JPH0515991B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is particularly effective when used for attaching and detaching electronic components such as semiconductor devices to and from burn-in boards used in IC testers.

[Conventional technology]

In aging inspections of electronic components such as semiconductor devices such as ICs (hereinafter simply referred to as ICs), the ICs are mounted on a board called a burn-in board, which has a series of sockets on its surface. A process is performed in which the product is left in a high temperature, highly humidified environment for a certain period of time.

Prior to such an inspection, it is first necessary to mount components into each socket on the burn-in board using a mounting means called a loader or loading device.

[Problem that the invention seeks to solve]

By the way, for burn-in boards like the one mentioned above, the socket size and arrangement pitch are determined for each standard of the IC to be mounted, and there are various standards for loader devices for mounting ICs on such burn-in boards. There was no universally available IC for this, and special equipment with different specifications had to be used depending on the burn-in board standard.

In particular, FP (flat package) or
For surface mounting type products such as PLCC (Plastic Leaded Chip Carrier), ICs are supplied lined up on a tray, and the spacing and number of sockets on the burn-in board vary depending on the product standard. In handling from the tray to the socket, it is difficult to change and control the amount of movement etc. for each IC standard, and it has been difficult to realize a loader mechanism that can be used universally for ICs of multiple types of standards.

The above also applies to an unloader device for taking out an IC from a burn-in board, and it is necessary to use a dedicated unloader device compatible with the socket arrangement of the burn-in board.

The present invention has been made in view of the above problems, and its purpose is to provide a general-purpose loader-unloader technology that is compatible with boards of a plurality of standards.

[Means for solving problems]

The present invention provides means for supplying a tray on which an IC can be placed, an intermediate pocket that adjusts the posture of the IC and is replaceable with one having a different number of pockets relative to the main body of the device, and the tray and the intermediate pocket. A first transfer head that transfers the ICs between the intermediate pockets according to a program or manual operation of the control unit, and sockets that are arranged on the side of the intermediate pocket and accommodate the ICs on the upper surface thereof are arranged in a matrix. and a second transfer head equipped with a suction pad that transfers ICs between the intermediate pocket and the socket on the board in units of rows according to a program or manual operation of a control unit. The intermediate pocket row and the suction pad row of the second transfer head have a unit structure that can be replaced in accordance with the number of unit rows of sockets on the board.

[Effect]

According to the above-mentioned means, by replacing the units of the intermediate pocket and the second transfer head in accordance with the number of arrays of sockets arranged on a board such as a burn-in board, a single device can accommodate multiple standards. A loading or unloading process compatible with a burn-in board, that is, an IC, can be easily realized.

In addition, by programming the amount and direction of movement of the first and second transfer heads,
Not only can automatic work be realized, but by providing defective socket information in advance when running the program, it is possible to prevent ICs from being installed in the defective sockets, and highly reliable IC tests can be realized.

〔Example〕

Fig. 1 is an overall perspective view showing a loader-unloader device that is an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a front view thereof, and Fig. 4 is a view showing the IC loading procedure from the front direction. FIG. 5 is an explanatory view as seen from the plane direction, and FIG. 6 is an explanatory front view showing the socket mounted on the burn-in board.

The loader unloader device 1 of this embodiment is a QFP
(Quad Flat Package) type semiconductor device (hereinafter referred to as
This is for attaching or removing an IC (simply referred to as IC2) to or from a socket 4 arranged on a burn-in board 3, and the burn-in board 3 has a large number of sockets 4 arranged in a matrix shape, and this burn-in board 3 is placed on the burn-in board 3. It has stage 5.

Here, to explain the bar-in board 3 in more detail, the bar-in board 3 has a large number of sockets 4 arranged in a matrix on its main surface, each consisting of a base body 6 and a cover body 8 that can be opened and closed around a shaft support 7. A predetermined measurement is performed while the IC 2 is held inside the socket 4 by the base 2 and the lid 8. The socket 4 of the burn-in board 3 may be similar to that used in general flat package type semiconductor devices, and is made of a material having a predetermined heat resistance temperature, such as glass epoxy resin, as shown in FIG. As shown, a cavity C for accommodating the IC 2 is formed at the center of the upper surface of the base body 6 which is integrally molded using a molded material. At the bottom of the cavity C, contact electrodes (not shown) that are in contact with each lead 2a of the IC 2 are arranged, and the contact electrodes are further electrically connected to a lead pin 10 protruding downward from the back surface of the base 6. . In addition, on the upper surface of the base body 6, position adjustment pins 21 with inclined surfaces 21a are protruded from the four corners of the cavity C, and are designed to prevent the IC 2 from shifting when it is housed in the cavity C. There is. Also, at one end of the upper surface of the base body 6, a lid body 8 that can be opened and closed around the shaft support 7 is provided.
is attached to the open position in a normal state by a biasing means 11 such as a spring. A hook 12 whose tip is biased inward of the lid 8 is attached to the end of the lid 8 in the direction opposite to the axis, and when the lid 8 is closed, the hook 12 The structure is such that the closed state of the socket 4 is maintained by the engagement of the tip with the lid 6 (the state shown by the two-dot chain line in FIG. 6). The hook 12 has an L-shaped cross section, and the rear end of the L-shape forms a lever 13. That is, when the socket 4 is in the closed state, by pressing the lever 13 portion of the hook 12, that is, the portion P in FIG. 6 from above, the engagement of the hook 12 with the base body 6 is released. The lid body 8 is opened by the urging force of the urging means 11.

On the upper surface of the apparatus main body 1a, the burn-in board 3 is arranged in the center, an intermediate pocket 14 is arranged on one side thereof, and a supply mechanism 28 for the IC 2 is provided outside of the intermediate pocket 14. As shown in FIG. 2, the supply mechanism 28 has two systems of belt conveyors 16a and 16b arranged in parallel to supply the trays 15 in the direction of the arrow.
The tray 15 shown by the dotted chain line is moved in a U-shape. That is, the tray 15
is located on the side of the intermediate pocket 14, and the first transfer head 17 takes out the IC 2 (during loader operation) and stores the IC 2 (during unloading).

The first transfer head 17 includes the linear guide 1
It is supported by a linear arm 20 extending from 8, and can move in the XY direction in FIG. 2 and in the Z direction in FIG. 3.

The intermediate pocket 14 has a unit structure in this embodiment, and can be easily replaced with one corresponding to the number of socket rows (four in FIG. 2) of the bar-in board 3 placed on the stage 5. It is said to be a structure. This intermediate pocket 14 is, for example, as shown in FIGS. 4 and 5,
Position adjustment pins 21 with inclined surfaces 21a toward the pocket direction are protruded from the four corners around the pocket 14a, and when the IC2 is naturally dropped at a predetermined height position above the pocket 14a, the package body of the IC2 is fixed. is positioned at a prescribed position at the bottom of the pocket 14a. Furthermore, a push pin 22 is configured to be able to protrude upward from the bottom surface of the pocket 14a, and the protrusion of the push pin 22 prevents the IC 2 from getting caught during its natural fall, ensuring a secure position. Compensation is achieved.

On the upper surface of the apparatus main body 1a, on the other side of the burn-in board 3, a second transfer head 23 movable in the X direction is arranged. As shown in FIG. 3, the transfer head 23 has at its lower end a number of suction pads 23a corresponding to the number of unit row sockets 4 of the burn-in board 3, and corresponding pushers 24, and is movable in the Y direction. and a roller 25. The suction pad 23a and the pusher 24 have a unit structure, and the transfer head 23
It is removably attached to the socket, and can be replaced with a unit corresponding to the number (four in FIG. 2) and arrangement of sockets 4 in the row direction on the bar-in board 3 to which the sockets 4 are applied. On the other hand, roller 2
5 can sequentially close the lids 8 of one row of sockets 4 to the base 6 by scanning one cycle in the Y direction, and on the other hand, this roller 25 closes the lids 8 by a pusher 24. lever 13
When pressed, the arrangement is such that it is retracted between the rows of sockets.

The supply mechanism 28 described above has a structure in which the first and second transfer heads 17 and 23 are both controlled by a control section 26 installed inside the upper surface of the main body 1a. The control 26 has a structure that allows program start-up and manual operation interrupt processing using an operation panel 27 provided on its upper surface.

Next, the loader operation by the loader-unloader device 1 of this embodiment will be explained. In the following explanation, the sockets 4 on the burn-in board 3 are assumed to have a standard of 4 rows x 10 columns, that is, 40 sockets, and accordingly, the intermediate pocket 14 also has 4 pockets 14a. A series of units are mounted on the pusher 2 of the second transfer head 23.
4 and the suction pad 23a are also equipped with four units.

First, when the tray 15 on which the IC 2 is placed is supplied to the supply mechanism 28, the belt conveyor 16a is operated under the control of the control unit 26, and the tray 15 is
to the side of the intermediate pocket 14.

Next, the linear arm 20 is moved along the linear guide 18 and the first transfer head 17 is moved to a predetermined position.
The suction pad 17a of the first transfer head 17 is positioned above the IC2, and the suction pad 17a of the first transfer head 17 is lowered to transfer the target IC.
It adsorbs 2 and rises again. At this time, a structure may be adopted in which the adsorption state of the IC 2 is detected by a sensor (not shown) or the like.

While the suction pad 17a holds the IC2 in its raised position, the actuator installed in the transfer head 17 operates to rotate the suction pad 17a 90 degrees in the axial direction, changing the direction of the IC2 package. (Figure 3a)). The reason why the package direction of the IC 2 is changed in this way is that the orientation of the IC 2 on the tray 15 specified by the product standard is different from the orientation of the IC 2 in the socket 4 according to the burn-in board 3 standard by 90 degrees. Therefore, when the IC 2 is supplied onto the tray 15 with its direction changed by 90 degrees, rotation of the suction pad 17a is not necessarily necessary.

With the suction pad 17a suctioning the IC2, the linear arm 20 moves along the linear guide 18 to the second position.
In the figure, each pocket 14a is moved to the right.
Release the adsorption of IC2 directly above the. This allows IC
As shown in FIG. 4, the package 2 falls naturally, and the package body falls into the bottom of the pocket 14a along the position adjustment pin 21, completing the posture adjustment. In addition, at this time, the pocket 14a
By repeating the protruding operation using the push pin 22 from the bottom two or several times, the pocket 1 of the IC2 is removed.
Inclination within 4a is prevented, and posture correction can be performed more completely. In the unlikely event that the posture correction is not completed even by the protruding operation of the push pin 22, that is, if the tilted IC 2 is present in any pocket 14a, this will be detected by an optical sensor or the like (not shown). to activate the alarm mechanism on the operation panel 27.

When the posture correction of all ICs 2 in the intermediate pocket 14 is completed, the first transfer head 17
is retracted to the left in FIG. 2, and subsequently the second transfer head 23 is moved to the left in the same figure and positioned directly above the intermediate pocket 14.

The second transfer head 23 then transfers the intermediate pocket 1
4 and adsorbs one row of IC2 with the suction pad 23a at the lower end, then rises again and moves horizontally to the target position on the burn-in board 3,
The IC2 is accommodated in each cavity C of the base body 6 of the socket 4 which is in an open state.
Thereafter, the roller 25 is loaded in the Y direction above the socket 4 in which the IC 2 is accommodated, thereby closing the socket 4.

The loader operation is completed by performing each of the above operations for all four rows of sockets on the burn-in board 3.

The above-mentioned series of operations by the first and second transfer heads 17, 23, etc. are all controlled according to a program of the control unit 26, and in this program, the number of sockets 4 of the burn-in board 3 to be mounted, Standard information such as the arrangement interval of the sockets 4 is stored in advance, and the amount of displacement of each transfer head 17, 23 in the XYZ directions is controlled based on this storage.

By the way, in the above explanation, it is assumed that all the sockets 4 on the burn-in board 3 are of good quality.
Although the case where the ICs 2 are installed in all of the sockets 4 has been described, depending on the burn-in board 3, there may be cases where the sockets 4 are partially damaged or have defects such as disconnection. In such a case, according to this embodiment, by inputting the row and column number of the defective socket 4a in advance, it is possible to forcibly branch the program. That is, when controlling the second transfer head 23, if there is a corresponding defective socket 4a based on the input defect information in the target socket row in which the transfer head 23 attempts to accommodate the IC2, the corresponding defective socket 4a is detected. The IC 2 is not adsorbed by the suction pad 23a from the intermediate socket 14, but the IC 2 is removed from the intermediate pocket 14 corresponding to the other non-defective socket 4.
Only adsorption of IC2 is performed. By performing such control, it is possible to skip the defective socket 4a and accommodate the IC 2 only in the good socket 4, thereby preventing measurement failures caused by the defective socket 4a.

Next, the unloader operation by the loader-unloader device 1 of this embodiment will be explained. During unloader operation, the ICs 2 are placed in each socket 4 of the burn-in board 3 on the stage 5, while an empty tray 15 is prepared in the supply mechanism 28 of this device. ing.

In this state, first, the second transfer head 23 descends to each row of sockets 4 one after another, and its pusher 24 presses the lever 13 of the hook 12 of the lid 8 to open the lid 8 of the socket 4. state.
When the lid 8 is opened for all the sockets 4 on the bar-in board 3, the second transfer head 23 is lowered to a predetermined row of sockets and the sockets 4 in the sockets 4 are moved.
Adsorbs IC2. This suction of IC2 is performed simultaneously for one row, and with the IC2 for one row being suctioned, the second transfer head 23 is moved to above the intermediate pocket 14, and dropped at a predetermined height position of the pocket 14a. be done.

The IC 2 accommodated in the intermediate pocket 14 as described above is moved to the first position in the same manner as in the loader operation described above.
are held by the suction pad 17a of the transfer head 17, taken out from the pocket 14a, and stored in the tray 15 one after another.

In the above explanation, we have taken as an example the case where the sockets 4 are installed as a burn-in board 3 in an arrangement specification of 4 rows x 10 columns, but one of the features of this embodiment is that it can be used as a burn-in board with other specifications. can also be used. That is, if the IC is small, it is also possible to use a burn-in board with a socket arrangement of 5 rows and 15 columns. In this case, the intermediate pocket 14 may be replaced with a unit having five pockets, and the second transfer head 23 may also be replaced with a unit having five suction pads 23a and pushers 24. At this time, a corresponding control program for the control unit 26 is also applied.

As described above, according to this embodiment, the intermediate pocket 14 and the second transfer head 23 are constructed to be replaceable with units corresponding to the socket rows of the burn-in board 3, and the control section 26 controls the By controlling the movement of the second transfer heads 17 and 23 in a corresponding manner, it is possible to efficiently attach and detach the IC 2 to and from the burn-in board 3 of various standards with a single device, thereby increasing versatility. A high-quality loader-unloader device 1 can be provided.

In addition, the intermediate pocket 14 enables accurate posture correction prior to mounting the IC 2 into the socket 4 by the second transfer head 23, and achieves reliable positioning when mounting the IC 2 into the socket 4. I can do it.

Furthermore, by making the suction pad 17a of the first transfer head 17, which transfers the IC 2 between the tray 15 and the intermediate pocket 14, rotatable by 90 degrees, the longitudinal direction of the tray 15 is aligned with the main body 1a of the apparatus.
It becomes possible to set the device in the width direction of the upper surface, and the installation length of the device can be suppressed.

The above description describes the field of application of the present invention,
Although the case where the application is applied to a burn-in board used for an IC with a QFP type package structure has been described, the application is not limited to this.
It can also be applied to burn-in boards used in ICs.

[Effects of this project]

According to the present invention, by replacing the intermediate pocket and the second transfer head unit in accordance with the number of sockets arranged on a board such as a burn-in board, a single device can handle ICs of a plurality of standards. A loading or unloading process corresponding to the above can be easily realized.

[Brief explanation of drawings]

Fig. 1 is an overall perspective view showing a loader-unloader device that is an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a front view thereof, and Fig. 4 is a view showing the IC loading procedure from the front direction. An explanatory view, FIG. 5 is an explanatory view seen from the plane direction, and FIG. 6 is an explanatory front view showing the socket mounted on the burn-in board. 1...Loader unloader device, 1a...Device body, 2...IC, 2a...Lead, 3...Burn-in board, 4...Socket, 4a...Defective socket, 5...Stage, 6...Base, 7... Pivot support, 8... Lid body, 10... Lead pin, 11...
Biasing means, 12... Hook, 13... Lever, 1
4... Middle pocket, 14a... Pocket, 15
... Tray, 16a, 16b ... Belt conveyor, 17 ... First transfer head, 17a ... Suction pad, 18 ... Linear guide, 20 ... Linear arm, 21 ... Position adjustment pin, 21a ... Inclination Surface, 22... Push pin, 23... Second transfer head, 23a... Suction pad, 24... Pusher, 25... Roller, 26... Control unit, 27...
Operation panel, 28... Supply mechanism, C... Cavity.

Claims (1)

[Claims] 1. Means for supplying a tray on which an IC can be placed;
An intermediate pocket that adjusts the posture of the IC and can be replaced with one having a different number of pockets relative to the main body of the device, and transfer of the IC between the tray and the intermediate pocket is controlled by a program in the control unit or by manual operation. a first transfer head, a board arranged on the side of the intermediate pocket and having sockets in which ICs are accommodated arranged in a matrix on its upper surface; and a first transfer head between the intermediate pocket and the socket on the board. It has a second transfer head equipped with a suction pad that transfers ICs row by row according to a program or manual operation of the control unit, and the intermediate pocket and the suction pad row of the second transfer head and A loader-unloader device characterized in that the loader-unloader device is composed of units that can be replaced in accordance with the number of unit rows of sockets on the board. 2 The program in the control section retrieves control information corresponding to the number of arrays of sockets on the board from the storage section and controls the movement of the transfer head, and also retrieves control information corresponding to the number of arrays of sockets on the board and controls the movement of the transfer head. 2. The loader-unloader device according to claim 1, wherein movement of the transfer head is controlled to avoid loading or unloading of the IC in the socket. 3. Claims 1 or 2, characterized in that the transfer head has a suction pad at its tip and a drive means capable of horizontal rotation of at least 90 degrees while the IC is suctioned. The loader-unloader device described in .