JPH05152356A - Optical semiconductor element assembling device - Google Patents

Abstract

PURPOSE:To provide an optical semiconductor element assembling device which is able to discriminate the front from the rear of a chip mixedly housed in a chip tray when the chip is picked out from the chip tray. CONSTITUTION:A chip tray located at a pickup section A is a transparent case, and the image of the underside of a chip 1 is picked up by a CCD camera 5. It is discriminated by the output of the camera 5 that the underside of the chip 1 is the front side or the rear, and a chip whose front side faces upwards is sucked by a first collet 4 and transferred to a position adjusting section B. The chip is adjusted in position on a positioning stage 7, transferred to a die bonding section C with a second collet 11, and mounted on a base 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for assembling an optical semiconductor device.

[0002]

2. Description of the Related Art Light emitting elements such as LDs and LEDs and light receiving elements such as PIN diodes are known as optical semiconductor elements. FIG. 4 is a sectional view of an example of a conventional light emitting diode. In the figure, 21 is a base, 22 is a lead, and 23
Is a heat sink, 24 is an LED chip, 25 is a spherical lens, 26 is a cap, and 27 is an optical fiber. LED on the heat sink 23 attached to the base 21
The chip 24 is fixed and wiring is provided between the chip 24 and the lead 22. A spherical lens 25 is attached to the LED chip 24 by an optical adhesive, and is optically coupled with an optical fiber 27 fixed to a cap 26. A lens may be attached to the cap 26, but the attachment position of the LED chip 24 with respect to the base 21 directly affects optical coupling, and thus high accuracy is required.

FIG. 2 is a schematic configuration diagram of an example of a conventional optical semiconductor device assembling apparatus. In the figure, 1 is a chip, 2 is a chip tray, 4 is a first collet, 7 is a positioning stage,
8 is a CCD camera, 9 is a TV monitor, 10 is a base, 1
Reference numeral 1 denotes a second collet, which is roughly divided into a pickup section A, a position adjusting section B, and a die bonding section C as a whole. The first collet 4 is provided with a vacuum suction means, moves up and down as shown by an arrow, and reciprocates between the pickup section A and the position adjusting section B as shown by arrows on the left and right. The second collet 11 is also provided with a vacuum suction means, moves up and down as shown by an arrow, and reciprocates between the position adjusting section B and the die bonding section C as shown by an arrow indicating a moving direction from side to side. .. In the pickup section A, the chips 1 are stored in the chip tray 2 and
One of them is picked up by the collet 4 and carried to the position adjusting section B. Here, the suction of the first collet 4 is released, and the chip 1 is placed on the positioning stage 7. The pattern of the chip 1 on the positioning stage 7 is picked up by the CCD camera 8 and monitored by the TV monitor 9. The output of the CCD camera 8 is compared with stored reference data in a control device (not shown) to output a control signal, and the positioning stage 7 is rotated by the coordinate positions in the X and Y directions and the angle θ. It is controlled and positioned with respect to the base 10 and adjusted to a predetermined position and angle. At this time, the front and back of the chip 1 are judged, and when the chip 1 is turned upside down, it is returned to the original chip tray 2 and the next chip is similarly placed on the positioning stage 7. When the control of the position adjustment in the positioning stage 7 is completed, the second collet 11 sucks the chip 1 on the positioning stage 7, and the die bonding portion C
Then, the chip 1 is set on the base 10.
The second collet 11 has the positioning stage 7 in advance.
Since it is set so as to move between the center position of and the center position of the base 10, the chip 1 can be positioned on the base 10 with accuracy based on the position accuracy of the positioning stage 7. The chip 1 thus positioned is die-bonded. By repeating this, each chip can be assembled on the base.

However, in the case of the prior art, since the front and back determination is located in the middle of the sequence, the chip tray 2
There is a problem that if there is an inside-out chip in the chip stored in, the time loss will increase.

A large number of chips of optical semiconductor elements are simultaneously manufactured on a wafer and are separated into individual chips by cleavage, so the separated chips are automatically stored in a chip tray with the front side facing up. It is difficult to get it done. It is troublesome and time consuming to determine the front and back by a microscope or visually and set them all in the chip tray so that all the chips face up. Therefore, it is common to arrange them on the tray regardless of the front and back sides, and the above-mentioned problems cannot be solved.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is possible to discriminate between the front and back when picking up chips from a chip tray in which the front and back are mixed and stored. An object of the present invention is to provide an optical semiconductor device assembling apparatus that can be used.

[0007]

According to the present invention, in an optical semiconductor device assembling apparatus, a chip tray made of a transparent material, a collet movably arranged above the chip tray, and a bottom surface of the chip tray are provided. It is characterized in that it has image pickup means for picking up an image of a chip, and front and back determination means for determining the front and back of the chip in the chip tray based on the output of the image pickup means. The front and back of the chip can be judged by the front and back judgment means, and the chip turned inside out can be excluded according to the judgment result to perform the assembly work.

[0008]

According to the present invention, a chip tray made of a transparent container is provided, and it is possible to determine the front and back of the chip by observing from the bottom of the container with an image pickup means such as a CCD camera. The collet can be made to adsorb, or the inside-out chip can be inverted and made to be adsorbed to the collet, so that the assembling time can be made efficient.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic configuration diagram of an embodiment of an apparatus for assembling an optical semiconductor device according to the present invention. In the figure, 1 is a chip, 2 is a chip tray, 3 is a support table, 4 is a first collet,
5 is a CCD camera, 6 is a TV monitor, 7 is a positioning stage, 8 is a CCD camera, 9 is a TV monitor, 10 is a base, and 11 is a second collet. As a whole, the pickup unit A, the position adjusting unit B, and the die. The bonding portion C can be roughly classified. The chip tray 2 in the pickup unit A uses a transparent container, for example, a tray made of quartz, and is installed on a support table 3 in which the bottom of the chip tray 2 can be opened. Therefore, the lower surface of the chip 1 accommodated in the chip tray 2 can be observed through the bottom surface of the chip tray 2 through the opening below the support table 3. The observation is performed by the CCD camera 5, the output of which is monitored by the TV monitor 6 and is also introduced into the front / back determination means (not shown). The front / back determination unit refers to the pattern data from the CCD camera 5 as reference data to determine the front / back. At this time, in the observation area, the movement of the first collet 4 for taking out the chip 1 and the movement of the CCD camera 5 are interlocked with each other.

When the front and back are determined by the front / back determination means, that is, when the CCD camera recognizes the back of the chip 1, the chip is sucked by the first collet 4.
Then, the first collet 4 that has sucked the tip moves to the position adjusting section B, and as described with reference to FIG. 2, after the tip 1 is adjusted to a predetermined position and angle by the positioning stage 7, the second collet 4 is moved. It is transferred to the die bonding section C at 11 and mounted on the base 10.

In the pickup section A, a chip determined to be turned inside out is not picked up, and the front / back determination of the next chip is performed. Therefore, when the determination of the final chip in the chip tray 2 and the pickup associated therewith are completed, only the flipped chips are left in the chip tray 2. If another chip tray is prepared and the chips are turned upside down, all the chips can be stored face up. Therefore, if this tray is set, all chips can be bonded. For this chip tray, it is not necessary to determine the front and back sides.

Although the first collet 4 and the CCD camera 5 are made to interlock with each other when the front and back of the CCD camera 5 are judged, during observation by the CCD camera 5,
The first collet 4 and the CCD camera 5 may be fixed at positions corresponding to the same chip, and the chip tray 2 may be moved.

Further, after the first collet 4 picks up the chip and transfers it to the position adjusting section B, the CDD camera 5 is moved to the position of the next chip, and the position adjusting section B positions it. The first chip collet 4 may be moved to the position of the CCD camera 5 when the front side and the back side of the next chip are determined during the period in which it is being performed and the chip that has become the front side is recognized. In this method, the collet does not have to be at the position of the CCD camera 5 when determining the front and back sides,
This method is advantageous when the first collet 4 and the second collet 11 are shared.

FIG. 3 is a schematic configuration diagram of a pickup section of another embodiment of the optical semiconductor element assembling apparatus according to the present invention. The position adjusting section and the die bonding section may be the same as those in the above-mentioned embodiments. In this example, the rotary collet 12 was used. The rotary collet 12 also has a vacuum suction means,
As shown by the arrow in the figure, the chip tray 2 is configured to be movable and rotationally movable to a predetermined position. CCD camera 5
When it is determined that the chip is the inside-out chip by the observation, the rotary collet 12 moves to the position of the chip as shown in the figure, and the chip 1 is sucked and rotated by 180 °. The chip sucked by this rotation is turned upside down. Then,
The tip on the rotary collet 12 is sucked by the first collet 4 and transferred to a position adjusting unit (not shown). The chips determined to be the front side are sucked by the first collet 4 as they are without using the rotary collet. By using the rotating collet, all the chips can be sequentially flipped without flipping the chips stored in the chip tray 2 inside out.
It can be transferred to the position adjusting unit in the state of the table.

[0015]

As is apparent from the above description, according to the present invention, it is possible to determine the front and back of chips in a state where they are lined up in a chip tray, so that there is no loss in operation and quick assembly is possible. An element assembling device can be provided, which is effective for mass production devices.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an embodiment of an apparatus for assembling an optical semiconductor element of the present invention.

FIG. 2 is a schematic configuration diagram of an example of a conventional optical semiconductor device assembling apparatus.

FIG. 3 is a schematic configuration diagram of a pickup section of another embodiment of the apparatus for assembling an optical semiconductor element of the present invention.

FIG. 4 is a cross-sectional view of an example of a conventional light emitting diode.

[Explanation of symbols]

 A pickup part B position adjusting part C die bonding part 1 chip 2 chip tray 3 support table 4 first collet 5 CCD camera 6 TV monitor 7 positioning stage 8 CCD camera 9 TV monitor 10 base 11 second collet 12 rotating collet

Claims (1)

[Claims] 1. An apparatus for assembling an optical semiconductor device, comprising: a chip tray made of a transparent material; a collet movably arranged above the chip tray; and an image pickup means for picking up an image of the chip through a bottom surface of the chip tray. An optical semiconductor device assembling apparatus comprising front and back determining means for determining the front and back of a chip in a chip tray based on the output of the image pickup means.