JPH0516168A - Method and apparatus for separating gate residue of molded product - Google Patents

Abstract

PURPOSE:To automatically separate the gate residue of a molded product at the time of molding in the manufacture of a semiconductor device even in both of resin packages of single-side and double-side gates. CONSTITUTION:The predetermined part of the lower gate residue 4 and runner residues of a resin package 2 wherein the upper and lower gate residues 3, 4 are formed in an integrated state are placed on a receiving part 7. Force is downwardly applied to the receiving part 7 by a push-down part to separate the lower gate residue 4 and force is upwardly applied to the receiving part 7 by a push-up part 21 to separate the upper gate residue 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating a gate residue of a molded product when molding is performed in manufacturing a semiconductor device.

In recent years, a semiconductor package type in which a resin is molded is increasing in number because of its mass productivity and low cost. Since the resin package is injected with resin from one end of the end surface of the molding die, runner residue and gate residue are generated, and it is desired to separate these from the end surface of the resin package automatically and with good cut surface.

[0003]

2. Description of the Related Art Conventionally, resin package semiconductor devices are
When packaging, the semiconductor chip mounted on the die stage of the lead frame is injected into the cavity of the mold set in the internal space with a fluid resin and passed through the runner of the mold to form the gate. In general, it is injected and cured.

Here, a diagram for explaining the conventional gate remaining isolation is shown. In the case of packaging with the molding die as described above, as shown in FIGS. 5 (A) and 5 (B), the resin package 51 and the gate remainder 52 are connected to each other, and the gate remainder 52 and the runner remainder 53 are connected to each other to be integrated. In addition to the state, a part of the remaining gate is in close contact with the cradle 54a of the lead frame 54.

The remaining gate 52 and the remaining runner 53
When completing a resin package type semiconductor device,
It should not remain in the resin package 51 of this semiconductor device.

Therefore, in order to separate the resin package 51 and the remaining gate 52, the cradle 54a on the outer side of each lead frame 54 as shown in FIG.
After being fixed between the supporting jig 55 and the pressing jig 56, the runner presser 57 presses the runner remainder 53 in the direction of the arrow as shown in FIG. The gate rest 52 was folded and separated.

[0007]

By the way, there is a molded product in which resin is injected from both the upper gate and the lower gate when molding is performed with resin.

FIG. 6 shows a diagram for explaining the conventional molding by the upper and lower gates. FIG. 6A shows a partial view, and FIG. 6B shows an enlarged view of the upper gate and the lower gate. In FIGS. 6 (A) and 6 (B), holes near the outer leads of the lead frame 54 are perforated, and when resin is injected from the runner through the lower gate, the portion above the perforated portion of the lead frame 54 is located above the gate. By wrapping around, molding is performed from the upper and lower gates.
Therefore, after molding, in the resin package 51, the lower gate residue 52a and the upper gate residue 52b are integrated on both surfaces in a state where a part of the resin package 51 is in close contact with the lead frame 54, and the lower gate residue 52a and the runner residue 53 are integrated. It becomes a state.

However, when the resin package 51 is separated by the method shown in FIG. 5, only the lower gate residue 52a can be separated, and the upper gate residue 52 cannot be automatically separated.

Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a gate residual separation method for a molded product which automatically separates the gate residual in either one-sided or double-sided gate resin packages. And

[0011]

FIG. 1 is a diagram for explaining the principle of the present invention.

In FIG. 1, when a predetermined number of molded products are formed by molding a resin, a plurality of gates formed integrally on the end face of the molded product are separated from each other, and the gates of the molded product are separated. In order to separate the remaining parts, in the first step, the predetermined number of molded products are mounted on a mounting portion that is rotatable in the direction orthogonal to the longitudinal direction of the gate remaining, and linearly in the direction orthogonal to the longitudinal direction remaining of the gate. The predetermined part remaining on the gate is placed on the moving receiving part. In the second step, a force is applied to the receiving portion in one direction to move the receiving portion,
The remaining part of the gate is separated. Then, in a third step, a force is applied to the receiving portion in a direction opposite to the moving direction to move the receiving portion, and the remaining portion of the gate is separated.

Further, in a separating device for realizing the above separating method, a predetermined number of molded products are placed, a mounting portion which is rotatable in the longitudinal orthogonal direction of the remaining gate, and a predetermined portion remaining in the gate. And a receiving part that linearly moves in the longitudinal orthogonal direction of the remaining gate, and a first pressing means that separates a part of the remaining gate by applying a force in one direction moving to the receiving part to move the receiving part. And a second pressing means for applying a force to the receiving portion in a direction opposite to the moving one direction to move the receiving portion and separate the remaining portion of the remaining gate.

[0014]

As described above, the molded product is placed, and at the same time, a plurality of remaining gates remaining in the molded product, for example, upper gate remaining and lower gate remaining lower gate remaining predetermined portions are mounted on the receiving portions. To do. Then, a force is applied from one direction moving to the receiving portion, for example, an upward direction to separate the lower gate remainder. Then, a force is applied in the opposite direction, for example, downward to separate the remaining upper gate.

That is, since the forces in different directions are sequentially applied to the remaining gates, it becomes possible to separate the remaining gates formed on both sides, and it is possible to automatically mold resin molded packages of either single-sided or double-sided gates. It is possible to separate the remaining gate.

[0016]

FIG. 2 shows a block diagram of an embodiment of the present invention.
FIG. 2 shows a schematic side cross-section of a main part of the separation device 1 of the present invention, which is molded and molded by a molding die (not shown).
The resin package type semiconductor device 6 in which the upper gate remaining 3, the lower gate remaining 4 and the runner remaining 5 are connected to the resin package 2 which is a molded product immediately after being taken out from the And the remaining runner 5 are set on the receiving portion 7 and the placing plate 8 which is the placing portion.

The receiving portion 7 supported by the connecting plate 10 which is biased upward by the spring 9 and is linearly movable in the vertical direction, which is the direction orthogonal to the longitudinal direction of the remaining gates 3 and 4, is provided in the lower remaining gate 3. The predetermined portion and the remaining runner 5 are formed such that they can be mounted by fitting them. When the remaining runner 5 is fitted into this receiving portion 7 and mounted, the semiconductor device 6 can be set in a gate residual separating device in a stable state. Becomes

The connecting plate 10 is also rotatably connected by a connecting rotary shaft 13 to the tip of the mounting plate 8 which is rotatably connected by the rotating shaft 11 to the support plate 12.

Since the surface of the mounting plate 8 is flat, the semiconductor device 6 can freely move along the surface of the mounting plate 8.

Further, the support plate 12 is rotated by the rotating shaft 13 and the position of the support plate 12 is regulated by the urging force of the spring 15 on the side plate 14.

On the other hand, the first part is provided above the receiving part 7 and the connecting plate 10.
A push-down portion 16 which is a pushing means is disposed to push down the receiving portion 7 and the like. In addition, the first guide shaft 17 fixed to the connecting plate 10 passes through the inside of the spring 9, and the hole 18a of the bottom plate 18 is formed.
It penetrates through the inside of the holder 19 fitted to. A stop ring 20 is provided on the first guide shaft 17 to position the connecting plate 10 (the receiving portion 7) against the urging force of the spring 9.

The first guide shaft 17 has a second
Is fixed to the push-up portion 21 which is a pressing means of the holder 19, and is pushed by the push-up force of the push-up portion 21 through the first guide shaft 17 in accordance with the guide of the second guide shaft 22.
The connecting plate 10 and the receiving portion 7 are pushed up in the direction orthogonal to the longitudinal direction of the remaining gates (3, 4).

Next, the operation of the above separating apparatus 1 will be described with reference to FIGS. FIG. 3 is a diagram for explaining the manufacturing process of the present invention, and FIG. 4 is a side view in the manufacturing process of FIG. It should be noted that in FIG. 4, the separation mechanism is composed of front and rear stages.

First, as shown in FIG. 2, a resin which is a molded product in which an upper gate remaining 3, a lower gate remaining 4 and a runner remaining 5 are integrally formed on a resin package 2 which is a molded product by molding. Package 2
The lower gate remains 4 on the receiving part 7 while being placed on the placing plate 8.
And a part of the runner remaining 5 are placed. Therefore, when the receiving portion 7 is pressed downward from above the runner rest 5 by the pressing portion 16 in the direction perpendicular to the longitudinal direction of the rest of the gate, the resin package 2
As a result, the lower gate remaining portion 4 integrated with the runner remaining portion 5 is cut and separated (FIGS. 3A and 4A). In this case, since the mounting plate 8 is rotatable and an unreasonable force is not applied to the resin package 2, the cut surface can be improved.

Next, while pushing the force Fa to each row of the resin packages 2 to prevent the resin package 2 from falling, the push-up portion 21 is forced to force F.
When pushed up in the opposite direction to the above by b, the stop plate 20 pushes up the connecting plate 10 and the receiving portion 7 together with the holder 19 along the second guide shaft 22 via the first guide shaft. . At this time, the upper gate residue 3 is cut and separated from the resin package 2 (see FIG.
(B), FIG. 4 (B)). The force relationship in this case is Fb> 2F
a.

In this way, the separating device pushes down the push-down portion to separate the lower gate residue 4 and pushes up the push-up portion to separate the upper gate residue 3, so that the gate residue is on one side or both sides of the resin package. It can be automatically separated regardless of which is formed. As a result, it is possible to reduce the number of personnel in the gate residual separation step in the manufacturing of the semiconductor device, and to reduce the variation in the gate residual and stabilize the quality.

In the above embodiment, the case where the lower gate remainder is separated at the push-down portion and then the upper gate remainder is separated at the push-up portion has been shown, but the same effect can be obtained regardless of which step is performed first. It is a thing.

[0028]

As described above, according to the present invention, a force is applied from one direction to a receiving portion on which a predetermined portion of the remaining gate of a molded product integrally formed with the remaining gate is placed. By applying a force to separate the remaining part of the gate and then applying a force in the opposite direction to separate the remaining part of the gate, the remaining gate is automatically formed on one side or both sides of the molded product. It can be separated, and the number of workers can be reduced and the quality can be stabilized.

[Brief description of drawings]

FIG. 1 is a diagram illustrating the principle of the present invention.

FIG. 2 is a configuration diagram of an embodiment of the present invention.

FIG. 3 is a diagram for explaining a manufacturing process of the present invention.

FIG. 4 is a side view in the manufacturing process of FIG.

FIG. 5 is a diagram for explaining conventional gate residual isolation.

FIG. 6 is a diagram for explaining a conventional molding process using upper and lower gates.

[Explanation of symbols]

1 Separation device 2 resin package 3 Upper gate remaining 4 Lower gate remaining 5 Lanna remaining 6 Semiconductor device 7 Receiver 8 Placement plate 9,15 spring 10 Connection plate 11,13 rotation axis 12 Support plate 14 Side plate 16 Pressed part 17 First guide shaft 18 Bottom plate 19 holder 20 stop ring 21 Oshige 22 Second guide shaft

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location B29L 31:34 4F

Claims (2)

[Claims] 1. When a resin is molded to form a predetermined number of molded products (2), a plurality of remaining gates (3 to 5) are integrally formed on an end surface of the molded product (2). In the method for separating the remaining gates of the molded product, the predetermined number of molded products (2) are mounted on a mounting portion (8) rotatable in the longitudinal orthogonal direction of the remaining gates (3 to 5). Placing the predetermined portion of the remaining gate on the receiving portion (7) that moves linearly in the direction orthogonal to the longitudinal direction of the remaining portion (3-5) of the gate, and one direction of moving to the receiving portion (7). To move a part of the remaining gates (3 to 5) (4, 5) by applying force to the receiving part (7) and apply a force to the receiving part (7) in the opposite direction to the moving direction. The remaining part (3) of the remaining gate (3-5)
And a gate remaining separation method for a molded product, comprising: 2. A plurality of remaining gates (3 to 5) integrally formed on an end surface of the molded product (2) when a predetermined number of molded products (2) are formed by molding a resin. ) Is separated into the remaining gate separation device of the molded product, the predetermined number of molded products (2) are mounted, and the mounting portion (3-5) is rotatable in the longitudinal orthogonal direction. 8), a predetermined part (4,5) of the remaining gate (3-5), and a receiving part (7) that linearly moves in the direction orthogonal to the longitudinal direction of the remaining gate (3-5); A first pressing means (16) for separating a part (4,5) of the remaining gates (3-5) by applying a force in one direction to move the part (7), and the receiving part (6). 7) is moved by applying a force in the opposite direction to the moving one direction, and the remaining portion (3) of the remaining gate (3 to 5)
And a second pressing unit (21) for separating the gate remaining part separating device for a molded product.