JPH05139476A - Housing container for semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate housing of a semiconductor device in a housing container and to prevent the semiconductor device from jumping out of the housing container by a method wherein in a pocket inside structure of the housing container, a double-step tapered structure is formed, so that one step corresponds to a bottom surface of the semiconductor device and the other corresponds to a flash part at an upper part. CONSTITUTION:Housing containers 103 for semiconductor are laminated on a lot. In this instance, the housing container 103, for example, a tray 103 is formed with tapered parts A and A' which prevent movement of the semiconductor 101 in the right and left direction on a bottom part of the tray 103. Steps B and B' are also formed for avoiding flash parts 102 of the semiconductor 101. Other tapered parts C and C' are further formed for preventing the respective movements of the semiconductor 101 in the right, and left direction and the upward and downward direction at the flash parts 102. Thus in a pocket inside structure of the tray 103, a double-step tapered structure is formed, so that one step corresponds to a bottom surface of the semiconductor device 101, while the other step corresponds to the flash parts 102. Accordingly, the semiconductor can be housed easily and prevented from jumping out of the housing container 103.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage container (hereinafter referred to as tray) structure of a type in which storage devices are stacked to store semiconductor devices.

[0002]

2. Description of the Related Art A conventional tray pocket structure is a TSOP (Thin Sm-all Outline Pack) which is a semiconductor device.
age), a taper is provided so that the top dimension of the pocket is larger than the bottom dimension of the pocket so that the TSOP can be easily stored.
The lateral position of the OP is restricted by the taper.

A plan view of TSOP is shown in FIG.
FIG. 4 shows a cross-sectional view in the FF ′ direction in which the OP is stored in the conventional tray pocket.

As shown in FIG. 4, the tray pocket sectional structure is such that when the TSOP is stored in the pocket, the taper of G and G'prevents lateral movement.
At this time, when the trays are stacked, the structure is such that the TSOP is prevented from moving in the vertical direction by being pressed from above D.

[0005]

However, in the above-mentioned prior art, there is a problem in the storage stability in the left-right and up-down directions in the F-F 'direction in the tray pocket in which the TSOP is stored, so that the TSOP is stored in the tray pocket. TSOP sometimes jumped out of the tray pocket due to impact. This is because TSOP is another semiconductor device (QFP, PLCC, etc.)
Because it is thinner, lighter, and smaller than the above, it is easy to jump out of the tray. Furthermore, there are burrs on the two sides of TSOP, and these burrs are protruding, and the tray pocket taper structure is a straight structure, so it slips. It was easy and had no stability after storage.

Further, at the TSOP entrance portion at the upper part of the tray pocket taper, when the TSOP is stored in the pocket, the front opening of the TSOP is small, so that the TSOP entrance portion is small.
There was also a problem with the stability of the storage because it was difficult to store it in the regular position in the pocket. Therefore, the present invention solves such a problem, and its purpose is to
Not only the SOP but also the one having a protruding burr on the semiconductor device has a two-step structure corresponding to the bottom part of the semiconductor device to be housed and the burr part on the upper part thereof for the storage stability in the left-right and up-down directions inside the pocket. The structure is characterized by having a taper. Furthermore, a taper corresponding to the stability of the semiconductor device to be stored is provided on the upper portion of the tray pocket, and the storage container pocket internal structure has a three-stage taper structure. It provides a tray that is characterized by

[0007]

The tray pocket structure of the present invention is characterized by having a two-step taper structure corresponding to the bottom surface of the semiconductor device to be housed and the burr portion above it.

Further, the upper part of the tray pocket is provided with a taper corresponding to the stability of the semiconductor device to be stored, and the internal structure of the storage container pocket has a three-step taper structure.

[0009]

Embodiments of the present invention will now be described with reference to the accompanying drawings.

(Embodiment 1) FIG. 1 is a sectional view taken along line FF 'in which TSOP is housed in a tray. Where 10
1 is TSOP, 102 is a burr of TSOP, and 103 is a tray main body.

The TSOP tray pocket structure is A, A '.
The taper of prevents the horizontal movement of the bottom part of TSOP, and avoids the burr part of TSOP by the shelf of B and B '.
The taper of C and C'prevents the burr portion protruding from the TSOP from moving in the left-right direction and the vertical direction.

Here, in order to maximize the stowability of the TSOP, the taper angle θ1 at the bottom of the pocket of A, A'is
Is the same as the bottom taper angle θ3 of TSOP. Further, the pocket taper angle θ2 of C and C ′ is set to a taper angle close to vertical to prevent the burr portion from moving vertically and horizontally.

As described above, the internal structure of the pocket is TSO.
The bottom surface of P and the burr portion have a two-step taper structure.

Further, since the shelves B and B'are provided, the frontage can be enlarged at the upper portion of the pocket, and the TSOP has a structure that is easily stored.

When the trays are stacked, the structure is such that the TSOP is prevented from moving in the vertical direction by being pressed from above D.

(Embodiment 2) FIG. 2 shows the pocket upper structure of Embodiment 1 in which E and E'tapers are provided.

This taper is the TSOP above the pocket.
It is installed at the entrance part, which makes the frontage larger,
The TSOP has a structure that is more easily stored.

[0018]

As described above, according to the tray pocket structure of the present invention, by providing the two-step taper structure corresponding to the bottom surface of the semiconductor device to be housed and the burr portion above it, the semiconductor device of the semiconductor device is provided. There is an effect that the semiconductor device does not pop out due to the movement in the left-right and up-down directions after the storage, and the storage stability is improved.

Further, the tray pocket upper structure is provided with a taper structure having a large frontage so that the semiconductor device can be easily housed, so that the semiconductor device can be housed more easily.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of a tray having a two-step taper structure according to the present invention.

FIG. 2 is a cross-sectional view showing a second embodiment of a tray having a three-step taper structure according to the present invention.

FIG. 3 is a plan view showing a TSOP which is a semiconductor device.

FIG. 4 is a sectional view taken along line FF ′ in which TSOP is stored in a tray pocket, which is a conventional technique.

[Explanation of symbols]

 101 TSOP 102 TSOP burr 103 TSOP tray 104 TSOP lead A, A'pocket bottom taper B, B'shelves to avoid burrs C. C'Pocket taper D Pressing E, E'Pocket top taper G, G'Conventional pocket taper θ1 Pocket bottom taper angle θ2 Pocket taper angle θ3 TSOP Bottom taper angle

Claims (2)

[Claims] 1. A semiconductor device storage container of a type in which storage containers are stacked and stored for storing semiconductor devices, wherein the internal structure of the storage container pocket corresponds to the bottom surface of the semiconductor device to be stored and a burr portion above the semiconductor device. A semiconductor device storage container having a two-step taper structure. 2. The storage container pocket according to claim 1, wherein a taper corresponding to the stability of the semiconductor device to be stored is provided, and the storage container pocket internal structure has a three-step taper structure. A semiconductor device storage container.