconductor element 1 is die-attached on the through-hole covering member (pad) 70 rather than directly on the substrate 6. Other structures are the same as those in FIG.

  Therefore, the through-hole covering member 70 only needs to be opened only at a portion where the wire 2 is connected to the wiring pattern 3. As the through-hole covering member 70, an adhesive sheet, a glass epoxy plate, a ceramic plate is used. In the case of using, etc., unlike the structure of FIG. 7, it is not always necessary to form the punching opening with an expensive mold, and it may be processed with a drill bit. In addition, the positioning of the semiconductor element 1 is facilitated. Therefore, if the structure of FIG. 8 is adopted, the through-hole covering member 70 and the semiconductor element 1 can be easily manufactured and the cost of the electronic component can be reduced as compared with the structure of FIG.

  Furthermore, another embodiment of the present invention will be described. FIG. 9 is a structural diagram of another chip carrier type electronic component according to the present invention. FIG. 9B is a back view of the chip carrier type electronic component as seen from the back side. FIG. 9A is a cross-sectional view of the chip carrier type electronic component of FIG. As shown in FIG. 9, in this electronic component, a through hole 73 is formed in a through hole covering member (pad) 70 between the semiconductor element 1 and the substrate 6 shown in FIG. The hole 73 is filled with a silver paste 72. The silver paste 72 electrically connects the die pad 71 formed on the substrate 6 and the back surface of the semiconductor element 1.

  In general, the die pad 71 is often connected to a certain fixed potential, and the structure of FIG. 9 is an effective structure when the potential of the die of the semiconductor element 1 must be fixed. Of course, in this case, the through-hole covering member 70 only needs to open the portion where the wire 2 is connected to the wiring pattern 3 and the portion of the through hole 73 described above. When an adhesive sheet, a glass epoxy plate, a ceramic plate, or the like is used, an inexpensive through-hole covering member 70 processed with a drill bit may be attached as in the structure of FIG.

  Next, a method for manufacturing a chip carrier type electronic component having the structure shown in FIGS. 7 to 9 will be described with reference to FIG. As shown in FIG. 10A, first, a substrate (substrate material) 6 in which a through hole 7 is formed in a connection portion of a chip carrier is prepared. Next, the through hole covering member 70 is attached on the through hole 7. The through-hole covering member 70 is formed by punching a sheet having adhesiveness, a dry film used in substrate manufacturing technology, a glass epoxy plate, a ceramic plate, etc. so as to be located only on the through-hole 7, This may be attached to the substrate 6. Of course, in the case of a dry film, it may be bonded to the entire surface of the substrate, and only the through hole 7 may be left by a photo process similar to the conventional substrate manufacturing technique.

  As shown in FIG. 10A, the through-hole covering member 70 may be provided only in the portion of the through-hole 7, and in addition to this, as described in FIGS. 8 and 9, the semiconductor element 1 and the substrate 6 May be provided as a pad of the semiconductor element 1. Thereafter, the semiconductor element 1 is die-attached, and the die-attached semiconductor element 1 and the wiring pattern 3 formed on the substrate 6 are electrically connected by the wire 2. Further, as shown in FIG. 10 (b), the mold resin 5 is potted (applied) on the substrate. At this time, the through hole 7 is covered with the through hole covering member 70. , Does not flow into the through hole 7 and does not ooze out to the back surface of the substrate. Finally, as in FIG. 2C, the electronic component material is disposed along the portion of the through hole 7 which is the outer shape of the chip carrier type electronic component, that is, along the imaginary line passing through the substantially axial center of the through hole 7. Cut with a dicing blade 20 to form an electronic component alone.

  Furthermore, another method for manufacturing an electronic component will be described with reference to FIG. As in the above embodiments, the semiconductor element 1 is die-attached, wire-bonded, and the mold resin 5 is potted (applied) on the substrate 6. In this embodiment, as shown in FIG. When the mold resin 5 is cured, a plane holding means for holding the flatness of the substrate 6 is attached to the substrate 6. The plane holding means includes a plane holding plate 80 applied to the back surface of the substrate 6, and a holding member 81 having a “U” -shaped cross section that holds the plane holding plate 80 and the substrate 6 together. Removably attached to. In this state, the mold resin 5 is cured by a method suitable for the mold material to be used. In general, since the mold resin 5 is composed of a thermosetting epoxy resin, it is cured in a thermostat.

  By the way, in general, the thermal expansion coefficient of the mold resin 5 (2 to 3 × 10 −5 / ° C. in the case of a frequently used resin) is the thermal expansion coefficient of the substrate (in the case of FR-4 as a typical substrate example). , About 1.5 × 10 −5 / ° C.), and the mold resin 5 shrinks by several to several tens percent. Accordingly, if the substrate 6 coated with the mold resin 5 is cured as it is, the substrate 6 warps in a concave shape with the mold resin 5 as the center. However, when the mold resin 5 is cured in a state where the above-described plane holding means is attached to the substrate 6, due to a relaxation phenomenon (creep phenomenon) due to a viscous component of the mold resin 5, the substrate (electronic component material in this state) 6 The degree of warpage is reduced. The warping of the substrate 6 that has finally removed the plane holding means is extremely small, and works advantageously in processes that require flatness of the substrate 6 such as dicing and probing electrical property inspection, which are subsequent processes. Moreover, the warpage of the electronic component as the final product can be naturally reduced.

  Furthermore, after the mold resin 5 is cured, as shown in FIG. 11, a plane holding means is attached to the warped substrate 6, and in this state, the substrate (electronic component material) 6 is heated again and further cooled gradually. Even so, the warpage of the substrate 6 is alleviated. This is a process generally called annealing, but it is also due to a relaxation phenomenon (creep phenomenon) due to the viscous component of the mold resin 5. Of course, if the step of attaching the plane holding means to the substrate 6 and curing the mold resin 5 is combined with the step of annealing with the plane holding means attached, the warpage of the substrate 6 can be further reduced. Needless to say.

Next, a useful mold resin coating method in the method of manufacturing an electronic component of this embodiment will be described. Although not particularly illustrated, in this mold resin application method, the amount of mold resin poured (applied) onto the substrate is controlled by its weight. That is, the area where the mold resin is applied is determined by the corresponding substrate, and the specific gravity of the mold resin (thermosetting epoxy resin) is approximately 1.8. Therefore, the application thickness of the mold resin can be managed by managing the mold resin to be applied by weight. Then, if the volume of a component element to be molded such as a semiconductor element is taken into consideration, the coating thickness of the molding resin can be managed with high accuracy.
For example, a mold resin can be applied to a 0.4 mm substrate with an accuracy of 0.8 mm to 0.9 mm thickness, mold cracks do not occur, and the thickness as an electronic component is minimized. can do.

Further, in this mold resin coating method, the substrate coated with the mold resin is horizontally held and cured. In other words, the mold resin is cured using a jig for holding the substrate horizontally and holding the substrate horizontally in a thermostat.
If it does in this way, the application thickness of the mold resin of an electronic component material can be made uniform, and the application thickness of the mold resin of the cut-out electronic component, and also the thickness of an electronic component can be made constant. In addition, as a means for measuring the weight of the mold resin, various scales such as an electronic balance can be considered, and as the jig, a three-point support equipped with a level (height adjustable) A stand with three legs) is conceivable.

  Next, another embodiment of the present invention that can be applied to the structure of any of the above-described electronic components will be described. FIG. 12 is a substrate structure diagram of another chip carrier type electronic component according to the present invention. Here, two types of substrate structures will be described with reference to the drawings so that they can be compared with each other. In FIG. 12, reference numeral 61 denotes a die attach portion of a semiconductor element common to two types of substrate structures. Hereinafter, the substrate 6, the wiring pattern 3, and the through hole 7 are indicated by a solid line in one substrate structure 62 and indicated by a two-dot chain line in the other substrate structure 63. The solid line is the substrate structure 62 of the embodiment, and the through-hole 7 and the wiring pattern 3 that also serves as a bonding pad for wire bonding are formed at the four corners of the substrate 6. A two-dot chain line is a known substrate structure 63, and through-holes 7 and wiring patterns 3 are formed on four sides of the substrate 6.

  In particular, when the number of the semiconductor elements 1 and the wiring patterns 3 is 4 or less, as shown in FIG. 12, the through hole 7 is formed on the substrate 6 in order to design the electronic component as small as possible and in a standard size. It can be seen that the formation at the four corners of the substrate 6 rather than the side portions can effectively utilize the four corners of the substrate 6 that tend to be a dead space, which is advantageous in reducing the size of the substrate. Here, when the number of the semiconductor elements 1 and the wiring patterns 3 is three or less, the through holes 7 may not use all the four corners of the substrate 4. On the other hand, when manufacturing an electronic component of this substrate structure 62, a substrate (substrate material) 6 in which a through hole (through hole material) 7 is formed at the intersection of a virtual line that will be a cutting line later is prepared. An electronic component material is formed and cut along an imaginary line.

  Similarly, another manufacturing method that can be applied to any chip carrier type electronic component will be described with reference to FIG. In addition, although the cutting process of the board | substrate 6 demonstrated below is a process performed after mounting the semiconductor element 1 and apply | coating the mold resin 5 as mentioned above, in order to make explanation easy to understand, in the drawing, the semiconductor The element 1 and the wire 2 are omitted. FIG. 13A is a back view of a substrate (substrate material) 6 used for a chip carrier type electronic component according to the present invention, and FIG. 13B is a plan view thereof.

  The code | symbol 71 shown in FIG.13 (b) is a die pad, and the semiconductor element 1 is die-attached here. The semiconductor element 1 and the wiring pattern 3 are connected, and further connected to the back surface of the substrate 6 through the through hole 7. The broken line in the figure is a full dicing line (virtual line) 91, and the area surrounded by the line 91 is finally the outer shape of the chip carrier type electronic component. Of course, in the actual process, the surface of the substrate 6 is coated with the mold resin 5 over the entire surface, and the wiring pattern 3 and the through hole 7 shown in FIG. 13B cannot be seen. Further, the back surface of the substrate 6 in FIG. 13A has no change in appearance before and after mounting before dicing.

  As shown in FIG. 13A, a plating lead 92 connected to each through hole 7 is provided on the peripheral edge of the back surface of the substrate 6, and the plating lead 92 and the wiring pattern 3 on the surface of the substrate 6 and Electroplating is performed on the through holes 7 and the connection lands 8 on the back surface of the substrate 6. For this reason, all the through holes 7, the wiring pattern 3 that follows the plated leads 92, and the external connection portion of the semiconductor element 1 are all electrically short-circuited.

  Therefore, after the plating is performed, the plating lead 92 is cut by the half dicing line 90 in the embodiment in order to eliminate this short-circuit state. Half dicing is performed at least at the thickness of the plated lead 92 or less and the total thickness of the electronic component including the mold. In this case, it is desirable to perform after sticking an adhesive sheet on the surface of the substrate 6 after molding so that the chip carrier type electronic components do not fall apart in the subsequent full dicing step. Since the plating lead 92 is cut in this half dicing process, all the through holes 7, the wiring pattern 3 that follows the plating leads 92, and the external connection portion of the semiconductor element 1 are all removed from the electrical short circuit, and the through holes 7 To the semiconductor element 1 are electrically independent electronic component elements as in the final chip carrier type electronic component. Thereby, the electrical inspection of the semiconductor element 1 can be performed from the back surface of the substrate 6 such that the pin probe stands in the through hole 7. After the inspection is completed, the outer shape of the final chip carrier type electronic component is cut by the full dicing line 91.

  By doing so, since the chip carrier type electronic component can be inspected in the substrate external state, handling and positioning at the time of inspection are greatly improved as compared with the case where the electronic component alone is used. Further, the half dicing line 90 and the full dicing line 91 may overlap. That is, even if half dicing is performed at the final chip carrier type electronic component outer shape position, full dicing is performed at the same position after component inspection, and the final chip carrier type electronic component is finished, the effect does not change.

Further, half dicing may be omitted, and full dicing may be performed directly on the above-mentioned full dicing line 91 to obtain a final chip carrier type electronic component.
Also in this case, it is performed after sticking an adhesive sheet on the surface of the substrate 6. As a result, the fully diced electronic components do not fall apart and the plated leads 92 are also cut, so that the chip carrier type electronic components can be inspected in the substrate outer shape.

Although not shown, the plating leads 92 may be formed on both the front and back surfaces of the substrate 6. In such a case, the localization of the plating current is suppressed, and the plating thickness can be made uniform. In this case, it is preferable to perform full dicing directly as described above.
(Modification)

  In the embodiments described above, the method of mounting the semiconductor element on the substrate by the so-called wire bonding method has been described. Of course, it may be mounted by other known methods such as the TAB method and the flip chip method. . In particular, when performing flip-chip mounting by the face-down method, it is possible to omit the area corresponding to the area where the wire is routed, and it is needless to say that further miniaturization can be achieved. Further, in the above embodiment, the case where the semiconductor element is mounted on the chip carrier type electronic component has been described. However, the mounted component is not limited to the semiconductor element, and any other element component such as a capacitor or an inductor may be used. . In addition, a plurality of element parts as well as a single element part may be mounted on the substrate in the embodiment. Of course, it can also be used as a package on which a so-called MCM (multi-chip module) is mounted.

1 is a structural diagram of an electronic component according to an embodiment of the present invention. It is explanatory drawing of the manufacturing method corresponding to the Example of FIG. 1 of this invention. It is explanatory drawing of the other manufacturing method corresponding to the Example of FIG. 1 of this invention. FIG. 6 is a structural diagram of an electronic component according to another embodiment of the present invention. It is explanatory drawing of the manufacturing method corresponding to the Example of FIG. 4 of this invention. It is explanatory drawing of the other manufacturing method corresponding to the Example of FIG. 4 of this invention. FIG. 6 is a structural diagram of an electronic component according to another embodiment of the present invention. FIG. 6 is a structural diagram of an electronic component according to another embodiment of the present invention. FIG. 6 is a structural diagram of an electronic component according to another embodiment of the present invention. It is explanatory drawing of the manufacturing method corresponding to the Example of FIG.7, FIG.8 and FIG.9 of this invention. It is explanatory drawing of the manufacturing method of the electronic component which concerns on one Example of this invention. It is a board | substrate structure figure of the electronic component which concerns on one Example of this invention. It is explanatory drawing of the manufacturing method of the electronic component which concerns on one Example of this invention. It is a structural diagram of a conventional electronic component.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor element, 2 ... Wire, 3 ... Wiring pattern, 4 ... Mold frame, 5 ... Mold resin, 6 ... Board | substrate, 7 ... Through-hole (external electrode), 8 ... Connection land, 9 ... Solder, 20 ... Dicing Blade: 21 ... Cream solder, 22 ... Small hole, 23 ... Stencil, 24 ... Squeegee, 30 ... Solder jet, 31 ... Molten solder, 40 ... Adhesive sheet, 50 ... Silicone rubber, 61 ... Diamond touch part, 62 ... Solid line Substrate structure, 63 ... Two-dot chain line substrate structure, 70 ... Through-hole covering member, 71 ... Die pad, 72 ... Silver paste, 73 ... Through-hole, 80 ... Plane holding plate, 81 ... Nipping member, 90 ... Half dicing line, 91: Full dicing line, 92: Plating lead.

Claims (62)

  A rectangular substrate having a plurality of external electrodes around it, an element component placed on the surface of the substrate while being electrically connected to the external electrode, and a mold in which the element component is molded on the surface of the substrate In a leadless package type electronic component comprising a resin, a surface of the mold resin is formed flat, and each side surface of the mold resin is formed flush with each side surface of the substrate. Electronic parts.   The electronic component according to claim 1, wherein the external electrode is formed by cutting a through hole in an axial direction.   The electronic component according to claim 2, wherein the external electrode is filled with a conductive paste.   The electronic component according to claim 2, wherein the external electrode is filled with a metal material having solder wettability.   The electronic component according to claim 4, wherein the metal material is solder.   The electronic component according to claim 4, wherein the metal material is gold. A covering member that closes the opening on the mold resin side of the external electrode is further provided,
3. The covering member is molded on the surface of the substrate by the mold resin, and a side end surface thereof is formed flush with the side surface of the mold resin and the substrate. The electronic component described.   The electronic component according to claim 7, further comprising a pad made of the same material as that of the covering member between the substrate and the element component.   The pad is formed with a through-hole penetrating the covering member in the front-back direction, and the through-hole contains a conductive member that conducts the element component and the wiring region of the substrate. The electronic component according to claim 8.   The electronic component according to claim 7, wherein the covering member is an adhesive sheet.   The electronic component according to claim 7, wherein the covering member is a dry film.   The electronic component according to claim 7, wherein the covering member is a glass epoxy plate.   The electronic component according to claim 7, wherein the covering member is a ceramic plate.   The electronic component according to claim 1, wherein the external electrode is provided at a corner of the substrate. A substrate material in which through-holes in which external electrodes are formed by cutting along a line substantially passing through the axis are arranged on a grid-like virtual line,
Component parts mounted in the area surrounded by the virtual line of the substrate material,
An electronic component material, comprising: a mold resin poured over the entire surface of the substrate material so as to mold the element component.   The electronic component material according to claim 15, further comprising a dam for preventing the poured mold resin from flowing out at a peripheral portion of the substrate material.   The electronic component material according to claim 15 or 16, further comprising a plating lead connected to each through hole in the substrate material.   The electronic component material according to claim 17, wherein the plating lead is disposed on both front and back surfaces of the substrate material.   The electronic component material according to claim 15, wherein each through hole is filled with a conductive paste.   The electronic component material according to claim 15, wherein each through hole is filled with a metal material having solder wettability.   The electronic component material according to claim 20, wherein the metal material is solder.   The electronic component material according to claim 20, wherein the metal material is gold.   19. The cover material according to claim 15, further comprising a covering material that closes an opening of each through hole and is molded in a molding resin on a surface of the substrate material. Electronic parts material.   24. The electronic component material according to claim 23, further comprising a pad made of the same material as the covering material between the substrate material and each of the component parts.   The electronic component material according to claim 23 or 24, wherein the covering material is an adhesive sheet.   The electronic component material according to claim 23, wherein the covering material is a dry film.   The electronic component material according to claim 23 or 24, wherein the covering material is a glass epoxy plate.   The electronic component material according to claim 23 or 24, wherein the covering material is a ceramic plate.   The electronic component material according to any one of claims 15 to 28, wherein the through holes are arranged at intersections of lattice-like virtual lines. A substrate manufacturing process in which a through hole in which an external electrode is formed by cutting along a line substantially passing through the axis is formed in a substrate material along a lattice-like virtual line;
A mounting step of mounting an element component in a region surrounded by the imaginary line of the substrate material; a connection step of electrically connecting the element component and the corresponding through hole;
A molding step in which a mold resin is poured over the entire surface of the substrate material to mold the element component;
An electronic component manufacturing method comprising: a cutting step of cutting the substrate material, the mold resin, and the through hole along the virtual line after the mold resin is cured.   31. The manufacturing of an electronic component according to claim 30, further comprising a dam forming step of forming a dam for preventing the poured mold resin from flowing out at a peripheral portion of the substrate material prior to the molding step. Method.   32. The electronic component according to claim 30, wherein the mold resin is cured using a jig that horizontally holds the substrate material, and the substrate material is held horizontally by the jig. Production method.   The method of manufacturing an electronic component according to claim 32, wherein the mold resin to be poured is managed by weight.   34. The method of manufacturing an electronic component according to any one of claims 30 to 33, further comprising a filling step of filling each through hole with a conductive paste prior to the molding step.   35. The method of manufacturing an electronic component according to claim 34, wherein the filling step is performed by heating and curing the conductive paste after filling the through holes.   The electronic component according to any one of claims 30 to 33, further comprising a filling step of filling each through hole with a metal material having solder wettability prior to the molding step. Production method.   37. The method of manufacturing an electronic component according to claim 36, wherein the metal material is solder, and the filling step is performed by filling the through holes with solder paste and then heating and melting the paste. .   37. The electronic component manufacturing method according to claim 36, wherein the metal material is solder, and the filling step is performed by bringing the opening of the through hole into contact with molten and waved solder. Method.   The metal material is solder, and the filling step is performed by immersing the substrate material in molten solder after masking a portion of the substrate material excluding the opening of the through hole. The method of manufacturing an electronic component according to claim 36.   37. The method of manufacturing an electronic component according to claim 36, wherein the filling step is performed by plating the through hole thickly. Prior to the molding step, a closing step of closing the opening of each through hole opened on the back surface of the substrate material using a closing member;
The method for manufacturing an electronic component according to any one of claims 30 to 33, further comprising an opening step of removing the blocking member after the mold resin is cured.   The blocking member is a non-adhesive flat plate member that can cover the entire back surface of the substrate material, and the blocking step is performed by pressing the flat plate member against the back surface of the substrate material. The method of manufacturing an electronic component according to claim 41.   43. The method of manufacturing an electronic component according to claim 42, wherein the flat member is silicone rubber.   The closing member is an adhesive sheet that can cover the entire back surface of the substrate material, and the closing step is performed by sticking the sheet to the back surface of the substrate material. 41. A method for producing an electronic component according to 41.   45. The ultraviolet curable sheet according to claim 44, wherein the sheet is an ultraviolet curable sheet whose adhesiveness decreases when irradiated with ultraviolet light, and the ultraviolet curable sheet is irradiated with ultraviolet light between the closing step and the opening step. Manufacturing method of electronic components.   45. The electronic component according to claim 44, wherein the electronic component is a thermosetting sheet whose adhesiveness decreases when the sheet is heated, and the thermosetting sheet is heated between the closing step and the opening step. Manufacturing method.   The closing member is a soluble resin that dissolves in an alkaline aqueous solution, and the closing step is performed by pouring and dissolving the soluble resin in each through hole, and the opening step is soluble in an alkaline aqueous solution. The method of manufacturing an electronic component according to claim 41, wherein the method is performed by washing away the resin.   34. The covering method according to any one of claims 30 to 33, further comprising a covering step of attaching a covering material that closes the opening of each through hole to the surface of the substrate material prior to the molding step. The manufacturing method of the electronic component of description.   The said covering material is an adhesive sheet | seat, The said covering process is performed by sticking the said sheet | seat on the surface of the said board | substrate material, The manufacturing of the electronic component of Claim 48 characterized by the above-mentioned. Method.   49. The method of manufacturing an electronic component according to claim 48, wherein the covering member is a dry film, and the covering step is performed by attaching the dry film to a surface of the substrate material. .   49. The electronic component according to claim 48, wherein the covering member is a glass epoxy molded plate, and the covering step is performed by bonding the molded plate to a surface of the substrate material. Production method.   49. The electronic component manufacturing method according to claim 48, wherein the covering member is a glass epoxy prepreg, and the covering step is performed by thermocompression bonding the prepreg to a surface of the substrate material. Method.   49. The electronic component manufacturing method according to claim 48, wherein the covering member is a ceramic molded plate, and the covering step is performed by bonding the molded plate to a surface of the substrate material. Method.   49. The electronic component according to claim 48, wherein the covering member is a ceramic green sheet, and the covering step is performed by thermocompression bonding the green sheet to a surface of the substrate material. Production method. Prior to the molding step, attaching a plane holding means for holding the flatness of the substrate material to the substrate material;
55. The electronic component according to any one of claims 30 to 54, further comprising a step of removing the flat surface holding means after the molding resin is cured and before the cutting step. Production method.   56. The method of manufacturing an electronic component according to claim 55, wherein the substrate material is heated and gradually cooled after the mold resin is cured and before the plane holding means is removed. A step of attaching a plane holding means for holding the flatness of the substrate material to the substrate material after the molding resin is cured and before the cutting step;
Heating and gradually cooling the substrate material;
The method for manufacturing an electronic component according to any one of claims 30 to 54, further comprising a step of removing the flat surface holding means.   The plane holding means includes a plane holding plate applied to the back side of the substrate material, and a clamping member for clamping the plane holding plate and the substrate material together. 58. A method of manufacturing an electronic component according to 55, 56 or 57.   59. The electronic component according to claim 30, wherein, in the substrate manufacturing step, a plating lead connected to each through hole is integrally formed in the substrate material together with the through hole. Production method. Prior to the cutting step, a semi-cutting step of cutting the substrate lead and the mold resin to cut the plating lead from the through hole,
60. The method of manufacturing an electronic component according to claim 59, further comprising a subsequent inspection step of performing an electrical inspection of the component part.   61. The method of manufacturing an electronic component according to claim 60, wherein the cutting in the half-cutting step is performed along the virtual line. Prior to the cutting step, further comprising the step of sticking an adhesive sheet to the entire area of one side of the substrate material,
The method of manufacturing an electronic component according to any one of claims 30 to 61, wherein the cutting step is performed without completely cutting the sheet.

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