JP3453989B2 - Optical semiconductor device module - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element module for coupling emitted light of an optical semiconductor element that requires temperature control to an optical fiber.

[0002]

2. Description of the Related Art FIG . 2 shows, for example, an airtight container and a flat base made of a material having W and Cu as main components, which is formed by joining an electronic cooling element inside the container and performing cutting on the electronic cooling element. An optical semiconductor element that is joined to an insulating substrate on a base, an insulating substrate or a temperature sensing component that is joined to a temperature detecting component, an electronic circuit component having one end joined to the container, and a lens FIG. 2B is a sectional view for explaining the configuration of a conventional optical semiconductor element module in which a post made of the same material as the holding component is joined and a lens holding component is welded to the post, and FIG. 2B is the right side of FIG. 2A. FIG. In the figure, 1 is a container, 2 is a lens holding component, 3 is a post, 4 is a base, 5 is an electronic circuit component, 6 is an electronic cooling element, 7 is an optical semiconductor element bonded to an insulating substrate, and 8 is a temperature detection component. is there.

Next, the operation will be described. The temperature of the optical semiconductor element 7 changes due to self-heating during driving, an external environment in which the optical semiconductor element module is placed, and heat generation of the electronic circuit component 5 inside the optical semiconductor element module.

When the temperature detected by the temperature detecting component 8 is different from the set temperature, the electronic cooling element driving device outside the optical semiconductor element module drives the electronic cooling element 6 until the temperature detecting component 8 reaches the set temperature. . As a result, the temperature detecting component 8 is always constant at the set temperature. Therefore, like the temperature detecting component 8, the optical semiconductor element bonded on the base 4 also has a certain temperature.

[0005]

In the conventional optical semiconductor element module as described above, since the electronic cooling element 6 is bonded to the inner surface of the container 1, the heat generated in the electronic cooling element 6 is transferred to the optical semiconductor element module. While conducting the heat to the outer surface of the container 1 which is the heat dissipation surface, a temperature difference is generated due to the thermal resistance of the container 1 and the contact thermal resistance of the junction between the container 1 and the electronic cooling element 6, and the cooling capacity of the optical semiconductor element module is poor. It was

[0006]

[0007]

[0008]

[0009]

[0010]

[0011]

[0012]

The present invention has been made in order to solve the above problems, and even when a large temperature difference occurs between the external environmental temperature of the optical semiconductor element module and the set operating temperature of the optical semiconductor element, the optical semiconductor (EN) An optical semiconductor device module that can be operated normally without affecting the device too much.

The present invention also reduces the power consumption of the electronic cooling element used in the optical semiconductor element module.

[0015]

[0016]

In the optical semiconductor element module of the present invention, a part or the whole of the container 1 is composed of an insulating substrate of the electronic cooling element 6.

[0017]

[0018]

[0019]

[0020]

DETAILED DESCRIPTION OF THE INVENTION

Embodiment 1. 1 is a cross-sectional view showing a first embodiment of the present invention, and FIG. 1 (b) is a view of FIG. 1 (a) seen from the right side. In FIG. 1, 2, 3, 4, 5, 6, 7, 8 is exactly the same as the prior art, but the surface of the container 1 has an opening into which the electronic cooling element 6 is inserted, and the electronic cooling element 6 is inserted in the inserted state. 6 and the surface of the electronic cooling element 6 constitute the main heat dissipation surface of the optical semiconductor element module. Further, the fitting portion between the container 1 and the electronic cooling element 6 is hermetically sealed if necessary.

In the conventional structure mounted on the bottom of the container 1, the heat generated from the heat dissipation surface of the electronic cooling element 6 is transmitted to the bottom of the container 1 and is dissipated to the outside from the outer surface of the bottom of the container 1. The heat dissipation efficiency of the optical semiconductor element module is deteriorated due to the contact heat resistance with the heat dissipation surface of the electronic cooling element 6 and the heat resistance due to the material characteristics and shape of the container 1.

In the conventional optical semiconductor element module, there is also a method of reducing the thickness of the bottom surface of the container 1 in order to reduce the thermal resistance at the bottom surface. However, the rigidity balance of the container 1 depends on the shape and material characteristics of the container 1. Therefore, there is a risk that the bottom surface which is the main heat dissipation surface of the container 1 is bent due to the stress at the time of mounting the optical semiconductor element module, and a gap is created between the bottom surface and the mounting surface, which may deteriorate the heat dissipation effect of the optical semiconductor element module.

Therefore, in the optical semiconductor element module having the above-mentioned structure, the heat radiation surface of the electronic cooling element is directly exposed to the outside, so that the contact thermal resistance between the container 1 and the insulating substrate of the electronic cooling element 6 is increased. The thermal resistance due to the material characteristics and shape of the container 1 can be reduced.
Since the thickness of the bottom portion of the component has less influence on the heat radiation efficiency of the optical semiconductor element module, it can be made thicker and the thermal efficiency of the optical semiconductor element module can be improved. Although part of the container 1 is made of the insulating substrate of the electronic cooling element 6 in the first embodiment, the whole container 1 may be made of the insulating substrate.

[0024]

[0025]

[0026]

[0027]

[0028]

[0029]

[0030]

[0031]

[0032]

[0033]

[0034]

[0035]

[0036]

[0037]

[0038]

[0039]

[0040]

[0041]

[0042]

According to the present invention, compared with the conventional structure,
The contact thermal resistance between the container 1 and the insulating substrate of the electronic cooling element 6 and the thermal resistance due to the material characteristics and shape of the container 1 are eliminated, and the power consumption of the electronic cooling element 6 can be reduced or the cooling capacity of the optical semiconductor element module can be improved. .

[0043]

[0044]

[0045]

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of an optical semiconductor element module according to the present invention.

FIG. 2 is a cross-sectional view showing a conventional optical semiconductor device module.

[Explanation of symbols]

1 container, 2 lens holding parts, 3 posts, 4 bases, 5 electronic circuit parts, 6 electronic cooling elements, 7 optical semiconductor elements, 8 temperature detecting parts .

Claims (3)

(57) [Claims] 1. An optical semiconductor element, an electronic cooling element thermally coupled to the optical semiconductor element, a temperature sensing component thermally coupled to the optical semiconductor element , the optical semiconductor element and a temperature sensing component. Accommodating
In addition, the heat dissipation surface of the electronic cooling element is directly exposed to the outside.
So that the electronic cooling element is inserted and fitted
Optical semiconductor element module including a container having a bottom
Due to the stress during mounting of the optical semiconductor device module.
The bottom of the container so that it does not bend.
The optical semiconductor element module is characterized in that the thickness of the bottom portion is increased. 2. The container has a mounting surface for mounting a bottom surface.
Make sure that the bottom is thick so that there is no gap between
An optical semiconductor device module according to claim 1, characterized in that
Le. 3. The container has a bottom surface of the electronic cooling element.
Fits with the electronic cooling element on the same plane as the bottom surface
The optical semiconductor according to claim 1, wherein the portion is hermetically sealed.
Body element module.