JPH0514424B2 - - Google Patents
Info
- Publication number
- JPH0514424B2 JPH0514424B2 JP63274372A JP27437288A JPH0514424B2 JP H0514424 B2 JPH0514424 B2 JP H0514424B2 JP 63274372 A JP63274372 A JP 63274372A JP 27437288 A JP27437288 A JP 27437288A JP H0514424 B2 JPH0514424 B2 JP H0514424B2
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- resin
- mold
- main surface
- molding cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63274372A JPH02122634A (ja) | 1988-11-01 | 1988-11-01 | 樹脂封止型電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63274372A JPH02122634A (ja) | 1988-11-01 | 1988-11-01 | 樹脂封止型電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02122634A JPH02122634A (ja) | 1990-05-10 |
| JPH0514424B2 true JPH0514424B2 (enExample) | 1993-02-25 |
Family
ID=17540740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63274372A Granted JPH02122634A (ja) | 1988-11-01 | 1988-11-01 | 樹脂封止型電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122634A (enExample) |
-
1988
- 1988-11-01 JP JP63274372A patent/JPH02122634A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02122634A (ja) | 1990-05-10 |
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