JPH051562B2 - - Google Patents

Info

Publication number
JPH051562B2
JPH051562B2 JP61092669A JP9266986A JPH051562B2 JP H051562 B2 JPH051562 B2 JP H051562B2 JP 61092669 A JP61092669 A JP 61092669A JP 9266986 A JP9266986 A JP 9266986A JP H051562 B2 JPH051562 B2 JP H051562B2
Authority
JP
Japan
Prior art keywords
powder
silver
copper
fine
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61092669A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6280907A (ja
Inventor
Takashi Shoji
Kenji Ochiai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of JPS6280907A publication Critical patent/JPS6280907A/ja
Publication of JPH051562B2 publication Critical patent/JPH051562B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP61092669A 1985-04-23 1986-04-22 導電ペ−スト Granted JPS6280907A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8686785 1985-04-23
JP60-86867 1985-04-23

Publications (2)

Publication Number Publication Date
JPS6280907A JPS6280907A (ja) 1987-04-14
JPH051562B2 true JPH051562B2 (cs) 1993-01-08

Family

ID=13898768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61092669A Granted JPS6280907A (ja) 1985-04-23 1986-04-22 導電ペ−スト

Country Status (1)

Country Link
JP (1) JPS6280907A (cs)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
JPH0826251B2 (ja) * 1991-06-05 1996-03-13 福田金属箔粉工業株式会社 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料
JP2653314B2 (ja) * 1992-02-07 1997-09-17 鳴海製陶株式会社 電磁調理用容器
JP3254044B2 (ja) * 1993-06-16 2002-02-04 ナミックス株式会社 太陽電池用電極
JP5207439B2 (ja) * 2002-08-20 2013-06-12 トモリックテクノロジー株式会社 防錆剤
JP4507012B2 (ja) * 2006-01-23 2010-07-21 日立金属株式会社 多層セラミック基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132502A (ja) * 1983-01-20 1984-07-30 住友金属鉱山株式会社 導電被膜形成用組成物
JPS59146103A (ja) * 1983-02-09 1984-08-21 昭和電工株式会社 ドツテイングペ−スト

Also Published As

Publication number Publication date
JPS6280907A (ja) 1987-04-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees