JPH05167223A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH05167223A JPH05167223A JP3352895A JP35289591A JPH05167223A JP H05167223 A JPH05167223 A JP H05167223A JP 3352895 A JP3352895 A JP 3352895A JP 35289591 A JP35289591 A JP 35289591A JP H05167223 A JPH05167223 A JP H05167223A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- aqueous solution
- oxide film
- treatment
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は無電解めっき処理を２回
以上に分けて行うプリント配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board in which electroless plating treatment is performed twice or more.
【０００２】[0002]
【従来の技術】プリント配線板を製造する方法としてフ
ルアディティブ法やパートリアディティブ法がある。前
者は接着剤層を積層した絶縁基板に回路及びスルーホー
ルの銅等のめっきを総て無電解めっき処理により形成す
る方法である。また、後者は銅張積層板等を用い、表面
回路の一部とスルーホールのめっきを無電解めっき処理
により形成する方法である。2. Description of the Related Art As a method for manufacturing a printed wiring board, there are a full additive method and a part additive method. The former is a method in which all the plating of circuits and through holes such as copper is formed by electroless plating on an insulating substrate having an adhesive layer laminated thereon. The latter is a method of forming a part of the surface circuit and the through holes by electroless plating using a copper clad laminate or the like.
【０００３】両者とも一般的には無電解めっき処理を２
回以上に分けて行い、厚さ２０〜４０μｍ程度の厚付け
めっきをする。この場合、１回目の無電解めっき処理
（以下ストライクめっきという）と２回目以降の無電解
めっき処理（以下後付けめっきという）とに用いる無電
解めっき液は、通常、組成を違えている。従って、スト
ライクめっきのめっき液が絶縁基板に付着したまま後付
けめっきを行うことは好ましくない。そのために、スト
ライクめっき後に水洗してめっき液を除去し、その後に
後付けめっきを行っている。Both of them generally require electroless plating.
The plating is performed at least once, and thick plating with a thickness of about 20 to 40 μm is performed. In this case, the electroless plating solutions used for the first electroless plating treatment (hereinafter referred to as strike plating) and the second and subsequent electroless plating treatments (hereinafter referred to as post-plating) usually have different compositions. Therefore, it is not preferable to carry out the post-plating while the plating solution for strike plating is attached to the insulating substrate. For that purpose, after the strike plating, the plating solution is removed by washing with water and then the post plating is performed.
【０００４】[0004]
【発明が解決しようとする課題】しかし、ストライクめ
っき後に水洗を行うと、めっき層の表面に酸化皮膜が生
成する。また、ストライクめっき、水洗、後付けめっき
の処理間において、めっき層を大気中にさらすためによ
っても酸化皮膜が生成する。そのために、後付けめっき
の際に、酸化皮膜で覆われた部分のめっき層が酸化銅等
の酸化金属に変わり不動態化し、その上にめっき層を形
成できなくなる欠点がある。また、後付けめっきにより
めっき層を積層できたとしても、ストライクめっきによ
り形成しためっき層との間の密着性が劣化する欠点があ
る。However, when water is washed after strike plating, an oxide film is formed on the surface of the plating layer. In addition, an oxide film is formed by exposing the plating layer to the atmosphere during the processes of strike plating, washing with water, and post-plating. Therefore, there is a drawback that the plating layer of the portion covered with the oxide film is changed into an oxide metal such as copper oxide and passivated during the post-plating, and the plating layer cannot be formed thereon. Further, even if the plating layer can be laminated by the post-plating, there is a drawback that the adhesion with the plating layer formed by the strike plating is deteriorated.
【０００５】そのためめっき層表面に生成した酸化皮膜
を除去するために、従来は、水洗後に絶縁基板を希硫酸
溶液中にディップする等している。しかし、この方法で
も、希硫酸溶液中にディップした後に、この溶液を除去
するために水洗しなければならず、再び酸化皮膜が生成
するため、効果が低い欠点がある。Therefore, in order to remove the oxide film formed on the surface of the plating layer, conventionally, after washing with water, the insulating substrate is dipped in a dilute sulfuric acid solution. However, even in this method, after dipping in a dilute sulfuric acid solution, it is necessary to wash with water in order to remove this solution, and an oxide film is formed again.
【０００６】本発明の目的は、以上の欠点を改良し、後
付けめっきの際にめっき層が不動態化するのを防止する
とともに、ストライクめっきと後付けめっきにより形成
した各めっき層間の密着性を向上できるプリント配線板
の製造方法を提供するものである。An object of the present invention is to improve the above-mentioned drawbacks, prevent the plating layer from being passivated during post-plating, and improve the adhesion between the plating layers formed by strike plating and post-plating. Provided is a method for manufacturing a printed wiring board which can be performed.
【０００７】[0007]
【課題を解決するための手段】請求項１の発明は、上記
の目的を達成するために、無電解めっき処理を２回以上
に分けて行うプリント配線板の製造方法において、各無
電解めっき処理の間にシアン化合物を含むｐＨ２〜７の
水溶液によりめっき表面を処理することを特徴とするプ
リント配線板の製造方法を提供するものである。In order to achieve the above object, the invention of claim 1 is a method for manufacturing a printed wiring board, wherein electroless plating treatment is performed twice or more times. The present invention provides a method for producing a printed wiring board, which comprises treating the plating surface with an aqueous solution having a pH of 2 to 7 containing a cyanide compound.
【０００８】また、請求項２の発明は、請求項１におい
て、水溶液中にシアン化合物とともに界面活性剤を含む
ことを特徴とするプリント配線板の製造方法を提供する
ものである。A second aspect of the present invention provides the method for producing a printed wiring board according to the first aspect, characterized in that the aqueous solution contains a cyan compound and a surfactant.
【０００９】なお、ｐＨが２より低いと、シアン化合物
を含む水溶液は強酸中で猛毒であるシアン化水素を発生
する。また、ｐＨが８より高いと、酸化皮膜の除去作用
が低くなる。When the pH is lower than 2, an aqueous solution containing a cyanide compound produces highly poisonous hydrogen cyanide in a strong acid. If the pH is higher than 8, the effect of removing the oxide film will be low.
【００１０】[0010]
【作用】シアン化合物は金属と強いキレート作用を持っ
ている。そのため、ストライクめっき後にシアン化合物
を含むｐＨ２〜７の水溶液により表面を処理すると、水
洗や大気中にさらすことによって生成した酸化皮膜を除
去できる。[Function] Cyanide has a strong chelating effect with metals. Therefore, if the surface is treated with an aqueous solution containing a cyanide compound and having a pH of 2 to 7 after strike plating, the oxide film formed by washing with water or exposure to the atmosphere can be removed.
【００１１】また、処理後は、シアン化合物がめっき層
に吸着した状態になるために、後付けめっきまでの間に
大気中にさらされても酸化皮膜を生成することがない。Further, after the treatment, since the cyan compound is in a state of being adsorbed on the plating layer, an oxide film is not formed even if it is exposed to the atmosphere before the post-plating.
【００１２】なお、水洗を行わずにシアン化合物を含む
水溶液により処理しても、ストライクめっきのめっき液
を除去できる。また、その後に後付けめっきを行っても
不良を生じることはない。従って、水洗を省いた場合に
はそれだけ酸化皮膜を生成する機会が少なくてすみ、酸
化皮膜を原因とする不良を低減できる。The strike plating solution can be removed by treating with an aqueous solution containing a cyanide compound without washing with water. Further, even if the subsequent plating is performed, no defects will occur. Therefore, when the washing with water is omitted, the chances of forming an oxide film are reduced, and defects caused by the oxide film can be reduced.
【００１３】そして、請求項２の発明の通り水溶液中に
界面活性剤を添加した場合には、水溶液は表面張力が低
くなる。そのため、スルーホール内に入り易くなり、そ
の部分のめっき層に生成した酸化皮膜を効果的に除去で
きる。When the surfactant is added to the aqueous solution as claimed in claim 2, the aqueous solution has a low surface tension. Therefore, it is easy to enter the through hole, and the oxide film formed in the plating layer at that portion can be effectively removed.
【００１４】[0014]
【実施例】以下、本発明を実施例に基づいて説明する。 実施例１）絶縁基板として接着剤層付き絶縁基板（日立
化成工業株式会社製ＡＣＬ−Ｅ−１６８）を用いる。EXAMPLES The present invention will be described below based on examples. Example 1) An insulating substrate with an adhesive layer (ACL-E-168 manufactured by Hitachi Chemical Co., Ltd.) is used as the insulating substrate.
【００１５】この絶縁基板にスルーホール用の孔を明け
る。孔明け後にめっき触媒を付着する。次に、めっきレ
ジストインクをスクリーン印刷してめっきレジスト層を
形成する。Through holes are formed in this insulating substrate. A plating catalyst is attached after drilling. Next, a plating resist ink is screen-printed to form a plating resist layer.
【００１６】めっきレジスト層を形成後、無電解銅めっ
き処理を２段階に分けて行う。最初のストライクめっき
により、厚さが約１０μｍの銅めっき層を形成する。次
に、水洗し、さらに、シアン化ナトリウム２０mg／ｌを
含むｐＨ５の水溶液に５分間ディップする。ディップ
後、後付けめっきして全体の厚さが３５μｍの銅めっき
層を形成する。After forming the plating resist layer, the electroless copper plating process is performed in two steps. A copper plating layer having a thickness of about 10 μm is formed by the first strike plating. Then, it is washed with water and further dipped in an aqueous solution of pH 5 containing 20 mg / l of sodium cyanide for 5 minutes. After the dipping, post plating is performed to form a copper plating layer having a total thickness of 35 μm.
【００１７】実施例２）実施例１において、水洗後に、
シアン化ナトリウム２０mg／ｌ及び界面活性剤としてポ
リエチレングリコール（分子量１０００）を１ｇ／ｌを
含む、ｐＨ５の水溶液に５分間ディップし、それ以外は
同一条件で製造する。Example 2) In Example 1, after washing with water,
Dip for 5 minutes in an aqueous solution containing 20 mg / l of sodium cyanide and 1 g / l of polyethylene glycol (molecular weight 1000) as a surfactant and having a pH of 5, and otherwise manufacture under the same conditions.
【００１８】また、比較のために次の条件で従来例を製
造する。 従来例 実施例１において、水洗後にシアン化ナトリウムを含む
水溶液にディップする処理を省く以外は同一条件とす
る。For comparison, a conventional example is manufactured under the following conditions. Conventional Example Under the same conditions as in Example 1, except that the process of dipping in an aqueous solution containing sodium cyanide after washing with water is omitted.
【００１９】次に、実施例１、実施例２及び従来例につ
いて、形成した銅めっき層の表面を目視により観察し、
不動態化の有無を調べた。その結果、実施例１及び実施
例２には不動態化している部分は無かった。しかし、従
来例では、一部不動態化していて、銅めっき層の厚さが
３５μｍない部分があった。Next, with respect to Examples 1, 2 and the conventional example, the surface of the formed copper plating layer was visually observed,
The presence or absence of passivation was investigated. As a result, in Examples 1 and 2, there was no passivated portion. However, in the conventional example, there was a portion that was partially passivated and the thickness of the copper plating layer was not 35 μm.
【００２０】[0020]
【発明の効果】以上の通り、請求項１の発明の製造方法
によれば、ストライクめっき後にシアン化合物を含むｐ
Ｈ２〜７の水溶液によりめっき層を処理することによ
り、めっき層が不動態化するのを防止できるとともにス
トライクめっきと後付けめっきとにより形成した各めっ
き層間の密着性を向上できるプリント配線板が得られ
る。また、請求項２の発明の製造方法によれば、シアン
化合物とともに界面活性剤を含む水溶液を用いて処理し
ているために、スルーホールのめっき層の不動態化をよ
り効果的に防止でき、密着性を向上できるプリント配線
板が得られる。As described above, according to the manufacturing method of the first aspect of the present invention, p containing a cyanide compound is formed after strike plating.
By treating the plating layer with an aqueous solution of H2 to 7, it is possible to obtain a printed wiring board that can prevent the plating layer from being passivated and improve the adhesion between the plating layers formed by strike plating and post-plating. . Further, according to the manufacturing method of the invention of claim 2, since the treatment is performed using an aqueous solution containing a cyanide compound and a surfactant, it is possible to more effectively prevent passivation of the plated layer of the through hole. A printed wiring board having improved adhesion can be obtained.
Claims (2)
うプリント配線板の製造方法において、各無電解めっき
処理の間にシアン化合物を含むｐＨ２〜７の水溶液によ
りめっき表面を処理することを特徴とするプリント配線
板の製造方法。1. A method for producing a printed wiring board, which comprises performing electroless plating treatment in two or more steps, wherein the plating surface is treated with an aqueous solution containing a cyanide compound at a pH of 2 to 7 during each electroless plating treatment. A method for manufacturing a characteristic printed wiring board.
剤を含むことを特徴とするプリント配線板の製造方法。2. The method for manufacturing a printed wiring board according to claim 1, wherein the aqueous solution contains a surfactant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3352895A JPH05167223A (en) | 1991-12-17 | 1991-12-17 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3352895A JPH05167223A (en) | 1991-12-17 | 1991-12-17 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05167223A true JPH05167223A (en) | 1993-07-02 |
Family
ID=18427188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3352895A Pending JPH05167223A (en) | 1991-12-17 | 1991-12-17 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05167223A (en) |
-
1991
- 1991-12-17 JP JP3352895A patent/JPH05167223A/en active Pending
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Legal Events
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|---|---|---|---|
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