JPH05164822A - Testing method for packaged circuit device - Google Patents

Abstract

PURPOSE:To carry out tests for malpackaging or solder-bridge or the like of surface packaged parts on a two-sided packaged circuit board efficiently in a short time, and to suppress cost or time required for development and manufacture of testing jigs. CONSTITUTION:Test probes 12, 13 arranged in both upper and lower sides of a two-sided packaged circuit board 9 to be tested respectively are scanned and transfered horizontally according to a preset program corresponding to wiring patterns on both sides of the circuit board 9. After transfering test probes 12, 13 just above or below a specified test position successively in a pre- programed order, a cylinder 14 is operated so as to contact tips of the probes 12, 13 to leads or the like of surface packaged parts 8 to detect continuity or the like between leads.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting an internal circuit and a mounting state (in-circuit test) of a mounted circuit device in which required electronic parts are mounted and mounted on a printed wiring board.

[0002]

2. Description of the Related Art Generally, regarding a mounting circuit device in which required electronic components are mounted and mounted on a printed wiring board, the mounting state of the electronic components such as erroneous mounting of the mounted electronic components and presence or absence of solder bridge As a means to inspect
(1) A pin jig type device in which a plate such as acrylic resin is provided with a plurality of pins for contacting the board to be inspected (to bring it into contact with a predetermined position), and (2) One side of the board to be inspected Fixture-less type device that drives and controls the contact probes (3 or more) placed on the side by (3) Place the substrate to be inspected on the mold that incorporates the contact probe and let the air around it. A fixtureless type device or the like configured to bring a probe into contact by vacuum suction using a suction mechanism is used.

By the way, in recent years, in response to the demand for lighter, thinner, shorter and smaller devices and higher functionality, the means for mounting electronic components on a printed wiring board has also changed from a lead-through mounting method to a surface mounting method, and this surface mounting method has also been adopted. Is also changing from single-sided mounting to double-sided mounting. When performing an in-circuit test to inspect the internal circuit and mounting state of the mounted electronic components in a double-sided mounting circuit device, the pin jig type device of (1) above or (2) and (3) The fixtureless type device allows a total of 2 on each side of the wiring board.
The method of conducting the inspection once is adopted.

However, since the above-mentioned one-sided inspection method is inefficient and the detection rate is low, as shown in a perspective view in FIG. 5, the inspected substrate 1 is provided with a pair of pin jigs from the upper and lower surfaces (both main surfaces). The pins 5 are sandwiched between the two and three, and the pins 5 are brought into contact with predetermined leads of the surface mount component 4 mounted on both sides to inspect the continuity and the like. Further, as also shown in a perspective view in FIG. 6, the substrate 1 to be inspected is sandwiched between the upper and lower surfaces (both main surfaces) by a vacuum mold 7 in which a plurality of test probes 6 are incorporated to surround the substrate 1 to be inspected. A vacuum is applied to bring the test probe 6 into contact with the surface-mounted component 4 on the inspected substrate 1 for inspection.

[0005]

However, such an inspection method has the following problems. That is, when performing in the implementation state shown in FIG.
Since two types of pin jigs 2 and 3 are required for the upper and lower surfaces of the board 1 to be inspected, not only is it costly, but also the positioning of the upper and lower pin jigs 2 and 3 requires accuracy, which results in a cure. The fixture mounting device becomes large-scale. Moreover, since a large number of pins are planted in the pin jigs 2 and 3, there is a problem that it takes a long period of time to design and manufacture the pin jigs 2 and 3.

Further, in the case of carrying out the embodiment shown in FIG. 6, not only the apparatus such as the vacuum mold 7 is expensive, but also the contact of the test probe 6 is deteriorated when the air leaks.
There is a problem that maintenance takes time and labor, and sometimes the inspection accuracy is poor. The present invention has been made to solve these problems, and an object of the present invention is to provide a method for inspecting a mounted circuit device, which enables an in-circuit test of a double-sided mounting board easily and in a short time.

[0007]

A method of inspecting a mounted circuit device according to the present invention is an inspection of a mounted circuit device in which required electronic parts are mounted and mounted on a printed wiring board provided with a predetermined wiring pattern. In the method, a plurality of inspection probes are arranged on both main surface sides of the wiring board, and these probes are respectively moved by scanning according to a program preset according to the wiring pattern, and a predetermined amount of the electronic component is set. Touch the lead or wiring pattern,
It is characterized by detecting conduction between them.

[0008]

According to the inspection method of the present invention, a plurality of inspection probes are arranged on both upper and lower sides of the mounting circuit device substrate to be inspected, and these inspection probes are formed on both sides of the substrate. According to a preset program corresponding to the wiring pattern thus set, each is scanned and moved to a predetermined position. Then, by bringing a predetermined probe into contact with a predetermined lead or wiring pattern of the electronic component, conduction between the leads can be easily and surely detected. Thus, according to the method of the present invention, it is possible to efficiently inspect mounting states such as erroneous mounting of electronic components mounted on both surfaces of the printed wiring board and solder bridges.

[0009]

Embodiments of the present invention will be described below with reference to FIGS.

First, as schematically shown in FIG. 1 as an implementation state, I are respectively placed at predetermined positions on both surfaces of the printed wiring board.
A double-sided mounting board 9 on which a surface-mounting component 8 such as a C package is mounted and mounted is introduced into an inspection unit 10 and fixed by a lever 11. Next, as also schematically shown in FIG. 2 in the implementation state, a plurality of test probes 12 and 13 respectively arranged on the upper and lower sides are preliminarily arranged so as to correspond to the wiring patterns on both surfaces of the substrate 9 forming the mounting circuit device. According to the set program, the scanning is moved in the horizontal direction. In this way, the test probes 12 and 13 are moved to a position directly above or below a predetermined inspection position in a pre-programmed order, and then the cylinder 14 is operated to bring the tips of the test probes 12 and 13 into contact with the leads of the surface mount component 8. Contact them to detect conduction between leads.

Therefore, the inspection of the continuity between the leads is performed as follows. That is, the set of the test probes 12 and 13 arranged on the upper and lower sides of the substrate to be inspected are respectively the plus (+) electrode probes 12a and 13a.
, Minus (-) electrode probes 12b and 13b, and guard electrode probes 12c and 13c. The scanning order and movement position of these probes can be freely set by a program. There is. Then, the inspection of the surface mount component 8 mounted on the printed wiring board is normally performed on the electrodes or leads at both ends of the component.
This is performed by bringing the + electrode probe 12a and the − electrode probe 12b into contact with each other. Further, at this time, if there is a wraparound of the external circuit, it is possible to surely inspect as follows. That is, as shown in a perspective view in FIG. 3, by contacting the guard electrode probe 12c with an appropriate wiring pattern or a lead of a component,
Although it is necessary to eliminate the external circuit, even when the lead of the component is not on the component mounting surface, one of the test probes 13 arranged on the opposite surface (solder surface) side is connected to the guard electrode probe 13c. It is possible to reliably perform the inspection by designating and contacting. Further, as shown in a perspective view in FIG. 4, conduction between the leads of the surface mount component 8 mounted / mounted on the surface of the printed wiring board and the leads of the component mounted / mounted on the opposite solder surface is maintained. Even when inspecting, the test probes are arranged on the upper and lower sides of the substrate to be inspected. Therefore, by appropriately designating these test probes and using them as the probe for each electrode, the inspection can be easily performed. ..

[0012]

As described above, according to the inspection method of the present invention, an in-circuit test such as erroneous mounting of surface-mounted components on a double-sided mounting board or a solder bridge can be efficiently performed in a short time. Further, since a pin jig or the like is unnecessary, it is possible to significantly reduce the cost and time required for the development and production of the inspection jig. Furthermore, switching of the product model to be inspected can be handled simply by switching the program that scans and moves the inspection probe, which shortens the setup period and is sufficient for a multi-model small-volume production system. Can correspond to.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing an embodiment of a mounting circuit device inspection method according to the present invention.

FIG. 2 is a perspective view schematically showing an embodiment of a mounting circuit device inspection method according to the present invention.

FIG. 3 is a perspective view showing another embodiment of the mounting circuit device inspection method according to the present invention.

FIG. 4 is a perspective view showing still another embodiment of the mounting circuit device inspection method according to the present invention.

FIG. 5 is a perspective view schematically showing an embodiment of a conventional pin jig type inspection method.

FIG. 6 is a perspective view schematically showing an embodiment of a conventional vacuum suction type inspection method.

[Explanation of symbols]

1 ... Inspected board 2, 3 ... Pin jig 4, 8 ... Surface mount component 6, 12, 13 ... Test probe 7 ... Vacuum type 9 ... Double-sided board 14 ... Cylinder

Claims (1)

[Claims] 1. A method for inspecting a mounted circuit device, comprising mounting and mounting required electronic components on a printed wiring board having a predetermined wiring pattern, wherein a plurality of wiring boards are provided on both main surface sides of the wiring board. An inspection probe is arranged, these probes are moved by scanning according to a preset program according to the wiring pattern, and they are brought into contact with a predetermined lead or wiring pattern of the electronic component to detect conduction between them. A method for inspecting a mounted circuit device, comprising: