JPH0514424B2 - - Google Patents

Info

Publication number
JPH0514424B2
JPH0514424B2 JP63274372A JP27437288A JPH0514424B2 JP H0514424 B2 JPH0514424 B2 JP H0514424B2 JP 63274372 A JP63274372 A JP 63274372A JP 27437288 A JP27437288 A JP 27437288A JP H0514424 B2 JPH0514424 B2 JP H0514424B2
Authority
JP
Japan
Prior art keywords
support plate
resin
mold
main surface
molding cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63274372A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02122634A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP63274372A priority Critical patent/JPH02122634A/ja
Publication of JPH02122634A publication Critical patent/JPH02122634A/ja
Publication of JPH0514424B2 publication Critical patent/JPH0514424B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP63274372A 1988-11-01 1988-11-01 樹脂封止型電子部品の製造方法 Granted JPH02122634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63274372A JPH02122634A (ja) 1988-11-01 1988-11-01 樹脂封止型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63274372A JPH02122634A (ja) 1988-11-01 1988-11-01 樹脂封止型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPH02122634A JPH02122634A (ja) 1990-05-10
JPH0514424B2 true JPH0514424B2 (enExample) 1993-02-25

Family

ID=17540740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63274372A Granted JPH02122634A (ja) 1988-11-01 1988-11-01 樹脂封止型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPH02122634A (enExample)

Also Published As

Publication number Publication date
JPH02122634A (ja) 1990-05-10

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