JPH0513538B2 - - Google Patents
Info
- Publication number
- JPH0513538B2 JPH0513538B2 JP8288788A JP8288788A JPH0513538B2 JP H0513538 B2 JPH0513538 B2 JP H0513538B2 JP 8288788 A JP8288788 A JP 8288788A JP 8288788 A JP8288788 A JP 8288788A JP H0513538 B2 JPH0513538 B2 JP H0513538B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- sprocket
- tape
- holes
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 18
- 238000005530 etching Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000012050 conventional carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- YTAHJIFKAKIKAV-XNMGPUDCSA-N [(1R)-3-morpholin-4-yl-1-phenylpropyl] N-[(3S)-2-oxo-5-phenyl-1,3-dihydro-1,4-benzodiazepin-3-yl]carbamate Chemical compound O=C1[C@H](N=C(C2=C(N1)C=CC=C2)C1=CC=CC=C1)NC(O[C@H](CCN1CCOCC1)C1=CC=CC=C1)=O YTAHJIFKAKIKAV-XNMGPUDCSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63082887A JPH01256138A (ja) | 1988-04-06 | 1988-04-06 | キャリアテープおよびその使用方法 |
| US07/332,608 US4980219A (en) | 1988-04-06 | 1989-03-31 | Carrier tape for bonding IC devices and method of using the same |
| KR1019890004474A KR920005451B1 (ko) | 1988-04-06 | 1989-04-04 | Ic 데바이스를 본딩하기 위한 캐리어 테이프 및 그 사용 방법 |
| US07/580,262 US5019209A (en) | 1988-04-06 | 1990-09-10 | Method of manufacturing and using a carrier tape for bonding IC devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63082887A JPH01256138A (ja) | 1988-04-06 | 1988-04-06 | キャリアテープおよびその使用方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01256138A JPH01256138A (ja) | 1989-10-12 |
| JPH0513538B2 true JPH0513538B2 (enrdf_load_stackoverflow) | 1993-02-22 |
Family
ID=13786781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63082887A Granted JPH01256138A (ja) | 1988-04-06 | 1988-04-06 | キャリアテープおよびその使用方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01256138A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1146030C (zh) | 1998-07-28 | 2004-04-14 | 精工爱普生株式会社 | 半导体装置及其制造方法、半导体模块、电路基板以及电子装置 |
| JP2003282649A (ja) * | 2002-03-27 | 2003-10-03 | Shindo Denshi Kogyo Kk | テープキャリアおよびその製造方法、テープキャリアへの電子部品の実装方法、ならびにテープキャリアパッケージの製造方法 |
| JP4386929B2 (ja) | 2007-04-09 | 2009-12-16 | 日東電工株式会社 | Ｔａｂ用テープキャリアの製造方法 |
-
1988
- 1988-04-06 JP JP63082887A patent/JPH01256138A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01256138A (ja) | 1989-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090222 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090222 Year of fee payment: 16 |