JPH0515442U - Fixed structure of heating element - Google Patents

Abstract

(57) [Abstract] [Purpose] In an electronic component having a built-in heating element, the heating element can be fixed to a heat radiating plate without the need for screwing or soldering steps. [Configuration] The case 5 ₀ attached to the heat radiating plate 1, in a state of being attached to the heat radiating plate 1, is pressed portion 5 ₀ a is formed presses and fixes the heat generating element 2 at a predetermined position of the heat sink 1 There is. [Effect] Mounting of the case to the heat sink and fixing of the heat generating element to the heat sink can be performed in the same process, and there is no need for screwing or soldering to fix the heat generating element to the heat sink. Therefore, the cost is reduced.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure for fixing a heating element to a radiator plate in an electronic component, such as an SSR (solid state relay), which incorporates a heating element (power element) such as a triac or a power transistor.

[0002]

[Prior Art]

 FIG. 3 is a cross-sectional view of a conventional SSR. In FIG. 3, 1 is a heat sink, 2 is a heating element (power element) such as a triac or a power transistor, 2a is a lead terminal of the heating element 2, and 3a. Is a circuit board to which the heating element 2 is connected, 4 is an external input / output terminal, and 5 is a case.

Generally, in the conventional SSR, the heating element 2 is fixed to the heat dissipation plate 1 by screwing with a screw 6 or by soldering or an adhesive as shown in FIG.

[0004]

[Problems to be solved by the device]

 However, in such a fixing structure of the conventional example, in order to fix the heat generating element 2 to the heat sink 1, steps such as screwing and soldering are required, and there is a drawback that the cost is increased accordingly.

The present invention has been made in view of the above points, and an object of the present invention is to provide a fixing structure for a heating element that can omit screwing and soldering steps.

[0006]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the present invention is configured as follows.

That is, the heating element fixing structure of the present invention includes a case attached to the heat dissipation plate so as to cover the heat generation element fixed to the heat dissipation plate, and the case is attached to the heat dissipation plate. In this state, a pressing portion for pressing and fixing the heating element at a predetermined position of the heat dissipation plate is formed.

[0008]

[Action]

 According to the above configuration, the case is formed with the pressing portion for pressing and fixing the heat generating element to the heat dissipation plate. Therefore, by attaching the case to the heat dissipation plate, the heat generating element is connected to the heat dissipation plate by the pressing portion. Will be fixed in place. That is, it is possible to attach the case to the heat sink and fix the heat generating element to the heat sink in the same process.

[0009]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a cross-sectional view of an SSR according to an embodiment of the present invention, in which parts corresponding to those of the conventional example described above are designated by the same reference numerals.

In this embodiment, in order to fix the heat generating element 2 at a predetermined position of the heat radiating plate 1 without screwing or soldering as in the conventional case, the following structure is adopted. There is.

Namely, the case 5 ₀ attached to the heat radiating plate 1, the pressing section 5 presses and fixes in position the heat generating element 2 extends downward from a position opposed to the heating element 2 with respect to the heat radiating plate 1 ₀ a is formed on the pin-shaped, the circuit board 3 _0, the pressing portion 5 ₀ insertion hole 3 so a can press the heating element 2 by inserting ₀ a is formed.

Further, in this embodiment, the heat radiating plate 1 is provided with projections 1a for preventing displacement of the heat generating element 2 from a predetermined position at four positions in front, rear, left and right of the predetermined position.

[0014] Case 5 ₀ is a made conventional example similar to the synthetic resin, in order to ensure the heat generating element 2 pressing and fixing, preferably a material having a greater elasticity.

Other configurations are similar to those of the above-mentioned conventional example.

[0016] In SSR having such a configuration, the case 5 _0, the heat radiating plate 1, adhesive, fitting, caulking, or by attaching screws etc. conventional in the same manner, the pressing portion 5 ₀ of the case 5 ₀ The heating element 2 is pressed by a and is fixed to the heat dissipation plate 1. That is, by attaching the case ₅₀ to the heat sink 1, the heat generating element 2 is attached to the heat sink 1.

Therefore, unlike the conventional example, since the heating element 2 is attached to the heat dissipation plate 1, no screwing step or soldering step is required, and the cost can be reduced.

FIG. 2 is a cross-sectional view of another embodiment of the present invention, in which parts corresponding to the above-mentioned embodiments are designated by the same reference numerals.

[0019] In this embodiment, the case 5 _1, you press and fix the heat generating element 2 with respect to the heat radiating plate 1 pressing portion 51a is not a pin-like, such as in the above embodiment, the side wall of the case 5 ₁ It is formed so as to extend slightly obliquely and press the heating element 2. Therefore, in this embodiment, the circuit board 3 has no insertion hole.

The other structure is the same as that of the above-mentioned embodiment.

[0021]

[Effect of the device]

 As described above, according to the present invention, the case attached to the heat dissipation plate is formed with the pressing portion for pressing and fixing the heating element to the heat dissipation plate at a predetermined position. Since the heating element is fixed to the heat dissipation plate, unlike the conventional example, the screwing process and the soldering process for attaching the heating element to the heat dissipation plate are not required, and the cost can be reduced accordingly. Is possible.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a sectional view of another embodiment of the present invention.

FIG. 3 is a sectional view of a conventional example.

[Explanation of symbols]

1 radiating plate 1a projecting second heating element 3,3 ₀ circuit board 5,5 _0, 5 ₁ Case 5 ₀ a, 5 ₁ a pressing portion

Claims (2)

[Scope of utility model registration request] 1. A case is provided which is attached to the heat radiating plate so as to cover a heat generating element fixed to the heat radiating plate, the case being attached to the heat radiating plate,
A fixing structure for a heating element, wherein a pressing portion for pressing and fixing the heating element at a predetermined position of a heat dissipation plate is formed. 2. The heating element fixing structure according to claim 1, wherein the heat radiating plate is provided with a protrusion for preventing displacement of the heating element from the predetermined position. Fixed structure of the element.