JPH05166912A - Method of detecting heat-generating part of semiconductor integrated circuit - Google Patents
Method of detecting heat-generating part of semiconductor integrated circuitInfo
- Publication number
- JPH05166912A JPH05166912A JP3334980A JP33498091A JPH05166912A JP H05166912 A JPH05166912 A JP H05166912A JP 3334980 A JP3334980 A JP 3334980A JP 33498091 A JP33498091 A JP 33498091A JP H05166912 A JPH05166912 A JP H05166912A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- frost
- heat generating
- generating part
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体集積回路の発熱
部の検出方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting a heat generating portion of a semiconductor integrated circuit.
【０００２】[0002]
【従来の技術】半導体集積回路チップ（以下、ＩＣチッ
プと呼ぶ）の表面の最大発熱部や異常発熱部の検出方法
としては、特定の温度で発色する液晶をＩＣチップ表面
に塗布しＩＣチップに電源を印加して液晶を発色させる
ことによって発熱部を検出する液晶法や、ＩＣチップに
電源を印加し発熱部の発光を光電子増倍することによっ
て発熱部を検出する発光検出法などがある。2. Description of the Related Art As a method of detecting a maximum heat generation portion or an abnormal heat generation portion on the surface of a semiconductor integrated circuit chip (hereinafter referred to as an IC chip), a liquid crystal that develops at a specific temperature is applied to the surface of the IC chip to form an IC chip. There are a liquid crystal method in which a heat source is detected by applying a power source to cause the liquid crystal to develop color, and a light emission detection method in which a heat source is detected by applying a power source to an IC chip and multiplying the light emission of the heat source by photoelectron multiplication.
【０００３】[0003]
【発明が解決しようとする課題】上記従来のＩＣチップ
の発熱部の検出方法である液晶法や発光検出法では液晶
や発光検出装置などが必要であり費用が嵩んでしまい、
特に液晶法では、液晶の発色が見つけにくく、写真撮影
した場合でも写真での発熱部の特定も難しく、液晶の発
色温度レンジを選ぶのにも経験を要するという問題があ
る。The liquid crystal method and the light emission detection method, which are the conventional methods for detecting the heat generating portion of the IC chip, require liquid crystal and a light emission detection device, which increases costs.
In particular, the liquid crystal method has a problem that it is difficult to find the color of the liquid crystal, it is difficult to identify the heat generating part in the photograph even when the photograph is taken, and it takes experience to select the color temperature range of the liquid crystal.
【０００４】そこで、本発明はＩＣチップの表面の最大
発熱部や異常発熱部の検出について、これを従来の方法
より低費用かつ容易に行えるようにすることを目的とす
る。Therefore, an object of the present invention is to make it possible to detect the maximum heat generating portion and the abnormal heat generating portion on the surface of the IC chip more easily and at lower cost than the conventional method.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
本発明のＩＣチップの発熱部検出方法は、ＩＣチップに
冷却ガスを吹き付け該ＩＣチップを低温化することによ
り該ＩＣチップの表面に霜を付着させ、該ＩＣチップに
通電することにより発熱部の前記霜を溶かすことを特徴
とするものである。In order to achieve the above object, a method for detecting a heat generating portion of an IC chip according to the present invention is designed such that a cooling gas is blown to the IC chip to lower the temperature of the IC chip and frost is formed on the surface of the IC chip. Is adhered and the IC chip is energized to melt the frost in the heat generating portion.
【０００６】[0006]
【作用】本発明のＩＣチップの発熱部検出方法は、最大
発熱部や異常発熱部を発見するために、例えば冷却スプ
レーを用いて冷却ガスをＩＣチップに吹き付けこれによ
りＩＣチップの表面を低温化することで、ＩＣチップの
表面に霜を付着させ、ＩＣチップに通電することで、Ｉ
Ｃチップの表面の発熱部の霜を溶かし、これにより発熱
部の発見を容易にする。According to the method for detecting a heat generating portion of an IC chip of the present invention, in order to find the maximum heat generating portion or the abnormal heat generating portion, a cooling gas is blown to the IC chip by using, for example, a cooling spray to lower the temperature of the surface of the IC chip. By doing so, frost is attached to the surface of the IC chip, and the IC chip is energized.
The frost on the heat generating portion on the surface of the C chip is melted, which facilitates finding the heat generating portion.
【０００７】[0007]
【実施例】図１は、本発明のＩＣチップの発熱部検出方
法により発熱部の霜が溶けた状態を表した図、図２は本
実施例に必要な装置およびその配置を表した図である。
本実施例においては、ＩＣチップ１のパッケージ（図示
せず）を開封し又は密封前に、冷却スプレー６を用いて
冷却ガスをＩＣチップ１に吹き付け、これによりＩＣチ
ップ１の表面を低温化させ、霜３をＩＣチップ１の表面
に付着させる。次にＩＣチップ１に電源装置７によって
通電させると、ＩＣチップ１の発熱部４の部分だけは霜
３が溶かされるので、ＩＣチップ１の表面を顕微鏡５で
観察すると、発熱部４が容易に発見される。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a state in which frost is melted in a heat generating portion by a method for detecting a heat generating portion of an IC chip according to the present invention, and FIG. 2 is a diagram showing an apparatus necessary for this embodiment and its arrangement. is there.
In this embodiment, before the package (not shown) of the IC chip 1 is unsealed or sealed, a cooling gas is sprayed onto the IC chip 1 by using a cooling spray 6, thereby lowering the temperature of the surface of the IC chip 1. , Frost 3 is attached to the surface of the IC chip 1. Next, when the IC chip 1 is energized by the power supply device 7, the frost 3 is melted only in the heat generating portion 4 of the IC chip 1. Therefore, when the surface of the IC chip 1 is observed with the microscope 5, the heat generating portion 4 is easily formed. To be discovered.
【０００８】霜３が溶けた発熱部４の部分はＩＣチップ
１の表面の回路パターンが見え、他の部分は霜が付着し
ていて白くなっているので発熱部４が周囲と明確に特定
でき、写真撮影を行った場合、その写真にも発熱部４の
位置が明確に現れる。The circuit pattern on the surface of the IC chip 1 can be seen in the portion of the heat generating portion 4 where the frost 3 is melted, and the other portion is frosted and white, so that the heat generating portion 4 can be clearly identified from the surroundings. When a photograph is taken, the position of the heat generating portion 4 also clearly appears in the photograph.
【０００９】[0009]
【発明の効果】以上説明したように、本発明のＩＣチッ
プの発熱部検出方法は、ＩＣチップの表面を冷却する冷
却スプレー等の他には特別な解析装置は不要であり、最
大発熱部や異常発熱部では霜が溶かされるので周囲と明
確に区分でき、発熱部の発見が容易になる。As described above, the method for detecting a heat generating portion of an IC chip according to the present invention does not require a special analysis device other than a cooling spray for cooling the surface of the IC chip, and the maximum heat generating portion and Since the frost is melted in the abnormal heat generating part, it can be clearly distinguished from the surroundings, and the heat generating part can be easily found.
【図１】本発明のＩＣチップの発熱部検出方法により発
熱部の霜が溶けた状態を表した図である。FIG. 1 is a diagram showing a state in which frost on a heat generating portion is melted by an IC chip heat generating portion detecting method of the present invention.
【図２】本発明のＩＣチップの発熱部検出方法に必要な
装置およびその配置を表した図である。FIG. 2 is a diagram showing an apparatus necessary for the method of detecting a heat generating portion of an IC chip according to the present invention and its arrangement.
１ ＩＣチップ ２ ボンディ
ングワイヤ ３ 霜 ４ 発熱部 ５ 顕微鏡 ６ 冷却スプ
レー ７ 電源装置1 IC chip 2 Bonding wire 3 Frost 4 Heat generating part 5 Microscope 6 Cooling spray 7 Power supply device
Claims (1)
付け該半導体集積回路チップを低温化することにより該
半導体集積回路チップの表面に霜を付着させ、 該半導体集積回路チップに通電することにより発熱部の
前記霜を溶かすことを特徴とする半導体集積回路チップ
の発熱部検出方法。1. A heat generating part by blowing cooling gas to a semiconductor integrated circuit chip to lower the temperature of the semiconductor integrated circuit chip to cause frost to adhere to the surface of the semiconductor integrated circuit chip and to energize the semiconductor integrated circuit chip. 2. A method for detecting a heat generating portion of a semiconductor integrated circuit chip, which comprises melting the frost.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3334980A JPH05166912A (en) | 1991-12-18 | 1991-12-18 | Method of detecting heat-generating part of semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3334980A JPH05166912A (en) | 1991-12-18 | 1991-12-18 | Method of detecting heat-generating part of semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05166912A true JPH05166912A (en) | 1993-07-02 |
Family
ID=18283381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3334980A Withdrawn JPH05166912A (en) | 1991-12-18 | 1991-12-18 | Method of detecting heat-generating part of semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05166912A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004079380A1 (en) * | 2003-03-04 | 2004-09-16 | Isothermal Systems Research, Inc. | Apparatus and mthod for cooling optically probed integrated circ uits |
| US7102374B2 (en) | 2002-08-16 | 2006-09-05 | Credence Systems Corporation | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis |
| JP2015046532A (en) * | 2013-08-29 | 2015-03-12 | 信越半導体株式会社 | Evaluation method of semiconductor element |
-
1991
- 1991-12-18 JP JP3334980A patent/JPH05166912A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6836131B2 (en) | 2002-08-16 | 2004-12-28 | Credence Systems Corp. | Spray cooling and transparent cooling plate thermal management system |
| US7102374B2 (en) | 2002-08-16 | 2006-09-05 | Credence Systems Corporation | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis |
| US8076951B2 (en) | 2002-08-16 | 2011-12-13 | Dcg Systems, Inc. | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis |
| WO2004079380A1 (en) * | 2003-03-04 | 2004-09-16 | Isothermal Systems Research, Inc. | Apparatus and mthod for cooling optically probed integrated circ uits |
| JP2015046532A (en) * | 2013-08-29 | 2015-03-12 | 信越半導体株式会社 | Evaluation method of semiconductor element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990311 |