JPH0515878A - Treatment of waste slicing water - Google Patents

Treatment of waste slicing water

Info

Publication number
JPH0515878A
JPH0515878A JP17257691A JP17257691A JPH0515878A JP H0515878 A JPH0515878 A JP H0515878A JP 17257691 A JP17257691 A JP 17257691A JP 17257691 A JP17257691 A JP 17257691A JP H0515878 A JPH0515878 A JP H0515878A
Authority
JP
Japan
Prior art keywords
slicing
water
bacteria
waste
fine particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP17257691A
Other languages
Japanese (ja)
Inventor
Takayoshi Ito
孝良 伊藤
Koichi Matsumoto
紘一 松本
Itsuki Koto
厳 古藤
Takashi Ogawa
高史 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP17257691A priority Critical patent/JPH0515878A/en
Publication of JPH0515878A publication Critical patent/JPH0515878A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W10/00Technologies for wastewater treatment
    • Y02W10/10Biological treatment of water, waste water, or sewage

Landscapes

  • Auxiliary Devices For Machine Tools (AREA)
  • Biological Treatment Of Waste Water (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

PURPOSE:To improve the quality of filtered water and to reuse it as the cutting water by removing the coarse grain in a waste slicing water with a filter, suppressing the propagation of bacteria with aeration and discharging the sludge consisting of bacteria and fine particles outside the system by backwashing and blowing. CONSTITUTION:A waste slicing water sent by a feed pump 9 is filtered by a cartridge filter 1, and then aerated in the circulating tank 2 provided with a polyolefin diffuser cylinder 3. The waste slicing water in the tank 2 is supplied by a circulating pump 4 to the ultrafilter membrane module 5 of polyolefin hollow fiber type having 13,000 fractional mol.wt. The filtrate is stored in a tank 6, discharged outside the system as the filtrate and reused as cutting water. The sludge consisting of bacteria and fine particles accumulated at the module inlet is backwashed and blown once a day and discharged outside the system.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はスライシング排水の処理
方法に関する。さらに詳しくは、電子産業で排出するス
ライシング排水をろ過膜でろ過して、ろ過水は切削水と
して再使用するスライシング排水の処理方法に関するも
のである。
FIELD OF THE INVENTION The present invention relates to a method for treating slicing wastewater. More specifically, the present invention relates to a method for treating slicing wastewater, which is obtained by filtering slicing wastewater discharged in the electronics industry with a filtration membrane and reusing the filtered water as cutting water.

【0002】[0002]

【従来の技術】半導体材料で最も多く使用されるのがシ
リコンである。シリコンを用いた半導体の加工に、シリ
コンインゴットの切断がある。切断した結晶板はウエハ
ーと呼ばれる。切断にはダイヤモンド砥粒が被覆された
円盤状のブレードまたはワイヤソーが使用される。切断
時、潤滑性と冷却性を付与し、ブレードまたはワイヤソ
ーの寿命延長とウエハーの収率を上げる目的で切削水が
使用される。水に水溶性切削油を1〜5%添加したもの
が切削水として使用される。水溶性切削油は高価であり
切削水の使用量が多いことから、シリコン微粒子と水溶
性切削油を含むスライシング排水は、シリコン微粒子を
分離して再度使用される。微粒子と切削水の分離には、
ろ布に珪藻土をプレコートしたろ過膜や精密ろ過膜およ
び限外ろ過膜等が使用されている。
Silicon is the most commonly used semiconductor material. The processing of semiconductors using silicon includes cutting of silicon ingots. The cut crystal plate is called a wafer. A disk-shaped blade coated with diamond abrasive grains or a wire saw is used for cutting. Cutting water is used for the purpose of imparting lubricity and cooling during cutting, extending the life of the blade or wire saw, and increasing the yield of wafers. Water containing 1 to 5% of water-soluble cutting oil is used as cutting water. Since the water-soluble cutting oil is expensive and the amount of cutting water used is large, the slicing waste water containing the silicon fine particles and the water-soluble cutting oil is used again after separating the silicon fine particles. For separating fine particles and cutting water,
Filter membranes pre-coated with diatomaceous earth, microfiltration membranes and ultrafiltration membranes are used.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、ろ布に
珪藻土をプレコートしたろ過膜を使用する方法は、0.
5ミクロン以下のシリコン微粒子がリークし、またろ過
水は繰り返し使用するため細菌が繁殖して切削水として
の性能が低下する。ほかにろ布が目づまりして処理能力
が低下し、低下した時のろ布洗浄が大変であるといった
問題がある。また、精密ろ過膜や限外ろ過膜を使用する
方法は、繁殖した細菌とシリコン微粒子からなるスラッ
ジで膜モジュールの入り口の詰まりによる処理能力の低
下と、膜表面の目づまりによる処理能力の低下という問
題点があった。
However, the method of using a filter membrane in which diatomaceous earth is pre-coated on the filter cloth is not recommended.
Silicon microparticles of 5 microns or less leak, and since the filtered water is repeatedly used, bacteria propagate and the performance as cutting water deteriorates. In addition, there is a problem that the filter cloth is clogged and the processing ability is lowered, and it is difficult to wash the filter cloth when the throughput is lowered. In addition, the method that uses microfiltration membranes and ultrafiltration membranes is called sludge consisting of bacteria and silicon fine particles that have propagated, resulting in a decrease in treatment capacity due to clogging of the inlet of the membrane module and a decrease in treatment capacity due to clogging of the membrane surface. There was a problem.

【0004】[0004]

【課題を解決するための手段】本発明者らは、上記問題
点を解決するために鋭意検討した結果、細菌の代謝生産
物による膜モジュールの入り口の詰まりの大部分は、嫌
気性細菌の代謝生産物によるものであることを見出だ
し、エアレーションをすることによって著しく改良され
ること、及び膜モジュールの入り口は、あらかじめ粗粒
子をフィルターで除去すると共に、逆洗ブローおよびま
たは逆循環ブローによって、膜モジュール入り口に詰ま
った細菌および微粒子からなるスラッジをスライシング
排水ろ過装置の系外に排出することによって解決するこ
とを見出し、本発明にいたった。
Means for Solving the Problems As a result of intensive studies for solving the above-mentioned problems, the present inventors found that most of the clogging of the entrance of the membrane module by the metabolic products of bacteria is due to the metabolism of anaerobic bacteria. Found to be by product, significantly improved by aeration, and the inlet of the membrane module is pre-filtered to remove coarse particles, while the backwash blow and / or the reverse circulation blow causes the membrane to The inventors have found that the problem can be solved by discharging sludge consisting of bacteria and fine particles clogging the module inlet to the outside of the system of a slicing drainage filtration device, and completed the present invention.

【0005】すなわち本発明は、スライシング排水をろ
過膜でろ過し、ろ過水を切削水として再使用する処理方
法において、(1)あらかじめ粗粒子をフィルターで除
去すること、(2)細菌の繁殖をエアレーションにより
抑制すること、(3)逆洗ブローおよび/または逆循環
ブローで細菌および微粒子からなるスラッジをスライシ
ング排水ろ過装置の系外に排出することを特徴とするス
ライシング排水の処理方法である。
That is, according to the present invention, in a treatment method in which slicing waste water is filtered with a filtration membrane and the filtered water is reused as cutting water, (1) removing coarse particles in advance with a filter, and (2) bacterial growth. It is a method for treating slicing wastewater, which is characterized by suppressing by aeration, and (3) discharging sludge consisting of bacteria and fine particles to the outside of the system of a slicing wastewater filtering apparatus by backwash blow and / or reverse circulation blow.

【0006】以下、本発明を詳細に説明する。まず、具
体例をシリコンインゴットの切断で排出するシリコンの
粗粒子と微粒子および水溶性切削油を含むスライシング
排水の処理方法について述べる。本発明であらかじめ粗
粒子の除去に用いるフィルターは、シリコンおよびその
他の粗粒子をカットするものであればなんでも良いが、
短径が25〜200ミクロンの孔をもったカートリッジ
フィルターもしくはバッグフィルターが適している。な
お、フィルターの取り替えは、フィルター付属の圧力計
が一定の圧力になった時点で行う。
The present invention will be described in detail below. First, a specific example will be described of a method for treating slicing wastewater containing coarse particles and fine particles of silicon and water-soluble cutting oil discharged by cutting a silicon ingot. The filter used for removing coarse particles in advance in the present invention may be any as long as it cuts silicon and other coarse particles,
Cartridge filters or bag filters with pores of short diameter 25-200 microns are suitable. The filter should be replaced when the pressure gauge attached to the filter reaches a certain pressure.

【0007】スライシング排水中には好気性細菌、嫌気
性細菌および硫酸還元菌等が繁殖しているが、エアレー
ションによって嫌気性細菌および硫酸還元菌の繁殖が抑
制される。エアレーションの場所および方法は、スライ
シング排水処理システム内であれば特に限定する必要は
ないが、スライシング排水を溜めるピットまたはタンク
およびスライシング排水の流れる配管中に市販の散気筒
や円筒に0.1ミクロン〜5ミリの孔をあけた散気筒を
容器の底部に設置するとよい。エアーはスライシング排
水1000リットル当り100〜2000リットル/時
間を供給すると良い。
Aerobic bacteria, anaerobic bacteria, sulfate-reducing bacteria and the like propagate in the slicing wastewater, but the aeration suppresses the growth of anaerobic bacteria and sulfate-reducing bacteria. The location and method of aeration are not particularly limited as long as they are in the slicing wastewater treatment system, but a pit or tank for storing the slicing wastewater and a pipe having a flow of the slicing wastewater of 0.1 micron to a commercially available cylinder or cylinder are used It is advisable to install a dispersion cylinder with 5 mm holes at the bottom of the container. Air is preferably supplied at 100 to 2000 liters / hour per 1000 liters of slicing waste water.

【0008】循環タンク内の細菌およびシリコン微粒子
は、細菌およびシリコン微粒子を除去するためのバルブ
および配管によって、定期的にろ過装置内から逆洗ブロ
ーなどの手段により装置外へ除去される。すなわち、ろ
過膜の入り口に詰まる細菌および微粒子からなるスラッ
ジは、ろ過水で逆洗ブローするか、またはスライシング
排水を逆循環ブローする。あるいはこの両者を併用する
ことにより膜モジュール入り口のスラッジ化した細菌お
よびシリコン微粒子は濃縮されたスライシング排水とと
もに装置外へ排出することができる。
Bacteria and silicon fine particles in the circulation tank are periodically removed from the inside of the filtration device to the outside of the device by means such as backwash blow by a valve and piping for removing the bacteria and silicon fine particles. That is, the sludge made up of bacteria and fine particles clogging the inlet of the filtration membrane is backwashed with filtered water or the slicing wastewater is subjected to reverse circulation blowing. Alternatively, by using both of them together, sludge-forming bacteria and silicon fine particles at the inlet of the membrane module can be discharged out of the apparatus together with the concentrated slicing waste water.

【0009】シリコン微粒子の大きさは15ミクロン以
下なので、本発明に用いる膜モジュールのろ過膜の孔径
は10オングストロームから2ミクロンの限外ろ過膜お
よび精密ろ過膜が適している。膜の材質は特に限定する
必要がなく、ポリスルホン樹脂、ポリエーテルスルホン
樹脂、ポリオレフィン樹脂、フッソ樹脂、ポリ四フッ化
エチレン樹脂、アセチルセルロース樹脂、ポリビニルク
ロライド樹脂、ナイロン樹脂等の有機質膜およびアルミ
ナ、ジルコニア等の無機質膜が使用できる。
Since the size of the silicon fine particles is 15 microns or less, an ultrafiltration membrane or a microfiltration membrane having a pore size of the filtration membrane of the membrane module used in the present invention of 10 angstrom to 2 microns is suitable. The material of the film is not particularly limited, and organic films such as polysulfone resin, polyether sulfone resin, polyolefin resin, fluorine resin, polytetrafluoroethylene resin, acetyl cellulose resin, polyvinyl chloride resin, nylon resin, and alumina, zirconia. Inorganic membranes such as can be used.

【0010】長時間使用してろ過能力の低下した上記ろ
過膜は、強塩基性水溶液と接触させて再生処理できる。
例えば、0.2〜1規定の水酸化ナトリウムで処理すれ
ばろ過能力が回復する。次亜塩素酸ナトリウムを100
〜1000ppm併用するとさらに回復効果をあげるこ
とができる。
The above-mentioned filtration membrane, which has been deteriorated in filtration ability after being used for a long time, can be regenerated by bringing it into contact with a strongly basic aqueous solution.
For example, if it is treated with 0.2 to 1N sodium hydroxide, the filtration capacity is restored. 100 sodium hypochlorite
The recovery effect can be further enhanced by using together up to 1000 ppm.

【0011】[0011]

【実施例】以下、本発明の実施例および比較例によって
具体的に説明する。
EXAMPLES Hereinafter, examples and comparative examples of the present invention will be specifically described.

【0012】[0012]

【実施例1】図1に示すように、供給ポンプ(9)によ
り送られたスライシング排水を25ミクロンのカートリ
ッジフィルター(1)でろ過した後、循環タンク(2)
に受け入れた。循環タンクには、0.2ミクロンのポリ
オレフィン製の散気筒(3)を設けて、循環タンク内の
液量の2倍量/時間のエアレーションを行った。
Example 1 As shown in FIG. 1, the slicing wastewater sent by a supply pump (9) was filtered by a 25-micron cartridge filter (1) and then a circulation tank (2).
Accepted to. The circulation tank was provided with a 0.2-micron polyolefin dispersion cylinder (3), and aeration was performed at twice the amount of liquid in the circulation tank / hour.

【0013】通常のろ過は、バルブV−1、V−2、V
−3を開き、V−4、V−5、V−6を閉止し、循環タ
ンク内のスライシング排水を循環ポンプ(4)により、
バルブV−1を経て膜モジュール(5)(分画分子量1
3000、ポリアクリル系中空糸型限外ろ過膜)に供給
し、循環液はバルブV−2を経由して、循環タンク
(2)に戻す。ろ過液はろ液タンク(6)に貯められ、
系外にろ液として排出され、切削水として再使用される
(以上順路を白抜き矢印で示す)。また、循環タンク
(2)のスライシング排水の濃度を一定に保つために、
10分に10秒の頻度で、送液ポンプ(7)を運転し、
V−6を開いて濃縮液を排出する。
Normal filtration is performed by valves V-1, V-2, V
-3 is opened, V-4, V-5 and V-6 are closed, and the slicing wastewater in the circulation tank is circulated by the circulation pump (4).
Membrane module (5) via valve V-1 (fraction molecular weight 1
3000, a polyacrylic hollow fiber type ultrafiltration membrane), and the circulating liquid is returned to the circulating tank (2) via the valve V-2. The filtrate is stored in the filtrate tank (6),
It is discharged as a filtrate out of the system and reused as cutting water (the above-mentioned route is indicated by a white arrow). In order to keep the concentration of the slicing wastewater in the circulation tank (2) constant,
Operate the liquid feed pump (7) at a frequency of 10 seconds every 10 minutes,
Open V-6 and drain the concentrate.

【0014】モジュールの入り口に詰まる細菌および微
粒子からなるスラッジは、1日に1回の頻度で、逆洗ブ
ローと逆循環ブローを行う。まず、逆洗ブローは、循環
ポンプ(4)を停止し、バルブV−3、V−4を開くと
共に、V−1、V−2、V−5、V−6を閉止し、逆洗
ポンプ(8)を運転し、V−4よりろ液タンク(6)の
ろ液を系外へ排出する。
The sludge consisting of bacteria and fine particles clogging the entrance of the module is subjected to backwash blow and reverse circulation blow once a day. First, in the backwash blow, the circulation pump (4) is stopped, the valves V-3 and V-4 are opened, and V-1, V-2, V-5, and V-6 are closed, and the backwash pump is used. (8) is operated, and the filtrate in the filtrate tank (6) is discharged from the system V-4 to the outside of the system.

【0015】次に、逆循環ブローは逆洗ポンプ(8)を
停止し、バルブV−5を開くと共に、V−3を閉止し、
循環ポンプ(4)を運転し、バルブV−4より循環液を
系外へ排出する(以上逆洗ブロー、及び逆循環ブローの
順路を→で示す)。最後に、バルブV−1、V−2、V
−3を開くと共にV−4、V−5を閉止して、循環ポン
プ(4)を運転し、通常のろ過を行った。
Next, in the reverse circulation blow, the backwash pump (8) is stopped, the valve V-5 is opened, and V-3 is closed,
The circulation pump (4) is operated, and the circulating liquid is discharged to the outside of the system through the valve V-4 (the routes of the backwash blow and the reverse circulation blow are indicated by →). Finally, valves V-1, V-2, V
-3 was opened, V-4 and V-5 were closed, the circulation pump (4) was operated, and normal filtration was performed.

【0016】得られたろ過水の透視度(JIS.K10
10)は50cm以上で、細菌は測定されなかった。ろ
過能力は3週間も初期の80%を保持した。スラッジに
よる膜モジュール入口のろ過膜の詰まりは無かった。1
0倍濃縮されたスライシング排水からは約10万個の細
菌を測定した。
The transparency of the obtained filtered water (JIS.K10
10) was 50 cm or more, and no bacteria were measured. The filtration capacity retained the initial 80% for 3 weeks. There was no clogging of the filtration membrane at the inlet of the membrane module due to sludge. 1
About 100,000 bacteria were measured from the 0-fold concentrated slicing wastewater.

【0017】[0017]

【比較例1】実施例1と同様にろ過したが、循環タンク
(2)でエアレーションを行なわなかったところ、ろ過
能力は3週間後に初期の40%まで低下した。10倍濃
縮されたスライシング排水からは約30万個の細菌を測
定した。
Comparative Example 1 Filtration was carried out in the same manner as in Example 1, but when aeration was not carried out in the circulation tank (2), the filtration capacity decreased to 40% of the initial value after 3 weeks. About 300,000 bacteria were measured from the 10 times concentrated slicing wastewater.

【0018】[0018]

【比較例2】実施例1と同様にろ過したが、逆洗ブロー
も逆循環ブローも行なわなかったところ、ろ過能力は3
週間後に初期の50%まで低下した。
[Comparative Example 2] Filtration was carried out in the same manner as in Example 1, but neither backwash blow nor reverse circulation blow was performed, and the filtration capacity was 3
It decreased to 50% of the initial value after a week.

【0019】[0019]

【比較例3】スライシング排水をろ布に珪藻土をプレコ
ートしたろ過膜を用いてろ過した。ろ過水の透視度は1
0cmで、約2000個/mlの細菌が測定された。ろ
過能力は1週間後に初期の30%まで低下した。
[Comparative Example 3] The slicing waste water was filtered using a filter membrane prepared by pre-coating diatomaceous earth on a filter cloth. Permeability of filtered water is 1
At 0 cm, about 2000 bacteria / ml were measured. The filtration capacity decreased to 30% of the initial value after one week.

【0020】[0020]

【発明の効果】以上より明らかなごとく、この発明によ
ればスライシング排水を処理して得られるろ過水は、水
質が向上するため切削水として再使用できる。また、処
理能力も安定しているため自動省力化できて産業上極め
て有用である。
As is apparent from the above, according to the present invention, the filtered water obtained by treating the slicing wastewater has improved water quality and can be reused as cutting water. Further, since the processing capacity is stable, it is possible to automatically save labor, which is extremely useful in industry.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1で用いたスライシング排水ろ過装置。FIG. 1 is a slicing drainage filtration device used in Example 1.

【符号の説明】[Explanation of symbols]

P 圧力計 V バルブ 1 カートリッジフィルター 2 循環タンク 3 散気筒 4 循環ポンプ 5 膜モジュール 6 ろ液タンク 7 送液ポンプ 8 逆洗ポンプ 9 供給ポンプ P Pressure gauge V Valve 1 Cartridge filter 2 Circulation tank 3 Dispersion cylinder 4 Circulation pump 5 Membrane module 6 Filtrate tank 7 Liquid feed pump 8 Backwash pump 9 Supply pump

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C02F 3/02 Z 6647−4D // C02F 9/00 A 6647−4D (72)発明者 小川 高史 静岡県富士市鮫島2番地の1 旭化成工業 株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical display location C02F 3/02 Z 6647-4D // C02F 9/00 A 6647-4D (72) Inventor Takashi Ogawa Asahi Kasei Kogyo Co., Ltd. 1 No. 2 Samejima, Fuji City, Shizuoka Prefecture

Claims (1)

【特許請求の範囲】 【請求項1】 スライシング排水をろ過膜でろ過し、ろ
過水を切削水として再使用する処理方法において(1)
あらかじめ粗粒子をフィルターで除去すること、(2)
細菌の繁殖をエアレーションにより抑制すること、
(3)逆洗ブローおよび/または逆循環ブローで細菌お
よび微粒子からなるスラッジをスライシング排水ろ過装
置の系外に排出することを特徴とするスライシング排水
の処理方法。
Claim: What is claimed is: 1. A treatment method in which slicing wastewater is filtered through a filtration membrane and the filtered water is reused as cutting water (1).
Remove coarse particles with a filter in advance, (2)
Suppressing the growth of bacteria by aeration,
(3) A method for treating slicing wastewater, which comprises discharging sludge composed of bacteria and fine particles to the outside of a slicing wastewater filtering device by backwashing blow and / or reverse circulation blow.
JP17257691A 1991-07-12 1991-07-12 Treatment of waste slicing water Withdrawn JPH0515878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17257691A JPH0515878A (en) 1991-07-12 1991-07-12 Treatment of waste slicing water

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17257691A JPH0515878A (en) 1991-07-12 1991-07-12 Treatment of waste slicing water

Publications (1)

Publication Number Publication Date
JPH0515878A true JPH0515878A (en) 1993-01-26

Family

ID=15944400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17257691A Withdrawn JPH0515878A (en) 1991-07-12 1991-07-12 Treatment of waste slicing water

Country Status (1)

Country Link
JP (1) JPH0515878A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108355496A (en) * 2018-05-16 2018-08-03 无锡格物环保技术有限公司 Ultrafiltration circulating tank for waste emulsified mixture processing
CN112720888A (en) * 2020-12-25 2021-04-30 句容协鑫光伏科技有限公司 Diamond wire-electrode cutting circulation system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108355496A (en) * 2018-05-16 2018-08-03 无锡格物环保技术有限公司 Ultrafiltration circulating tank for waste emulsified mixture processing
CN112720888A (en) * 2020-12-25 2021-04-30 句容协鑫光伏科技有限公司 Diamond wire-electrode cutting circulation system

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