JPH05165044A - Surface mounted package - Google Patents

Surface mounted package

Info

Publication number
JPH05165044A
JPH05165044A JP33172291A JP33172291A JPH05165044A JP H05165044 A JPH05165044 A JP H05165044A JP 33172291 A JP33172291 A JP 33172291A JP 33172291 A JP33172291 A JP 33172291A JP H05165044 A JPH05165044 A JP H05165044A
Authority
JP
Japan
Prior art keywords
input
liquid crystal
signal line
surface mount
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33172291A
Other languages
Japanese (ja)
Inventor
Yoshito Date
義人 伊達
Shoichi Takeshita
昭一 竹下
Tetsuo Omori
哲郎 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP33172291A priority Critical patent/JPH05165044A/en
Publication of JPH05165044A publication Critical patent/JPH05165044A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Liquid Crystal (AREA)

Abstract

PURPOSE:To facilitate signal wiring on the input side and provide possibility of working well with a number of input signals by enlarging the package width on the input terminal side relative to the package width on the output side of a driving LSI on a liquid crystal display panel. CONSTITUTION:When a plurality of driving LSIs 102 are to be mounted on a liquid crystal display panel 101, the output side is given a larger width than the input side in order to widen the input pitch of surface-mount packages 103, 106-108. The enlarged input side parts of these surface-mount packages are overlapped in such a way that they do not touch one another and are mounted on the liquid crystal panel 101. According to this arrangement where the incoming signal line 105 is wider than the outgoing signal line 4, the inter- wire pitch of the incoming signal line 105 becomes coarser than the inter-wire pitch of the outgoing signal line 104, which facilitates mounting on a printed circuit board 109.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、液晶表示パネルの駆動
LSIの表面実装パッケージに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount package of a drive LSI for a liquid crystal display panel.

【0002】[0002]

【従来の技術】近年、コンピュータの小型軽量化が進
み、携帯可能なコンピュータが一般的になってきてお
り、表示装置には液晶パネルが使用されることが多い。
この液晶パネルは、薄くて軽量に作製できるため、将来
的には、従来のCRTに置き換わる表示装置として注目
を集めている。
2. Description of the Related Art In recent years, as computers have become smaller and lighter, portable computers have become common, and liquid crystal panels are often used as display devices.
Since this liquid crystal panel can be manufactured to be thin and lightweight, it is attracting attention as a display device that replaces a conventional CRT in the future.

【0003】一方、コンピュータの表示システムから出
力するディジタル表示データを、直接入力する駆動LS
Iが開発されてきており、多階調表示化が進む中で入力
信号線数が増加しつつある。そのためTABの入力ピッ
チが狭くなり、実装が困難となる傾向にある。
On the other hand, a drive LS for directly inputting digital display data output from a display system of a computer.
I has been developed, and the number of input signal lines is increasing as multi-gradation display progresses. Therefore, the input pitch of the TAB is narrowed, and the mounting tends to be difficult.

【0004】以下、従来の表面実装パッケージについ
て、図2の従来の表面実装パッケージによる液晶表示装
置の構成図を参照しながら説明する。
A conventional surface mount package will be described below with reference to the configuration diagram of a liquid crystal display device using the conventional surface mount package shown in FIG.

【0005】図において、101は液晶パネル、102
は駆動LSI、203は表面実装パッケージ、204は
駆動LSI102からの出力信号線、205は駆動LS
I102への入力信号線、206〜208は液晶パネル
101を表示させるために必要な出力信号線数分の表面
実装パッケージ、209は全ての表面実装パッケージに
入力信号を供給するプリント配線基板、210はコンピ
ュータの表示システムからの表示データと制御信号を供
給する信号線である。
In the figure, 101 is a liquid crystal panel, and 102 is
Is a drive LSI, 203 is a surface mount package, 204 is an output signal line from the drive LSI 102, and 205 is a drive LS.
Input signal lines to I102, 206 to 208 are surface mount packages for the number of output signal lines required to display the liquid crystal panel 101, 209 is a printed wiring board that supplies input signals to all the surface mount packages, and 210 is It is a signal line for supplying display data and control signals from a display system of a computer.

【0006】以上のように構成された従来の液晶表示装
置の表面実装パッケージについて、以下に説明する。
A conventional surface mount package for a liquid crystal display device constructed as described above will be described below.

【0007】各表面実装パッケージの出力信号線204
の線間ピッチは、液晶パネル101のサイズと表示画素
数によって決まる。入力信号線205の線間ピッチも、
液晶パネル101のサイズと入力信号線数によって決ま
る。通常、出力信号線数の方が入力信号線数よりも多い
ため、出力信号線204の線間ピッチの方が入力信号線
205の線間ピッチよりも狭い。
Output signal line 204 of each surface mount package
The line pitch is determined by the size of the liquid crystal panel 101 and the number of display pixels. The pitch between the input signal lines 205 is also
It depends on the size of the liquid crystal panel 101 and the number of input signal lines. Normally, the number of output signal lines is larger than the number of input signal lines, and therefore the pitch between lines of the output signal lines 204 is narrower than the pitch between lines of the input signal lines 205.

【0008】したがって、従来の表面実装パッケージで
は、まず狭い信号線間ピッチの出力側から表面実装パッ
ケージを液晶パネル101に実装する。そのあと広いピ
ッチの入力側をプリント配線基板209に実装する。プ
リント配線基板209は、線膨張係数を持ち、液晶パネ
ルの水平方向に伸び縮みするため、表面実装パッケージ
に許容される入力信号線間ピッチは出力側の対して大き
な値となる。表示階調の低い駆動LSIの場合、データ
のビット幅も小さくて済み、入力信号数が少ないため、
この表面実装パッケージで実装可能である。
Therefore, in the conventional surface mount package, the surface mount package is first mounted on the liquid crystal panel 101 from the output side having a narrow pitch between signal lines. After that, the input side having a wide pitch is mounted on the printed wiring board 209. Since the printed wiring board 209 has a coefficient of linear expansion and expands and contracts in the horizontal direction of the liquid crystal panel, the pitch between the input signal lines allowed for the surface mount package becomes a large value on the output side. In the case of a drive LSI with a low display gradation, the bit width of data can be small and the number of input signals is small,
It can be mounted with this surface mount package.

【0009】[0009]

【発明が解決しようとする課題】しかしながら、表示階
調数が高くなるとデータのビット幅が大きくなり、入力
信号数が多くなるため、上記従来の表面実装パッケージ
では、入力信号線間のピッチが小さくなり、実装が困難
となる。
However, since the bit width of data increases and the number of input signals increases as the number of display gradations increases, the pitch between the input signal lines is small in the above-mentioned conventional surface mount package. It becomes difficult to implement.

【0010】本発明は、上記従来の課題を解決するもの
で、多数の入力信号に対応した表面実装パッケージを提
供することを目的とする。
The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a surface mount package that can handle a large number of input signals.

【0011】[0011]

【課題を解決するための手段】本発明は上記目的を達成
するために、表面実装パッケージの入力ピッチを広げる
ため、表面実装パッケージの入力側の幅を出力側の幅よ
り大きくし、表面実装パッケージの広がった入力側の幅
の部分が、互いに接触しないように重なり合って液晶パ
ネルに実装している。
In order to achieve the above object, the present invention enlarges the input pitch of the surface mount package, so that the width of the input side of the surface mount package is made larger than the width of the output side. The parts of the width on the input side, which have spread, are mounted on the liquid crystal panel so that they do not touch each other.

【0012】[0012]

【作用】本発明は、上記した構成によって、表面実装パ
ッケージの入力側の幅が広がるため、入力側の許容配線
ピッチを緩和してプリント配線基板との実装を容易にし
ている。
According to the present invention, since the width of the surface mount package on the input side is widened by the above configuration, the allowable wiring pitch on the input side is relaxed to facilitate mounting on the printed wiring board.

【0013】[0013]

【実施例】以下、本発明の一実施例について図1を参照
しながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

【0014】図1において、103は入力信号線105
側の幅を出力信号線104側の幅より広くした本発明の
表面実装パッケージ、106〜108は液晶パネル10
1を表示させるために必要な出力信号数分の表面実装パ
ッケージ、109は全ての表面実装パッケージに入力信
号を供給するプリント配線基板、110はコンピュータ
の表示システムからの表示データと制御信号を供給する
ための信号線である。その他従来例のものと同一機能の
ものには同一符号を付している。
In FIG. 1, 103 is an input signal line 105.
The surface mount package of the present invention in which the width on the side is wider than the width on the side of the output signal line 104, 106 to 108 are the liquid crystal panel 10.
1 is a surface mount package for the number of output signals necessary to display 1, 109 is a printed wiring board that supplies input signals to all surface mount packages, and 110 is display data and control signals from the display system of the computer. Is a signal line for. The other components having the same functions as those of the conventional example are designated by the same reference numerals.

【0015】表面実装パッケージ103〜108の、間
隔の広がった入力信号線105の一部が、互いに隣接す
る他方の表面実装パッケージの入力信号線と接触しない
ように、液晶パネルに実装される。
The surface mount packages 103 to 108 are mounted on the liquid crystal panel so that a part of the input signal line 105 with the wide interval is not in contact with the input signal line of the other surface mount package adjacent to each other.

【0016】以上のように構成された本実施例の表面実
装パッケージについて、以下に説明する。
The surface mount package of this embodiment having the above structure will be described below.

【0017】各表面実装パッケージの出力信号線104
の線間ピッチは、液晶パネル101のサイズと表示画素
数によって決まる。入力信号線105の線間ピッチも、
液晶パネル101のサイズと入力信号線数によって決ま
る。本実施例の場合、表面実装パッケージの入力信号線
105側の幅に比べて出力信号線104側の幅が広いた
めに、入力信号線105の線間ピッチが出力信号線10
4の線間ピッチよりも広くなり、プリント配線基板への
実装が容易になる。
Output signal line 104 of each surface mount package
The line pitch is determined by the size of the liquid crystal panel 101 and the number of display pixels. The pitch between the input signal lines 105 is also
It depends on the size of the liquid crystal panel 101 and the number of input signal lines. In the case of the present embodiment, the width of the output signal line 104 side is wider than the width of the surface mount package on the input signal line 105 side.
The pitch becomes wider than the line pitch of 4 and the mounting on the printed wiring board becomes easy.

【0018】ただし、各表面実装パッケージの入力信号
線105側の幅が広くなっているため、表面実装パッケ
ージの重なり部分が発生するため、プリント配線基板に
は両面基板を使用するか、または2枚に分割して実装す
る。
However, since the width of each surface mount package on the side of the input signal line 105 is wide, an overlapping portion of the surface mount packages is generated. Therefore, a double-sided board is used for the printed wiring board, or two sheets are used. Implement by dividing into.

【0019】また、パッケージの幅を広くするのは入力
信号線105側に限られることはなく、出力信号線10
4側についても同じ構造で幅を広くすることができ、こ
れにより出力配線数の増加にも対応できる。
Further, the width of the package is not limited to the input signal line 105 side, but the output signal line 10 is widened.
The same structure can be used for the four sides to widen the width, and thus the number of output wirings can be increased.

【0020】[0020]

【発明の効果】本発明は、表面実装パッケージの入力信
号線側、もしくは入力信号線側および出力信号線側の表
面実装パッケージ幅を広げることで、液晶パネルの画像
の精密化に伴い入出力配線が増加しても、実装を容易に
することのできる。
According to the present invention, the width of the surface mount package on the input signal line side of the surface mount package or on the input signal line side and the output signal line side is widened, so that the input / output wiring is improved as the image of the liquid crystal panel is refined. Even if the number increases, the implementation can be facilitated.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の表面実装パッケージを実装した液晶表
示装置の構成を示す平面図
FIG. 1 is a plan view showing a configuration of a liquid crystal display device mounted with a surface mount package of the present invention.

【図2】従来の表面実装パッケージを実装した液晶表示
装置の構成を示す平面図
FIG. 2 is a plan view showing the configuration of a liquid crystal display device mounted with a conventional surface mount package.

【符号の説明】[Explanation of symbols]

101 液晶パネル 102 駆動LSI 103 表面実装パッケージ 104 出力信号線 105 入力信号線 106〜108 表面実装パッケージ 109 プリント配線基板 101 liquid crystal panel 102 drive LSI 103 surface mounting package 104 output signal line 105 input signal lines 106 to 108 surface mounting package 109 printed wiring board

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 液晶表示パネルの駆動LSIの出力端子
側のパッケージ幅に対して、入力端子側のパッケージ幅
を拡張して入力側の信号配線を容易にした表面実装パッ
ケージ。
1. A surface mount package in which a package width on an input terminal side is expanded with respect to a package width on an output terminal side of a drive LSI of a liquid crystal display panel to facilitate signal wiring on an input side.
【請求項2】 液晶表示パネルの複数個の駆動LSIの
実装において、各駆動LSIの入出力端子側のパッケー
ジ幅を拡張して、入力側および出力側の信号配線を容易
にする表面実装パッケージ。
2. A surface mount package for mounting a plurality of drive LSIs on a liquid crystal display panel, wherein the package width on the input / output terminal side of each drive LSI is expanded to facilitate signal wiring on the input side and the output side.
JP33172291A 1991-12-16 1991-12-16 Surface mounted package Pending JPH05165044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33172291A JPH05165044A (en) 1991-12-16 1991-12-16 Surface mounted package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33172291A JPH05165044A (en) 1991-12-16 1991-12-16 Surface mounted package

Publications (1)

Publication Number Publication Date
JPH05165044A true JPH05165044A (en) 1993-06-29

Family

ID=18246868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33172291A Pending JPH05165044A (en) 1991-12-16 1991-12-16 Surface mounted package

Country Status (1)

Country Link
JP (1) JPH05165044A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0739675A3 (en) * 1995-04-28 1997-04-16 Nec Corp Liquid crystal display panel holding metal fixture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0739675A3 (en) * 1995-04-28 1997-04-16 Nec Corp Liquid crystal display panel holding metal fixture
US5737043A (en) * 1995-04-28 1998-04-07 Nec Corporation Liquid crystal display panel holding metal fixture

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