JPH0513480Y2 - - Google Patents
Info
- Publication number
- JPH0513480Y2 JPH0513480Y2 JP1987165763U JP16576387U JPH0513480Y2 JP H0513480 Y2 JPH0513480 Y2 JP H0513480Y2 JP 1987165763 U JP1987165763 U JP 1987165763U JP 16576387 U JP16576387 U JP 16576387U JP H0513480 Y2 JPH0513480 Y2 JP H0513480Y2
- Authority
- JP
- Japan
- Prior art keywords
- polishing table
- grooves
- ceramic
- polishing
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 5
- 238000005488 sandblasting Methods 0.000 claims description 5
- 238000005498 polishing Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987165763U JPH0513480Y2 (US20090163788A1-20090625-C00002.png) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987165763U JPH0513480Y2 (US20090163788A1-20090625-C00002.png) | 1987-10-29 | 1987-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0171057U JPH0171057U (US20090163788A1-20090625-C00002.png) | 1989-05-11 |
JPH0513480Y2 true JPH0513480Y2 (US20090163788A1-20090625-C00002.png) | 1993-04-09 |
Family
ID=31452545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987165763U Expired - Lifetime JPH0513480Y2 (US20090163788A1-20090625-C00002.png) | 1987-10-29 | 1987-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0513480Y2 (US20090163788A1-20090625-C00002.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109420980A (zh) * | 2017-08-22 | 2019-03-05 | 株式会社迪思科 | 修整板、修整板的使用方法以及切削装置 |
TWI749116B (zh) * | 2017-01-17 | 2021-12-11 | 日商迪思科股份有限公司 | 修整板、切削刀之修整方法及切削裝置 |
-
1987
- 1987-10-29 JP JP1987165763U patent/JPH0513480Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI749116B (zh) * | 2017-01-17 | 2021-12-11 | 日商迪思科股份有限公司 | 修整板、切削刀之修整方法及切削裝置 |
CN109420980A (zh) * | 2017-08-22 | 2019-03-05 | 株式会社迪思科 | 修整板、修整板的使用方法以及切削装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0171057U (US20090163788A1-20090625-C00002.png) | 1989-05-11 |
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