JPH05132774A - Sputtering apparatus - Google Patents

Abstract

PURPOSE:To thin a backing plate and to strengthen the control of film quality, in a sputtering apparatus by sealing a jacket for cooling water at the rear of a backing plate for holding a target with a cover or evacuating the inside of a magnet chamber at the rear of the backing plate. CONSTITUTION:At the time of evacuating the inside of a sputtering chamber 1 provided with the substrate 10 to be treated and a target 9 by an exhaust port 3, introducing a gas for electric discharge from a gas introducing port 2 under a low pressure and forming the thin film of the target 9 material on the surface of the substrate 10 by glow discharge, a jacket 4A for water cooling provided at the rear of the backing plate 4 of the target 9 is provided with a cover 4B fixed by silver solder, and the pressure of the water cooling applied to the backing plate 4 is released, or furthermore, the inside of a magnet chamber 6 charged with a magnet 5 for magnetron sputtering is evacuated to a low pressure similar to that in the sputtering chamber 1. The thickness can be reduced without the deformation of the backing plate 4 caused by pressurizing in a direction of the sputtering chamber 1, and the control of the film quality of the thin film on the substrate 10 by the magnetic field of the magnet 5 can be made easy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus, and more particularly to the structure of a backing plate and magnet chamber of a sputtering gun.

Sputtering devices are widely used for forming various films in the manufacturing process of semiconductor devices and LCD devices. The backing plate of the sputter gun is a plate on which a sputter material (target) is set.

In recent years, in the film forming process by sputtering, the target has a large diameter and the backing plate has become heavy due to the increase in the size of the film-forming substrate, making it difficult to handle. Also, the magnetic field strength of magnetron sputtering has been increased to control the film quality. Furthermore, it has become necessary to reduce the effect of contamination by fine particles.

[0004]

2. Description of the Related Art Conventional sputter guns are classified into a planar type and a mortar type, but the planar type has become the mainstream due to the introduction of a full-scale erosion type (magnetron sputtering type) which is effective in reducing fine particles. ..

FIG. 3 is a sectional view of a conventional planar type magnetron sputter. In the figure, 1 is a sputtering chamber, 2 is a gas inlet, 3 is an exhaust port, 4 is a backing plate, 5 is a permanent magnet, 7 is a motor, 8 is a cooling water inlet / outlet,
Reference numeral 9 is a target, and 10 is a substrate to be processed.

[0006] As a method of making the entire surface erosion of the planar type, most of the structure is to rotate the permanent magnet 5. In this case, the spatter gun has a structure in which the backing plate 4 has a hat shape, a rotary magnet is set therein, and cooling water is passed.

[0007]

When the conventional hat-type backing plate is used, the backing plate is subjected to the sum of the atmospheric pressure and the water pressure because the cooling water is flowing in the backing plate. The thickness of the backing plate must be increased to withstand these pressures when applied. This results in hindering attempts to increase the magnetic field strength to control film quality.

An object of the present invention is to reduce the thickness of the backing plate to increase the magnetic field strength and control the film quality, to reduce the weight of the backing plate and to prevent the magnets from rusting.

[0009]

Means for Solving the Problems To solve the above problems, 1) a backing plate body having a target, which is a sputtering material, held on the front surface and a water cooling jacket engraved on the back surface is covered with a lid from the back surface of the jacket A sputtering device having a backing plate with a structure capable of passing cooling water inside, or 2) a magnet chamber for holding a target on the front surface and a magnet for magnetron sputtering on the back surface, and the magnet chamber is airtight and exhausted. This is achieved by a sputtering device characterized by having a possible structure.

[0010]

In the present invention, the water cooling jacket is engraved in the backing plate, the lid is closed by silver brazing, and the cooling water is passed through. Therefore, the water pressure component of the force deforming the backing plate is removed. Only atmospheric pressure is used. Furthermore, in order to make the backing plate thinner, a rotating magnet is placed in the magnet chamber and the magnet chamber is decompressed in the same way as the sputter chamber so that the backing plate is not exposed to atmospheric pressure.

By making the backing plate thin, the magnetic field strength on the target surface acting as magnetron sputter becomes strong, and even in the permanent magnet rotating type, the strength of 700 Gauss or more can be easily achieved in the horizontal component (component parallel to the target surface). It is possible to control the film quality by magnetic force.

[0012]

1 is a sectional view of a planar type magnetron sputtering apparatus according to an embodiment of the present invention.

In the figure, 1 is a sputtering chamber, 2 is a gas inlet, 3 is an exhaust port, 4 is a backing plate body, 4A is a water cooling jacket carved in the backing plate body, and 4B is a lid brazed with silver. , 4C is the inlet / outlet of cooling water,
5 is a permanent magnet, 6 is a magnet chamber, 7 is a motor, 9 is a target, and 10 is a substrate.

In the embodiment, the magnet chamber 6 is evacuated in the same manner as the sputtering chamber 1, so that no atmospheric pressure is applied to the backing plate, so the backing plate is made thin.

Further, since the backing plate has the structure shown in FIG. 3, the cooling water flows in the backing plate and the cooling efficiency is good. FIG. 2 is a plan view of the backing plate of the embodiment.

In the figure, a water jacket 4A shown by a dotted line is formed by brazing silver on the backing plate body 4 with a lid 4B, and led out to the outside by a cooling water inlet / outlet port 4C.

[0017]

According to the present invention, since the backing plate is made thin, the magnetic field strength can be increased to control the film quality, and the backing plate can be made lighter and easier to handle. Moreover, since the magnet does not come into direct contact with the cooling water, the magnet can be rust-proofed and a long life can be expected. Also,
The target cooling efficiency is very high. Further, even if the distance between the magnet and the backing plate is arbitrarily changed, it does not affect the cooling effect.

[Brief description of drawings]

FIG. 1 is a sectional view of a planar type magnetron sputtering apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the backing plate of the embodiment.

FIG. 3 is a sectional view of a planar type magnetron sputtering apparatus according to a conventional example.

[Explanation of symbols]

1 is a sputter chamber 2 Gas inlet 3 Sputter chamber exhaust port 4 Backing plate body 4A Water cooling jacket carved in the backing plate body 4B Silver brazed lid 4C Cooling water inlet / outlet 5 Permanent magnet 6 Magnet chamber 6A Magnet Room exhaust port 7 Motor 8 Cooling water inlet / outlet 9 Target 10 Substrate

Claims (2)

[Claims] 1. A backing having a target, which is a sputtering material, held on the front surface and a water cooling jacket engraved on the back surface of the backing plate body, which is covered from the back surface so that cooling water can pass through the backing plate body. A sputtering apparatus having a plate. 2. A magnet chamber for holding a target on the front surface and a magnet for magnetron sputtering on the back surface,
A sputtering apparatus, wherein the magnet chamber is airtight and has a structure capable of being exhausted.