JPH05170B2 - - Google Patents
Info
- Publication number
- JPH05170B2 JPH05170B2 JP62218633A JP21863387A JPH05170B2 JP H05170 B2 JPH05170 B2 JP H05170B2 JP 62218633 A JP62218633 A JP 62218633A JP 21863387 A JP21863387 A JP 21863387A JP H05170 B2 JPH05170 B2 JP H05170B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- workpiece
- grindstone
- mirror
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 59
- 239000006061 abrasive grain Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 30
- 238000000227 grinding Methods 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 15
- 239000004575 stone Substances 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- 230000009257 reactivity Effects 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- -1 oxides Chemical class 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000007790 solid phase Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229930182556 Polyacetal Natural products 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 2
- 239000003082 abrasive agent Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 150000001247 metal acetylides Chemical class 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229910021332 silicide Inorganic materials 0.000 claims description 2
- 230000003993 interaction Effects 0.000 claims 1
- 229920006389 polyphenyl polymer Polymers 0.000 claims 1
- 238000003754 machining Methods 0.000 description 16
- 238000005498 polishing Methods 0.000 description 15
- 238000003672 processing method Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 7
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 6
- 229910000423 chromium oxide Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000011651 chromium Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000003746 solid phase reaction Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004125 X-ray microanalysis Methods 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21863387A JPS6464766A (en) | 1987-09-01 | 1987-09-01 | Machining method for specular surface of hard and brittle material and grinding wheel member used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21863387A JPS6464766A (en) | 1987-09-01 | 1987-09-01 | Machining method for specular surface of hard and brittle material and grinding wheel member used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6464766A JPS6464766A (en) | 1989-03-10 |
| JPH05170B2 true JPH05170B2 (fr) | 1993-01-05 |
Family
ID=16723009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21863387A Granted JPS6464766A (en) | 1987-09-01 | 1987-09-01 | Machining method for specular surface of hard and brittle material and grinding wheel member used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6464766A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102886388A (zh) * | 2012-10-19 | 2013-01-23 | 刘显 | 链式连续拉拔机 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336949A (ja) * | 1991-05-13 | 1992-11-25 | Marutoo:Kk | ラップ盤によるセラミックスの鏡面研磨法 |
| AT403671B (de) * | 1996-02-14 | 1998-04-27 | Swarovski Tyrolit Schleif | Schleifwerkzeug mit einem metall-kunstharzbindemittel und verfahren zu seiner herstellung |
| JP4809509B2 (ja) * | 1998-10-02 | 2011-11-09 | 財団法人ファインセラミックスセンター | セラミックス加工用工具。 |
| JP2017042890A (ja) * | 2015-08-28 | 2017-03-02 | 国立大学法人京都工芸繊維大学 | 研磨工具及びその製造方法、並びに研磨装置 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51117390A (en) * | 1975-04-07 | 1976-10-15 | Asahi Daiyamondo Kogyo Kk | Diamond grindstone for polishing glass |
| JPS5279398A (en) * | 1975-11-11 | 1977-07-04 | Showa Denko Kk | Polishing device for glass face finishing |
| JPS5623746A (en) * | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
| JPS59134647A (ja) * | 1983-01-19 | 1984-08-02 | Olympus Optical Co Ltd | 光学部品の研磨方法および研磨具 |
| JPS61182774A (ja) * | 1985-02-09 | 1986-08-15 | Kanebo Ltd | 軟質金属研磨用砥石 |
| JPS61192480A (ja) * | 1985-02-22 | 1986-08-27 | Kanebo Ltd | 軟質金属用合成砥石 |
| JPS61219565A (ja) * | 1985-03-22 | 1986-09-29 | Taihoo Kogyo Kk | 研磨方法 |
| JPS62107954A (ja) * | 1985-11-05 | 1987-05-19 | Tomiji Saito | 可塑性研磨材料 |
-
1987
- 1987-09-01 JP JP21863387A patent/JPS6464766A/ja active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51117390A (en) * | 1975-04-07 | 1976-10-15 | Asahi Daiyamondo Kogyo Kk | Diamond grindstone for polishing glass |
| JPS5279398A (en) * | 1975-11-11 | 1977-07-04 | Showa Denko Kk | Polishing device for glass face finishing |
| JPS5623746A (en) * | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
| JPS59134647A (ja) * | 1983-01-19 | 1984-08-02 | Olympus Optical Co Ltd | 光学部品の研磨方法および研磨具 |
| JPS61182774A (ja) * | 1985-02-09 | 1986-08-15 | Kanebo Ltd | 軟質金属研磨用砥石 |
| JPS61192480A (ja) * | 1985-02-22 | 1986-08-27 | Kanebo Ltd | 軟質金属用合成砥石 |
| JPS61219565A (ja) * | 1985-03-22 | 1986-09-29 | Taihoo Kogyo Kk | 研磨方法 |
| JPS62107954A (ja) * | 1985-11-05 | 1987-05-19 | Tomiji Saito | 可塑性研磨材料 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102886388A (zh) * | 2012-10-19 | 2013-01-23 | 刘显 | 链式连续拉拔机 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6464766A (en) | 1989-03-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101972979B (zh) | 一种金刚石表面化学机械复合研磨抛光方法与装置 | |
| EP1052062A1 (fr) | Préconditionnement d'un article abrasif fixé | |
| WO2021002216A1 (fr) | Meule synthétique | |
| JPH05170B2 (fr) | ||
| US6261162B1 (en) | Polishing apparatus and method of manufacturing grinding plate | |
| JP6145548B1 (ja) | 面取り研削方法及び面取り研削装置 | |
| US5817245A (en) | Method of and apparatus for tribochemically finishing ceramic workpiece | |
| JPH09193001A (ja) | ホーニングツール | |
| JPH08506769A (ja) | 脆性材料製部材の機械加工方法およびこの方法を実施する装置 | |
| JP4746788B2 (ja) | 平面ホーニング加工用超砥粒ホイール及びそのドレス方法ならびに同ホイールを使用する研削装置 | |
| JP2022047538A (ja) | 面取り研削方法及び面取り研削装置 | |
| Yasunaga et al. | Development of sequential grinding-polishing process applicable to large-size Si wafer finishing | |
| WO2000024548A1 (fr) | Dispositif de polissage et procede de fabrication de semi-conducteurs au moyen dudit dispositif | |
| JPH04201180A (ja) | 研磨用のパテ、それを使用する砥石材およびその砥石材を装備した研磨盤 | |
| JP6178216B2 (ja) | 研削・ラップ・研磨方法およびその装置 | |
| JPS61136762A (ja) | 粗球体製造方法 | |
| JP3317910B2 (ja) | 研削盤における研削装置 | |
| JPH01109063A (ja) | 砥石による切断および研削方法 | |
| JPS6339007Y2 (fr) | ||
| JPH0569309A (ja) | 超仕上方法 | |
| JP2023139462A (ja) | 研削ホイール及び研削装置 | |
| JP2645044B2 (ja) | 球体加工装置 | |
| TWI231246B (en) | Method for polishing diamond wafer | |
| KR200420508Y1 (ko) | 슬러리 블록을 이용한 연마판 | |
| JP2001009731A (ja) | メカノケミカル砥石 |