JPH0513403A - Spraying device for chemical solution wet treatment vessel - Google Patents

Spraying device for chemical solution wet treatment vessel

Info

Publication number
JPH0513403A
JPH0513403A JP16590091A JP16590091A JPH0513403A JP H0513403 A JPH0513403 A JP H0513403A JP 16590091 A JP16590091 A JP 16590091A JP 16590091 A JP16590091 A JP 16590091A JP H0513403 A JPH0513403 A JP H0513403A
Authority
JP
Japan
Prior art keywords
substrate
chemical solution
wet processing
spraying device
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16590091A
Other languages
Japanese (ja)
Other versions
JP3207218B2 (en
Inventor
Choichi Kimura
長市 木村
Koujirou Yasui
功二郎 保井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Engineering Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Engineering Works Co Ltd filed Critical Shibaura Engineering Works Co Ltd
Priority to JP16590091A priority Critical patent/JP3207218B2/en
Publication of JPH0513403A publication Critical patent/JPH0513403A/en
Application granted granted Critical
Publication of JP3207218B2 publication Critical patent/JP3207218B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To enhance the preciseness of a substrate by uniformly applying chemical liquid reaction on the whole surface of the substrate, to miniaturize the title spraying device, and to contrive improvement in safety of the substrate to be conveyed. CONSTITUTION:A chemical agent spraying device 13 is provided with a rotatable conveyor roller 4 with which a substrate 3 of LDC and the like is conveyed, a driving motor 15 with which the conveyor roller 4 is rotated at a low speed, and a high flow speed nozzle 16 which is arranged inclining in the direction of conveyance of the substrate 3 and sprays a chemical 6 on the whole surface of the substrate 3 by one projection.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、LCD等の基板にエッ
チング処理や現像処理等のウェット処理を行うウェット
処理槽にて、基板に所定の薬液を散布する薬液散布装置
に関するものであり、特に装置の簡略化に改良を加えた
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical solution spraying apparatus for spraying a predetermined chemical solution onto a substrate in a wet processing tank for performing a wet process such as an etching process and a developing process on a substrate such as LCD. It is an improvement of the simplification of the device.

【0002】[0002]

【従来の技術】一般にLCD等の基板を製造する基板製
造工程には、基板に対してエッチング処理や現像処理等
のウェット処理を行うウェット処理槽が組込まれてい
る。このウェット処理槽には前記基板に現像液など所定
の薬液を散布する薬液散布装置が設けられている。
2. Description of the Related Art Generally, in a substrate manufacturing process for manufacturing a substrate such as an LCD or the like, a wet processing bath for performing a wet processing such as an etching processing and a development processing on a substrate is incorporated. The wet processing tank is provided with a chemical solution spraying device for spraying a predetermined chemical solution such as a developing solution onto the substrate.

【0003】図3はウェット処理槽の薬液散布装置の構
成を示す概念図である。図において、薬液散布装置1は
基板3に所定の薬液6を散布する装置で、中空の直方体
状のウェット処理槽2内に設けられており、基板3を搬
送する回転可能な搬送ローラ4と、搬送ローラ4に回転
力を供給する駆動モータ5と、基板3に薬液6を散布す
るシャワー部7とを備えている。
FIG. 3 is a conceptual diagram showing the structure of a chemical spraying device in a wet processing tank. In the figure, a chemical liquid spraying device 1 is a device for spraying a predetermined chemical liquid 6 onto a substrate 3, which is provided inside a hollow rectangular parallelepiped wet processing tank 2, and a rotatable transport roller 4 for transporting the substrate 3, A drive motor 5 that supplies a rotational force to the transport roller 4 and a shower unit 7 that sprays the chemical liquid 6 onto the substrate 3 are provided.

【0004】前記ウェット処理槽2には、搬送される基
板3の入口部2a及び出口部2bが形成されており、入
口部2aから出口部2bに渡って前記搬送ローラ4が一
定の間隔で配設されている。また、搬送ローラ4上方に
は前記シャワー部7が前記搬送ローラ4と平行に配設さ
れている。
The wet processing bath 2 is formed with an inlet portion 2a and an outlet portion 2b of a substrate 3 to be transported, and the transport rollers 4 are arranged at regular intervals from the inlet portion 2a to the outlet portion 2b. It is set up. The shower unit 7 is disposed above the transport roller 4 in parallel with the transport roller 4.

【0005】搬送ローラ4は基板3を下方から支持し、
駆動モータ5から回転力を供給されて回転し、基板3を
図中右方へ連続的に搬送する。また、シャワー部7は、
薬液6が供給されるパイプ7aと、このパイプ7aの長
手方向に開口される複数のシャワー口7bとから成り、
シャワー口7bから基板3上に薬液6を散布する。
The carrier roller 4 supports the substrate 3 from below,
Rotational force is supplied from the drive motor 5 to rotate the substrate, and the substrate 3 is continuously conveyed rightward in the drawing. Also, the shower unit 7 is
It is composed of a pipe 7a to which the chemical liquid 6 is supplied and a plurality of shower ports 7b opened in the longitudinal direction of the pipe 7a,
The chemical solution 6 is sprayed on the substrate 3 from the shower port 7b.

【0006】なお、基板3の全面にまんべんなく薬液6
を散布する必要から、シャワー部7の長さ寸法はかなり
長く設定され、また、駆動モータ5によって決定される
搬送ローラ4の搬送速度は比較的低速度に設定されてい
る。
The chemical solution 6 is evenly distributed over the entire surface of the substrate 3.
The length of the shower unit 7 is set to be considerably long because of the necessity of spraying, and the transport speed of the transport roller 4 determined by the drive motor 5 is set to a relatively low speed.

【0007】ところで、薬液6は通常、散布された部分
から即座に所定の反応が始まる。この様な薬液6を散布
する薬液散布装置においては、基板3が低速度でウェッ
ト処理槽2内を通過する場合、次のような不具合が生じ
た。すなわち、図3に示すように、ウェット処理槽2の
入口部2a付近において、最初に薬液6が散布される基
板3の前端部3aは逸早く反応が開始され、最後に薬液
6が散布される基板3の後端部3bは、最も遅く反応が
開始される。つまり、薬液6による反応開始のタイミン
グは、基板3の搬送方向に沿って段階的に変化してい
き、これに応じて基板3上には基板搬送方向に沿った反
応ムラが発生する。
By the way, the chemical solution 6 usually starts a predetermined reaction immediately from the sprayed portion. In such a chemical liquid spraying device for spraying the chemical liquid 6, when the substrate 3 passes through the wet processing bath 2 at a low speed, the following problems occur. That is, as shown in FIG. 3, in the vicinity of the inlet portion 2a of the wet processing bath 2, the front end portion 3a of the substrate 3 to which the chemical liquid 6 is first sprayed starts the reaction quickly, and the substrate to which the chemical liquid 6 is sprayed lastly. The rear end portion 3b of 3 has the latest reaction start. That is, the timing of starting the reaction by the chemical liquid 6 changes stepwise along the transfer direction of the substrate 3, and accordingly, reaction unevenness along the substrate transfer direction occurs on the substrate 3.

【0008】この様な反応ムラが発生した基板は不良品
となり、基板製造工程にて製造される基板の精度が低下
する。最近では基板が大形化する傾向にあり、上記のよ
うな同一基板での薬液による反応開始タイミングのずれ
は益々大きくなっており、その解消が急務となってい
た。
A substrate in which such reaction unevenness has occurred becomes a defective product, and the accuracy of the substrate manufactured in the substrate manufacturing process is lowered. Recently, the size of the substrate tends to be large, and the above-mentioned deviation of the reaction start timing due to the chemical solution on the same substrate is becoming more and more urgent.

【0009】そこで、ウェット処理槽の入口部付近にお
いて、基板の前端部と後端部とがウェット処理槽に入る
タイムラグをできるだけ小さくする薬液散布装置が提案
されている。この様な従来例を図4に示す。図示された
薬液散布装置8の特徴は、ウェット処理槽2の入口部2
a付近のいくつかの搬送ローラ9に対して回転力を供給
し、駆動力の切替可能である第1の駆動モータ10と、
搬送ローラ9以外の搬送ローラ11に対して回転力を供
給する第2の駆動モータ12とが設置されている点にあ
る。
Therefore, there has been proposed a chemical solution spraying device which minimizes a time lag between the front end portion and the rear end portion of a substrate entering the wet processing tank near the entrance of the wet processing tank. Such a conventional example is shown in FIG. The feature of the chemical liquid spraying device 8 shown is that the inlet portion 2 of the wet processing tank 2 is
a first drive motor 10 that supplies a rotational force to some of the transport rollers 9 near a and is capable of switching the drive force;
A second drive motor 12 that supplies a rotational force to the transport rollers 11 other than the transport roller 9 is installed.

【0010】第1の駆動モータ10は、基板3がウェッ
ト処理槽2の入口部2aに差掛かった時点で搬送ローラ
9に高速度の回転力を供給する。そして、基板3全体が
ウェット処理槽2に搬入された時点では搬送ローラ9に
比較的低速度の回転力を供給するように駆動力を切替え
る。この低速時の搬送ローラ9の回転速度は、第2の駆
動モータ12により回転する搬送ローラ11の回転速度
と等しく設定されている。
The first drive motor 10 supplies a high-speed rotational force to the transport roller 9 when the substrate 3 reaches the inlet 2a of the wet processing bath 2. Then, when the entire substrate 3 is loaded into the wet processing bath 2, the driving force is switched so as to supply a relatively low speed rotational force to the transport roller 9. The rotation speed of the conveyance roller 9 at this low speed is set to be equal to the rotation speed of the conveyance roller 11 rotated by the second drive motor 12.

【0011】基板3全体がウェット処理槽2に搬入され
た時点で、第1の駆動モータ10の駆動力が切替わり、
搬送ローラ9は搬送ローラ11と共に低速度で回転す
る。そのため、基板3はウェット処理槽2内を低速度で
搬送され、基板3上にまんべんなく薬液6が散布され
る。
When the entire substrate 3 is loaded into the wet processing bath 2, the driving force of the first drive motor 10 is switched,
The transport roller 9 rotates at a low speed together with the transport roller 11. Therefore, the substrate 3 is transported at a low speed in the wet processing bath 2, and the chemical solution 6 is evenly dispersed on the substrate 3.

【0012】また、搬送ローラ11が基板3を搬送する
際、新たな基板3がウェット処理槽2の入口部2aに差
掛かかると、第1の駆動モータ10は再度、駆動力を切
替え、搬送ローラ9に高速度の回転力を供給して、搬送
ローラ9は新たな基板3を高速度でウェット処理槽2に
入れる。
Further, when the transport roller 11 transports the substrate 3, if a new substrate 3 comes across the inlet portion 2a of the wet processing bath 2, the first drive motor 10 switches the drive force again and transports it. By supplying a high-speed rotational force to the roller 9, the transport roller 9 puts a new substrate 3 into the wet processing bath 2 at a high speed.

【0013】以上のような薬液散布装置8によれば、駆
動モータ10により高速度で回転する搬送ローラ9を高
速度で基板3をウェット処理槽2内に搬入することがで
きる。そのため、基板3の前端部3aと後端部3bとが
ウェット処理槽2に入るタイムラグは極めて小さく、基
板3全体がほぼ同時にシャワー部7の下方に位置して、
基板3の全面に同時に薬液6を散布することができる。
According to the chemical liquid spraying device 8 as described above, the substrate 3 can be carried into the wet processing bath 2 at a high speed by the transport roller 9 rotating at a high speed by the drive motor 10. Therefore, the time lag when the front end portion 3a and the rear end portion 3b of the substrate 3 enter the wet processing bath 2 is extremely small, and the entire substrate 3 is positioned below the shower unit 7 almost at the same time.
The chemical solution 6 can be simultaneously sprayed on the entire surface of the substrate 3.

【0014】従って、基板3において薬液6による反応
開始のタイミングにズレがなく、散布される薬液6の分
布性能が向上して基板3上での反応ムラは発生しない。
これにより、製造される基板の精度を高めることができ
る。
Therefore, there is no deviation in the timing of the reaction start by the chemical liquid 6 on the substrate 3, the distribution performance of the chemical liquid 6 to be sprayed is improved, and the reaction unevenness on the substrate 3 does not occur.
Thereby, the precision of the manufactured substrate can be improved.

【0015】なお、上記の薬液散布装置8は、駆動モー
タ10,12という2つの駆動源を有しているが、たと
え駆動源が1つであっても、基板3がウェット処理槽2
の入口部2aに差掛かった時点で、搬送ローラを高速度
で回転させ、基板の全体がウェット処理槽の入った時点
で搬送ローラを低速度で回転させるという、駆動力切替
機構を有していれば、薬液散布装置8と同様の効果を期
待することができる。
Although the chemical spraying device 8 has two drive sources, that is, the drive motors 10 and 12, the substrate 3 has the wet processing bath 2 even if there is only one drive source.
It has a driving force switching mechanism that rotates the transport roller at a high speed when it reaches the entrance 2a of the substrate and rotates the transport roller at a low speed when the entire substrate enters the wet processing bath. If so, the same effect as that of the chemical liquid spraying device 8 can be expected.

【0016】[0016]

【発明が解決しようとする課題】しかし、以上のような
2つの駆動源もしくは駆動力切替機構を有している従来
例は、装置が複雑化・大形化するという問題点を抱えて
いる。また、ウェット処理槽入口部付近の搬送ローラを
高速回転させて、基板を高速で搬送させた場合、搬送さ
れる基板に対する慣性は強くなり、前方に位置する基板
に衝突して破損する等の危険性もあり、搬送される基板
に対する安全性が低いという問題があった。
However, the conventional example having the two driving sources or the driving force switching mechanism as described above has a problem that the apparatus becomes complicated and large-sized. In addition, when the transfer roller near the inlet of the wet processing tank is rotated at a high speed to transfer the substrate at a high speed, the inertia of the transferred substrate becomes strong, and there is a risk of colliding with a substrate positioned in front and damaging it. Therefore, there is a problem that the safety of the substrate to be transported is low.

【0017】本発明のウェット処理槽の薬液散布装置
は、以上の問題点を解消するために提案されたものであ
り、その目的は、薬液反応を基板全面に均一に施して製
造される基板精度を高めると共に、小形化が容易で、且
つ搬送される基板の安全性が高いウェット処理槽の薬液
散布装置を提供することである。
The chemical spraying device for a wet processing tank of the present invention has been proposed in order to solve the above problems, and its purpose is to obtain a substrate precision manufactured by uniformly performing a chemical reaction on the entire surface of the substrate. It is an object of the present invention to provide a chemical liquid spraying device for a wet processing tank, which is easy to downsize and has high safety of a substrate to be transported.

【0018】[0018]

【課題を解決するための手段】以上の課題を解決するた
めに、本発明のウェット処理槽の薬液散布装置は、LC
D等の基板を搬送する回転可能な搬送ローラと、搬送ロ
ーラに回転力を供給する駆動モータと、基板搬送方向に
傾斜して配置され、1回の発射で薬液を基板全面に散布
するように薬液を高速で噴射する高流速ノズルとを備え
たことを特徴とするものである。
In order to solve the above-mentioned problems, the chemical liquid spraying apparatus for a wet processing tank of the present invention is LC
A rotatable transport roller for transporting a substrate such as D, a drive motor for supplying a rotational force to the transport roller, and a tilted arrangement in the substrate transport direction, so that the chemical solution is sprayed over the entire surface of the substrate by one shot. It is characterized in that it is provided with a high flow rate nozzle for injecting a chemical liquid at high speed.

【0019】[0019]

【作用】以上のような構成を有する本発明において、搬
送ローラが基板を下方から支持し、駆動モータから回転
力が供給されて回転し、基板をウェット処理槽内に搬送
する。ウェット処理槽内に搬送された基板に対して、高
流速ノズルが薬液を高速で噴射する。高流速ノズルは基
板に対して傾斜して配置されているため、高流速ノズル
から発射された薬液を1回の発射で、基板全面に、まん
べんなく且つ同時に散布することができる。
In the present invention having the above-described structure, the transfer roller supports the substrate from below and is rotated by being supplied with the rotational force from the drive motor to transfer the substrate into the wet processing bath. The high-velocity nozzle jets the chemical liquid at high speed onto the substrate transported into the wet processing bath. Since the high-velocity nozzle is arranged so as to be inclined with respect to the substrate, the chemical solution ejected from the high-velocity nozzle can be uniformly and simultaneously sprayed over the entire surface of the substrate by one ejection.

【0020】従って、散布された部分から即座に反応が
始まる薬液を散布する場合、薬液反応は基板全面で同時
に起き、基板上で反応ムラが発生することがない。
Therefore, in the case of spraying the chemical solution in which the reaction starts immediately from the sprayed portion, the chemical solution reactions occur simultaneously on the entire surface of the substrate, and the reaction unevenness does not occur on the substrate.

【0021】[0021]

【実施例】進んで、本発明のウェット処理槽の薬液散布
装置の一実施例を図1及び図2に基づいて説明する。図
1は本実施例の構成を示す概念図であり、図2は本実施
例の要部斜視図である。なお、図3にて示した従来例と
同一部材に関しては同一符号を付し、説明は省略する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, one embodiment of the chemical liquid spraying device for a wet processing tank of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a conceptual diagram showing the configuration of the present embodiment, and FIG. 2 is a perspective view of the essential parts of the present embodiment. The same members as those in the conventional example shown in FIG. 3 are designated by the same reference numerals, and the description thereof will be omitted.

【0022】本実施例の薬液散布装置13は、ウェット
処理槽21に設けられており、1回の発射で薬液6を基
板3全面に散布するように薬液6を高速で噴射する高流
速ノズル16を備えた点を構成上の特徴としている。
The chemical liquid spraying device 13 of this embodiment is provided in the wet processing tank 21, and has a high flow rate nozzle 16 for spraying the chemical liquid 6 at a high speed so as to spray the chemical liquid 6 on the entire surface of the substrate 3 by one shot. Is a feature of the configuration.

【0023】この高流速ノズル16は、基板3の幅寸法
と同様の幅寸法を有しており、搬送ローラ4の上方に配
置されている。また、高流速ノズル16は、その先端部
がウェット処理槽2の入口部2a側に向いており、基板
3の搬送方向に傾斜して配置されている。また、ウェッ
ト処理槽21の入口部21aから出口部21bまでの長
さは、基板3の長さ寸法よりやや長く設定されており、
前記高流速ノズル16は、このウェット処理槽21の出
口部21b寄り上方に配置されている。
The high-velocity nozzle 16 has a width dimension similar to that of the substrate 3 and is arranged above the transport roller 4. Further, the high-velocity nozzle 16 has its tip end facing the inlet 2 a side of the wet processing bath 2 and is arranged so as to be inclined in the substrate 3 transport direction. The length of the wet processing bath 21 from the inlet 21a to the outlet 21b is set to be slightly longer than the length of the substrate 3.
The high flow velocity nozzle 16 is arranged above the outlet 21b of the wet processing bath 21.

【0024】以上の構成を有する本実施例において、駆
動モータ5から回転力が供給されて搬送ローラ4は低速
で回転するように設定されており、搬送ローラ4により
基板3はウェット処理槽21内を低速で搬送される。搬
送された基板3の前端部3aが高流速ノズル16の下方
位置に差掛かった時点で、高流速ノズル16が薬液6を
1回、噴射する。この時、高流速ノズル16は基板3の
幅寸法と同様の幅寸法を有しているため、薬液6は基板
3の前端部3aの幅寸法全体に渡って発射される。
In the present embodiment having the above-mentioned structure, the driving motor 5 supplies the rotational force to the conveying roller 4 so that the conveying roller 4 is rotated at a low speed. Is transported at low speed. When the front end portion 3a of the conveyed substrate 3 reaches the position below the high flow rate nozzle 16, the high flow rate nozzle 16 sprays the chemical liquid 6 once. At this time, since the high-velocity nozzle 16 has the same width dimension as the width dimension of the substrate 3, the chemical liquid 6 is sprayed over the entire width dimension of the front end portion 3 a of the substrate 3.

【0025】また、高流速ノズル16は基板3の搬送方
向に対向して傾斜して配置されているため、薬液6は基
板3の前端部3aから後端部3bへスムーズに流れる。
この時、高流速ノズル16から噴射された薬液6は、
0.5〜1秒程度で基板3の前端部3aから後端部3b
まで広がり、基板3全面にまんべんなく薬液6が散布さ
れる。
Further, since the high-velocity nozzle 16 is disposed so as to be opposed to the substrate 3 in the conveying direction, the chemical solution 6 smoothly flows from the front end portion 3a to the rear end portion 3b of the substrate 3.
At this time, the chemical liquid 6 jetted from the high-velocity nozzle 16 is
From the front end 3a to the rear end 3b of the substrate 3 in about 0.5 to 1 second
The chemical solution 6 is spread evenly over the entire surface of the substrate 3 and sprayed over the entire surface of the substrate 3.

【0026】以上のような薬液散布装置13によれば、
高流速ノズル16が1回の発射で薬液6を基板3全面に
まんべんなく、且つほぼ同時に散布することができるた
め、薬液6による反応開始のタイミングが基板3上でず
れることがない。従って、薬液反応が基板3全面でほぼ
同時に起き、基板3上での反応ムラを防止できる。これ
により、薬液6による反応を基板3全面に均一に施すこ
とが可能となり、基板製造工程にて製造される基板3の
精度を高めることができる。
According to the chemical liquid spraying device 13 as described above,
The high-velocity nozzle 16 can evenly spray the chemical liquid 6 over the entire surface of the substrate 3 by one shot, and therefore the reaction start timing by the chemical liquid 6 does not shift on the substrate 3. Therefore, the chemical reaction occurs almost simultaneously on the entire surface of the substrate 3, and the reaction unevenness on the substrate 3 can be prevented. Thereby, the reaction by the chemical liquid 6 can be uniformly applied to the entire surface of the substrate 3, and the accuracy of the substrate 3 manufactured in the substrate manufacturing process can be improved.

【0027】また、本実施例の薬液散布装置13の駆動
源は、搬送ローラ4を低速回転させる駆動モータ51つ
だけである。そのため、2つの駆動源もしくは駆動力切
替機構を設ける必要がなく、装置の構成を簡略化するこ
とができ、小形化が容易である。
The drive source of the chemical liquid spraying device 13 of this embodiment is only the drive motor 51 for rotating the conveying roller 4 at a low speed. Therefore, it is not necessary to provide two driving sources or a driving force switching mechanism, the configuration of the device can be simplified, and the size can be easily reduced.

【0028】更に、駆動モータ5により搬送ローラ4が
基板3を低速で搬送するため、搬送される基板3に対す
る慣性は弱く、前方に位置する基板3に衝突して破損す
る等の事故が発生せず、基板3に対する安全性が高い。
しかも、本実施例によれば、高流速ノズル16から1
回、薬液6を発射するだけで、基板3全体に薬液6を散
布可能であるため、ウェット処理槽21の長さ寸法は、
基板3を完全に収納可能な長さだけあれば十分である。
そのため、装置の小形化を大幅に進めることができ、基
板製造工程の小形化も促進される。
Furthermore, since the transport roller 4 transports the substrate 3 at a low speed by the drive motor 5, the inertia with respect to the transported substrate 3 is weak, and an accident such as a collision with the substrate 3 located in front and damage is caused. In addition, the safety of the substrate 3 is high.
Moreover, according to the present embodiment, the high velocity nozzles 16 to 1
Since the chemical solution 6 can be sprayed over the entire substrate 3 only by ejecting the chemical solution 6 once, the length dimension of the wet processing bath 21 is
It suffices if the substrate 3 has a length that allows it to be completely stored.
Therefore, the size of the device can be greatly reduced, and the size of the substrate manufacturing process can be reduced.

【0029】また、装置の小形化と同時に搬送ローラ4
の設置数が減少するため、装置の製造コストを抑えるこ
とができるので、経済的にも有利である。なお、本発明
のウェット処理槽の薬液散布装置は、以上のような実施
例に限定されるものではなく、高流速ノズルの先端部は
ウェット処理槽の出口部側に向いていても良く、また基
板搬送方向に対する高流速ノズルの傾斜角度も適宜変更
可能である。
At the same time as the apparatus is downsized, the transport roller 4
Since the number of installed devices can be reduced, the manufacturing cost of the device can be suppressed, which is economically advantageous. The chemical liquid spraying device for the wet processing tank of the present invention is not limited to the above embodiment, and the tip of the high-velocity nozzle may face the outlet side of the wet processing tank. The inclination angle of the high flow rate nozzle with respect to the substrate transport direction can also be changed appropriately.

【0030】[0030]

【発明の効果】以上述べたように、本発明のウェット処
理槽の薬液散布装置によれば、1回の発射で薬液を基板
全面に散布するように薬液を高速で噴射する高流速ノズ
ルを、基板搬送方向に対して傾斜して配置するという極
めて簡単な構成によって、高流速ノズルが1回の発射で
薬液を基板全面にまんべんなく、且つ同時に散布するこ
とができるため、薬液による反応を基板全面に均一に施
すことができ、基板製造工程にて製造される基板の精度
を高めることができる。
As described above, according to the chemical spraying device of the wet processing tank of the present invention, the high-velocity nozzle for spraying the chemical at a high speed so as to spray the chemical on the entire surface of the substrate by one shot, Due to the extremely simple structure of arranging it obliquely with respect to the substrate transport direction, the high-velocity nozzle can spray the chemical solution evenly over the entire surface of the substrate with one shot, so that the reaction by the chemical solution can be spread over the entire surface of the substrate. It can be applied uniformly, and the precision of the substrate manufactured in the substrate manufacturing process can be improved.

【0031】また、本発明によれば、駆動源として搬送
ローラを低速回転させる駆動モータを1つ備えるだけで
あるため、小形化が容易であり、且つ搬送される基板に
対して優れた安全性を確保することができる。
Further, according to the present invention, since only one drive motor for rotating the conveying roller at a low speed is provided as a drive source, downsizing is easy, and excellent safety for the conveyed substrate is ensured. Can be secured.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のウェット処理槽の薬液散布装置の一実
施例の構成を示す概念図。
FIG. 1 is a conceptual diagram showing a configuration of an embodiment of a chemical spraying device for a wet processing tank of the present invention.

【図2】本実施例の要部斜視図。FIG. 2 is a perspective view of a main part of this embodiment.

【図3】従来のウェット処理槽の薬液散布装置の構成を
示す概念図。
FIG. 3 is a conceptual diagram showing the configuration of a conventional chemical spraying device for a wet processing tank.

【図4】従来のウェット処理槽の薬液散布装置の構成を
示す概念図。
FIG. 4 is a conceptual diagram showing the configuration of a conventional chemical spraying device for a wet processing tank.

【符号の説明】[Explanation of symbols]

3 基板 4 搬送ローラ 5 駆動モータ 6 薬液 13 薬液散布装置 16 高流速ノズル 21 ウェット処理槽 3 Substrate 4 Conveyor Roller 5 Drive Motor 6 Chemical Solution 13 Chemical Solution Dispersing Device 16 High Flow Nozzle 21 Wet Processing Tank

Claims (1)

【特許請求の範囲】 【請求項1】 LCD等の基板にエッチング処理や現像
処理等を行うウェット処理槽にて、前記基板に所定の薬
液を散布する薬液散布装置において、 前記基板を搬送する回転可能な搬送ローラと、 前記搬送ローラに回転力を供給する駆動モータと、 基板搬送方向に傾斜して配置され、1回の発射で薬液を
基板全面に散布するように薬液を高速で噴射する高流速
ノズルと、備えていることを特徴とするウェット処理槽
の薬液散布装置。
Claim: What is claimed is: 1. A chemical solution spraying apparatus for spraying a predetermined chemical solution onto a substrate such as an LCD in a wet processing tank for performing etching processing, developing processing, etc. on the substrate, and a rotation for transporting the substrate. A possible transport roller, a drive motor that supplies a rotational force to the transport roller, and an inclined drive circuit in the substrate transport direction, which sprays the chemical solution at a high speed so as to spray the chemical solution over the entire surface in one shot. A chemical spraying device for a wet processing tank, which is equipped with a flow velocity nozzle.
JP16590091A 1991-07-05 1991-07-05 Chemical sprayer for wet processing tank Expired - Lifetime JP3207218B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16590091A JP3207218B2 (en) 1991-07-05 1991-07-05 Chemical sprayer for wet processing tank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16590091A JP3207218B2 (en) 1991-07-05 1991-07-05 Chemical sprayer for wet processing tank

Publications (2)

Publication Number Publication Date
JPH0513403A true JPH0513403A (en) 1993-01-22
JP3207218B2 JP3207218B2 (en) 2001-09-10

Family

ID=15821126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16590091A Expired - Lifetime JP3207218B2 (en) 1991-07-05 1991-07-05 Chemical sprayer for wet processing tank

Country Status (1)

Country Link
JP (1) JP3207218B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108389818A (en) * 2018-05-14 2018-08-10 安徽宏实自动化装备有限公司 A kind of wet process equipment dynamic etch liquid uniforming device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108389818A (en) * 2018-05-14 2018-08-10 安徽宏实自动化装备有限公司 A kind of wet process equipment dynamic etch liquid uniforming device

Also Published As

Publication number Publication date
JP3207218B2 (en) 2001-09-10

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