JPS6333286A - Container and method of treating electronic part by using said container - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a component storage technique, and particularly to a technique that is effective when used in a storage case for electronic components.

[Conventional technology]

A storage case (magazine) for electronic components (integrated circuit devices) is described in Japanese Patent Laid-Open No. 48-52480. The outline is that a single board is bent and formed.
It has a mounting table on which a DIL type IC package is placed inside, and is arranged so that the mounting table is at a position below the side surface and further away from the position of the lead tip of the IC placed on the mounting table. It is formed so as to be recessed in the direction of the mounting table.

[Problem that the invention seeks to solve]

The present inventor used a magazine similar to the above-mentioned magazine for integrated circuits (hereinafter referred to as magazine) to transport electronic components (hereinafter referred to as IC) and process ICs, and found the following problems. revealed something.

In other words, when stacking magazines containing ICs and placing them in a processing device (for example, a marking device) that applies IC temperature, the stacked magazines have a shape that makes it difficult to stack them (they easily shift and the device The problem is that it is difficult to set.

In addition, when storing ICs in magazines and transporting them in trays in multiple rows and stages, the magazines tend to move within the tray, so a large impact is applied to the magazines during transport. The inventor has also revealed that there is a problem in that the IC moves internally as the magazine moves, and the leads of the IC come into contact with the magazine or tray and are bent.

An object of the present invention is to provide a magazine (storage case) that does not collapse when stacked.

Another object of the present invention is to provide a magazine that is easy to set in an IC (component) processing apparatus.

Another object of the present invention is to provide a magazine in which stored ICs (components) are less likely to be damaged by impacts during transportation.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Failure to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the lower surface of the storage case (magazine) is provided with a protrusion that enters into the upper surface of the magazine.

[Effect]

According to the above-mentioned means, since the protrusion on the lower surface of the magazine can enter the upper surface of the magazine placed below,
When magazines are stacked, the movement of the upper magazine is regulated and can be prevented from collapsing.

In addition, since it does not easily collapse, it can be easily set when stacking magazines and setting them in a processing device.

Furthermore, when magazines containing TCs are stored in a tray and transported, the stacked magazines are difficult to move, so even if a shock is applied, the movement of ■c with the magazine is reduced.
The movement of the IC can be specified. Therefore, the impact applied to the IC can be reduced, and damage to the IC can be reduced.

〔Example〕

FIG. 1 is a perspective view showing a storage case according to an embodiment of the present invention and a magazine shown in FIG.

FIG. 2 is a front view showing a state in which ICs are stored and stacked in a magazine according to an embodiment of the present invention.

In FIG. 1, reference numeral 1 indicates a magazine which is an embodiment of the present invention. Reference numeral 2 denotes a mounting surface on which an IC package, which will be described later, is mounted. Reference numeral 3 denotes a support body, which is formed integrally with the placement surface 2 and supports the placement surface 2. 4 is a bottom surface, which is formed integrally with the support body 3;
This is the bottom of magazine 1. Reference numeral 5 designates a pawl as a protrusion, and this pawl 5, which is formed in an L-shape on the inside of the magazine on the bottom surface 4 and extends in the longitudinal direction of the magazine 1, is sized to fit into an opening described later.

A pawl 6 is also a protrusion, and is formed in an L-shape from the bottom surface 4 toward the inside of the magazine, extending in the longitudinal direction of the magazine 1. This pawl 6 is also sized to fit into the opening described later. 7 is a side surface, and the bottom surface 4
It is formed so as to cover the mounting surface 2 from above. Reference numeral 8 denotes an upper surface, which extends from the side surface 7 and is provided substantially parallel to the placement surface 2. 9 is also an upper surface, and the mounting surface 7 also extends and is provided substantially parallel to the mounting surface 2. 1
0 is an opening, and the upper surface 8. It is formed between the upper surface 9 and the upper surface 9.

In FIG. 2, 11 is an IC as an electronic component,
Leads, which will be described later, protrude from two sides of the package, which will be described later. A package 12 is made of resin or the like and is shaped like a rectangular parallelepiped.

Reference numeral 13 denotes leads, which protrude from two sides of the package.

An embodiment of the present invention having the configuration described above will be described below.

As shown in FIG. 1, claws 5 and 6 are formed on the lower side (upper side in the figure) of the mounting surface 2 of the magazine 10, that is, on the bottom surface 4. As shown in FIG. Therefore, when ICs are stored in the magazines and the magazines are stacked, as shown in FIG.
The claws 5 and 6 catch on the -F surface 8 and the upper surface 9, respectively, and the stacked magazines 1 become misaligned.

Therefore, (1) Below the mounting surface on which the IC' of the magazine is placed,
By providing a protrusion on the outside of the magazine, when the magazines are stacked, the protrusion hooks onto the top surface of the magazine below. This results in the effect that stacked magazines are less likely to collapse.

(2) Since the stacked magazines are difficult to shift, it is easy to stack and set magazines containing ICs in an IC processing device.

(3) Because the stacked magazines do not easily shift, even when magazines containing ICs are transported in trays in multiple rows and stages, the movement of the magazines due to the impact of transport can be regulated, so the ICs in the magazines It is thick (can reduce movement. Therefore, it has the effect of reducing the possibility that the IC lead will come into contact with the magazine, tray, etc. and bend.

Hereinafter, the invention made by the present inventor has been specifically explained based on examples, but the present invention is not limited to the above examples (and various changes can be made without departing from the gist of the invention). Needless to say, for example, the tabs extending from the back of the magazine do not need to be provided continuously in the longitudinal direction of the magazine (although they may be provided partially). It is fine as long as it is difficult.

Alternatively, the claw may extend from the side of the magazine and cover the upper side of the magazine below.

In other words, the structure may be such that when stacked, the magazines located one above the other will be caught on each other and will not easily shift.

In the above explanation, the invention made by the present inventor will be mainly referred to as the application field for semiconductor devices (IC), which is the background of the invention.
), but the present invention is not limited thereto.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, by providing a protrusion under the mounting surface of the magazine on which the IC is placed, when the magazines are stacked, the protrusion will catch on the magazine below, making it difficult to shift.

[Brief explanation of the drawing]

1-1) Fig. 1 is a diagram of a storage case which is an embodiment of the present invention, and Fig. 2 is a side view showing a state in which ICs are stored and stacked in a magazine which is an embodiment of the present invention. 1... Magazine, 2... Placement surface, 3... Support body,
4... Bottom, 5.6... Pawl, 7... Side, 8.
9...Top surface, 10...Opening, 1]...IC11
2...Package, 13...Lead.

Claims (1)

[Scope of Claims] 1. A component storage case having a mounting surface on which a component is placed, a side surface provided to cover the component, and a recess extending upward from the side surface, the front Below the writing surface,
A storage case characterized by forming a protrusion on the outside of the parts storage case. 2. The storage case according to claim 1, wherein the protrusion is sized to fit into the recess. 3. A mounting surface on which a component is placed, a side surface provided to cover the component, and a recess extending upward from the side surface, and a component storage case under the mounting surface. A processing method characterized by storing parts in a storage case having a protrusion formed on the outside, stacking the storage cases to stock the parts, and then taking out the parts from the storage case and processing them. 4. The processing method according to claim 3, wherein the processing includes marking the parts.