JPH05129746A - Conductor wire connection structure of circuit board and manufacture thereof - Google Patents

Conductor wire connection structure of circuit board and manufacture thereof

Info

Publication number
JPH05129746A
JPH05129746A JP31753791A JP31753791A JPH05129746A JP H05129746 A JPH05129746 A JP H05129746A JP 31753791 A JP31753791 A JP 31753791A JP 31753791 A JP31753791 A JP 31753791A JP H05129746 A JPH05129746 A JP H05129746A
Authority
JP
Japan
Prior art keywords
circuit board
conductor wire
conductor
exposed end
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31753791A
Other languages
Japanese (ja)
Inventor
Masataka Kurata
優孝 倉田
Hayato Naito
速人 内藤
Izumi Komatsu
泉 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Sankyo Corp
Original Assignee
Nidec Sankyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Sankyo Corp filed Critical Nidec Sankyo Corp
Priority to JP31753791A priority Critical patent/JPH05129746A/en
Publication of JPH05129746A publication Critical patent/JPH05129746A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Abstract

PURPOSE:To conduct the electrical connection work of a conductor wire efficiently and reliably and to improve the productivity of a circuit board. CONSTITUTION:An exposed end part 14a of a conductor wire 14 is superposed on contact members 17 reflow-soldered on land parts 16a of a conductor foil pattern 16 in the state of an electrical contact to the members 17, a fixing means 15 is datachably made to fit in the side of a circuit board 12 and the exposed end part 14a of the wire 14 is to made to press-bondecl simply and reliably to the side of the land parts 16a of the pattern 16 by the pressing force of this means 15 via the members 17. In such a way, a conductive wire connection structure of the circuit board is manufactured.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、回路基板上に形成され
た導体箔パターンと導体線とを電気的に接続してなる回
路基板の導体線接続構造及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor wire connection structure for a circuit board, which is formed by electrically connecting a conductor foil pattern formed on a circuit board and a conductor wire, and a manufacturing method thereof.

【0002】[0002]

【従来の技術】一般に、回路基板上に形成された導体箔
パターンに導体線を接続するにあたって、図6ないし図
8に示されたような導体線接続構造が用いられている。
まず図6に示された導体線接続構造では、回路基板1上
に形成された導体箔パターンのランド部に、リフローハ
ンダ付け等によって雄コネクタ2が装荷されているとと
もに、導体線としてのリード線3の露出端部には雌コネ
クタ4が設けられている。そして上記雌コネクタ4を雄
コネクタ2側に嵌合させることによって、リード線3の
接続が行われる。また図7に示されたものでは、回路基
板1側に雌コネクタ5が設置されており、フラットケー
ブル6の露出端部を上記雌コネクタ5内に差し込むこと
によってフラットケーブルの接続が行われる。さらに図
8に示されたものでは、リード線7の露出端部が、回路
基板1側の導体箔パターンのランド部に対して直接的に
ハンダ付けされている。
2. Description of the Related Art Generally, in connecting a conductor wire to a conductor foil pattern formed on a circuit board, a conductor wire connecting structure as shown in FIGS. 6 to 8 is used.
First, in the conductor wire connection structure shown in FIG. 6, the male connector 2 is loaded on the land portion of the conductor foil pattern formed on the circuit board 1 by reflow soldering or the like, and the lead wire as the conductor wire is used. A female connector 4 is provided at the exposed end portion of 3. Then, the lead wire 3 is connected by fitting the female connector 4 to the male connector 2 side. Further, in the structure shown in FIG. 7, the female connector 5 is installed on the circuit board 1 side, and the flat cable is connected by inserting the exposed end of the flat cable 6 into the female connector 5. Further, in the structure shown in FIG. 8, the exposed end portion of the lead wire 7 is directly soldered to the land portion of the conductor foil pattern on the circuit board 1 side.

【0003】[0003]

【発明が解決しようとする課題】しかしながら図6及び
図7における導体線接続構造では、リフロー工程を施す
ために耐熱性のコネクタを用いねばならならず、合理化
が難しいという問題がある。また図8に示された導体線
接続構造では、人手によるハンダ付け作業を必要とする
ため、生産性に問題があり、接続ミスも発生し易く、し
かもリード線の着脱を容易に行うことができないという
問題がある。
However, in the conductor wire connection structure shown in FIGS. 6 and 7, a heat resistant connector must be used in order to perform the reflow process, and there is a problem that it is difficult to rationalize. Further, the conductor wire connection structure shown in FIG. 8 requires a manual soldering work, which causes a problem in productivity, is likely to cause a connection error, and cannot easily attach and detach the lead wire. There is a problem.

【0004】そこで本発明は、回路基板の導体箔パター
ンと導体線とを、簡易かつ確実に、しかも着脱可能に接
続することができるようにした回路基板の導体線接続構
造及びその製造方法を提供することを目的とする。
Therefore, the present invention provides a conductor wire connection structure for a circuit board and a method for manufacturing the same so that the conductor foil pattern of the circuit board and the conductor wire can be connected easily, reliably and detachably. The purpose is to do.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
本発明にかかる回路基板の導体線接続構造は、回路基板
上に形成された導体箔パターンのランド部に、導体線の
露出端部が電気的に接続されてなる回路基板の導体線接
続構造において、上記導体箔パターンのランド部上にリ
フローによりハンダ付けされた接点部材と、この接点部
材上に電気的接触状態にて重ね合わせられた導体線の露
出端部と、前記回路基板側に着脱自在に嵌合された固定
手段と、を備えてなり、上記固定手段の嵌合押圧力によ
って、導体線の露出端部が、接点部材を介して導体箔パ
ターンのランド部側に圧接固定された構成になされてい
る。また本発明にかかる回路基板の導体線接続構造の製
造方法は、回路基板上に形成された導体箔パターンのラ
ンド部に、導体線の露出端部を電気的に接続するように
した回路基板の導体線接続構造の製造方法において、上
記導体箔パターンのランド部上に、リフローによって接
点部材をハンダ付けする工程と、上記接点部材上に、導
体線の露出端部を電気的接触状態にて重ね合わせる工程
と、前記回路基板側に着脱自在に固定手段を嵌合し、当
該固定手段の嵌合押圧力によって導体線の露出端部を、
導体箔パターンのランド部側に接点部材を介して圧接さ
せることにより導体線の固定を行う工程と、備えた構成
になされている。
In order to achieve the above object, a conductor wire connection structure for a circuit board according to the present invention has an exposed end portion of the conductor wire in a land portion of a conductor foil pattern formed on the circuit board. In a conductor wire connection structure of a circuit board electrically connected, a contact member soldered on the land portion of the conductor foil pattern by reflow and a contact member superposed in an electrically contact state on the contact member. An exposed end portion of the conductor wire and a fixing means detachably fitted to the circuit board side are provided, and the exposed end portion of the conductor wire serves as a contact member due to a fitting pressing force of the fixing means. It is configured such that it is pressed and fixed to the land portion side of the conductor foil pattern via. Further, the method for manufacturing a conductor wire connection structure for a circuit board according to the present invention is a circuit board in which an exposed end of a conductor wire is electrically connected to a land portion of a conductor foil pattern formed on the circuit board. In the method for manufacturing a conductor wire connection structure, a step of soldering a contact member on the land portion of the conductor foil pattern by reflow, and an exposed end portion of the conductor wire being superposed on the contact member in an electrically contacting state. The step of aligning, the fixing means is detachably fitted to the circuit board side, and the exposed end portion of the conductor wire is attached by the fitting pressing force of the fixing means.
The conductor wire is fixed to the land portion side of the conductor foil pattern via a contact member to fix the conductor wire.

【0006】[0006]

【作用】このような構成を備える各手段においては、回
路基板に固定手段を嵌合させることのみによって、回路
基板上の導体箔パターンと導体線とが圧接され電気的に
接続される。この電気的接続は、接点部材を介して行わ
れるものであるから、極めて良好な接触状態に維持され
る。また固定手段を回路基板側から外せば、導体箔パタ
ーンから導体線が離脱されるようになっている。
In each means having such a structure, the conductor foil pattern and the conductor wire on the circuit board are pressed and electrically connected only by fitting the fixing means to the circuit board. Since this electrical connection is made via the contact member, an extremely good contact state is maintained. Further, if the fixing means is removed from the circuit board side, the conductor wire can be separated from the conductor foil pattern.

【0007】[0007]

【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。本発明を、キャプスタンモータに適用した
実施例が図1ないし図4に示されている。まず図4のよ
うに、キャプスタンモータの本体部11に対し回路基板
12が取り付けられている。この回路基板12には、各
種モータ回路部品13が装荷されているとともに、導体
線としてのフラットケーブル14の露出端部14aが固
定手段としての押込固定具15を介して接続されてい
る。
Embodiments of the present invention will now be described in detail with reference to the drawings. An embodiment in which the present invention is applied to a capstan motor is shown in FIGS. 1 to 4. First, as shown in FIG. 4, the circuit board 12 is attached to the main body 11 of the capstan motor. A variety of motor circuit components 13 are loaded on the circuit board 12, and an exposed end portion 14a of a flat cable 14 as a conductor wire is connected via a pushing fixture 15 as a fixing means.

【0008】ここで図1ないし図3に示されているよう
に、本実施例おける回路基板12は、鉄基板12aの表
面上に絶縁層12bを被着してなるものであり、この絶
縁層12bを介して複数条の導体箔パターン16が形成
されている。この導体箔パターン16の端部には、ラン
ド部16aが形成されており、当該ランド部16a上に
は、まずリフローによってスイッチ接点部材17がハン
ダ付けされている。ついでこのスイッチ接点部材17の
表面上には、前記フラットケーブル14の露出端部14
aが、電気的接触状態にて重ね合わせられている。導体
箔パターン16のランド部16aにおける電気的接触領
域には、レジスト、シルク印刷等はかけられておらず、
スイッチ接点部材17が接続されるまでテーピング等に
よって保護されている。なお、リフローによって他の回
路部品をハンダ付けする工程で、スイッチ接点部材17
を同時にリフローによってハンダ付けすることも可能で
あるから、スイッチ接点部材17をハンダ付けするため
の工程を別に追加する必要はない。
Here, as shown in FIGS. 1 to 3, the circuit board 12 in this embodiment is obtained by depositing an insulating layer 12b on the surface of an iron substrate 12a. A plurality of conductor foil patterns 16 are formed via 12b. A land portion 16a is formed at an end portion of the conductor foil pattern 16, and a switch contact member 17 is first soldered on the land portion 16a by reflow. Then, on the surface of the switch contact member 17, the exposed end portion 14 of the flat cable 14 is provided.
a is superposed in an electrically contacting state. No resist, silk printing or the like is applied to the electrical contact region of the land portion 16a of the conductor foil pattern 16,
It is protected by taping or the like until the switch contact member 17 is connected. In the process of soldering other circuit components by reflow, the switch contact member 17
Since it is also possible to simultaneously solder the switch contact members by reflow, it is not necessary to separately add a step for soldering the switch contact member 17.

【0009】一方前記回路基板12には、導体箔パター
ン16の幅方向において、ランド部16aを両側から挾
むようにして一対の取付穴18,18が貫通形成されて
いる。そしてこの取付穴18,18内に、前記押込固定
具15の脚部15a,15aが着脱自在に嵌合されてい
る。押込固定具15の脚部15a,15aは、本体胴1
5bの両端部から、回路基板12側に向かって突出する
ように設けられており、当該脚部15a,15aの各先
端部に形成された半割構造の矢先状係合部が、前記回路
基板12側の取付穴18,18内に挿入されて着脱自在
に嵌合されるようになっている。
On the other hand, a pair of mounting holes 18, 18 are formed through the circuit board 12 so as to sandwich the land portion 16a from both sides in the width direction of the conductor foil pattern 16. The leg portions 15a, 15a of the pressing fixture 15 are detachably fitted in the mounting holes 18, 18. The legs 15a, 15a of the push-in fixture 15 are the main body 1
5b is provided so as to project toward both sides of the circuit board 12 from the both ends thereof, and the arrow-shaped engaging portions of the half-split structure formed at the respective tip portions of the leg portions 15a, 15a are the circuit board. It is designed to be inserted into the mounting holes 18, 18 on the 12th side so as to be detachably fitted.

【0011】上記押込固定具15が回路基板12側に嵌
着された状態において、本体胴15bの回路基板12側
に対面する部分は、前記フラットケーブル14の露出端
部14a上にプラスチック製の補強板19を介して圧接
されている。このとき押込固定具15の本体胴15bに
は、押圧部15c,15c,…が突設されている。これ
らの各押圧部15cは、銅箔パターン16のランド部1
6aとスイッチ接点部材17とフラットケーブル14の
露出端部14aとの重合位置に対応して配置されてお
り、押込固定具15の圧接力を集束させるようになって
いる。これによってフラットケーブル14への押込力は
増大され、フラットケーブル14の露出端部14aが、
スイッチ接点部材17及び導体箔パターン16のランド
部16a側に強圧される。
In the state where the push-in fixture 15 is fitted to the circuit board 12 side, the portion of the body barrel 15b facing the circuit board 12 side is reinforced with plastic on the exposed end 14a of the flat cable 14. The plates 19 are pressed against each other. At this time, the body 15b of the push-in fixture 15 is provided with pressing portions 15c, 15c ,. Each of these pressing portions 15c is a land portion 1 of the copper foil pattern 16.
6a, the switch contact member 17, and the exposed end portion 14a of the flat cable 14 are arranged in correspondence with each other, and the pressure contact force of the pressing fixture 15 is focused. As a result, the pushing force into the flat cable 14 is increased, and the exposed end portion 14a of the flat cable 14 becomes
The switch contact member 17 and the conductor foil pattern 16 are strongly pressed against the land portion 16a side.

【0012】このように上記実施例において、押込固定
具15を回路基板12側に嵌合させれば、押込固定具1
5の押圧力によってフラットケーブル14が、スイッチ
接点部材17及び導体箔パターン16上に圧接され、フ
ラットケーブル14の電気的接続が行われる。したがっ
てフラットケーブル14の接続にあたっては、従来のよ
うにコネクタを用いたり、ハンダ付けを行う必要はな
く、接続作業は容易かつ確実に行われる。このフラット
ケーブル14の電気的接続は、スイッチ接点部材17を
介して行われるものであるから、極めて良好な接触状態
に維持される。
As described above, in the above-described embodiment, if the push-fitting fixture 15 is fitted to the circuit board 12 side, the push-fitting fixture 1
The flat cable 14 is pressed against the switch contact member 17 and the conductor foil pattern 16 by the pressing force of 5, and the flat cable 14 is electrically connected. Therefore, when connecting the flat cable 14, there is no need to use a connector or soldering as in the conventional case, and the connecting work can be performed easily and surely. Since the electric connection of the flat cable 14 is performed through the switch contact member 17, the contact state is maintained extremely excellent.

【0013】また逆に、押込固定具15の嵌合状態を解
いて回路基板12側から押込固定具15を外してやれ
ば、スイッチ接点部材17及び導体箔パターン16から
フラットケーブル14が離脱される。
On the other hand, when the push-fastening fixture 15 is released and the push-fastening fixture 15 is removed from the circuit board 12, the flat cable 14 is detached from the switch contact member 17 and the conductor foil pattern 16.

【0014】このとき図5に示された実施例のように、
フラットケーブル14の露出端部14aにおける両縁部
分に、半円状の案内部14b,14bを切欠き形成して
おき、これら各案内部14b,14bを前記押込固定具
15の脚部15a,15aのそれぞれに係合させること
とすれば、フラットケーブル14の位置決めを容易かつ
確実に行わせることができる。また、導体線接続後にお
いて、外力による導体線のずれが防止効果及び抜け防止
効果がある。
At this time, as in the embodiment shown in FIG.
Semi-circular guide portions 14b and 14b are cut out at both edge portions of the exposed end portion 14a of the flat cable 14, and the guide portions 14b and 14b are formed into the leg portions 15a and 15a of the pushing fixture 15. If they are engaged with each other, the flat cable 14 can be positioned easily and surely. Further, after connecting the conductor wires, there is an effect of preventing the conductor wires from being displaced by an external force and an effect of preventing the conductor wires from coming off.

【0015】上述した実施例では、押込固定具15の両
端部に脚部15aを一対設けることとしているが、脚部
15aを3体以上にわたって設けることも可能である。
このようにすれば、押込固定具15による固定性を強化
することができる。
In the above-described embodiment, a pair of legs 15a are provided at both ends of the push-in fixture 15, but it is also possible to provide three or more legs 15a.
In this way, the fixability of the push-in fixture 15 can be enhanced.

【0016】本発明は、フラットケーブル以外の各種導
体線に対しても同様に適用することができるものであ
り、また回路基板の種類を問わず適用可能である。
The present invention can be similarly applied to various conductor wires other than the flat cable, and can be applied to any type of circuit board.

【0017】[0017]

【発明の効果】以上述べたように本発明は、導体箔パタ
ーンのランド部上に、接点部材をリフローハンダ付けす
るとともに、この接点部材上に導体線の露出端部を電気
的接触状態にて重ね合わせ、それらを着脱自在に嵌着さ
れた固定手段で押えることによって導体線の接続固定を
行うようにしたものであるから、回路基板に固定手段を
嵌合させることのみによって、回路基板の導体箔パター
ンと導体線との接続を簡易に行うことができ、かつ接点
部材を介して確実に行わせることができる。また固定手
段を回路基板側から外すことによって、導体箔パターン
側から導体線を離脱させることができる。したがって本
発明によれば、導体線の電気的接続作業を効率的に行う
ことができ、回路基板の生産性を向上させることができ
るとともに、製品の信頼性及びメンテナンス性を向上さ
せることができる。
As described above, according to the present invention, the contact member is reflow-soldered on the land portion of the conductor foil pattern, and the exposed end portion of the conductor wire is electrically contacted on the contact member. Since the conductor wires are connected and fixed by overlapping and pressing them with the fixing means that is detachably fitted, the conductors of the circuit board can be obtained only by fitting the fixing means to the circuit board. The connection between the foil pattern and the conductor wire can be easily made, and the connection can be surely made through the contact member. Further, by removing the fixing means from the circuit board side, the conductor wire can be separated from the conductor foil pattern side. Therefore, according to the present invention, the work of electrically connecting the conductor wires can be efficiently performed, the productivity of the circuit board can be improved, and the reliability and maintainability of the product can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における回路基板の導体線接
続構造を表わした分解斜視図である。
FIG. 1 is an exploded perspective view showing a conductor wire connection structure of a circuit board according to an embodiment of the present invention.

【図2】図1に表わされた実施例における導体線接続構
造の縦断面図である。
FIG. 2 is a vertical cross-sectional view of the conductor wire connection structure in the embodiment shown in FIG.

【図3】図1に表わされた実施例における導体線接続構
造の横断面図である。
FIG. 3 is a cross-sectional view of a conductor wire connection structure in the embodiment shown in FIG.

【図4】本発明を適用したモータの回路基板の一例を表
わした側面説明図である。
FIG. 4 is a side view showing an example of a circuit board of a motor to which the present invention is applied.

【図5】本発明の他の実施例おける回路基板の導体線接
続構造を表わした平面説明図である。
FIG. 5 is an explanatory plan view showing a conductor wire connection structure of a circuit board according to another embodiment of the present invention.

【図6】従来における導体線接続構造の一例を表わした
縦断面説明図である。
FIG. 6 is a vertical cross-sectional explanatory view showing an example of a conventional conductor wire connection structure.

【図7】従来における導体線接続構造の他の例を表わし
た縦断面説明図である。
FIG. 7 is a vertical cross-sectional explanatory view showing another example of a conventional conductor wire connection structure.

【図8】従来における導体線接続構造のさらに他の例を
表わした縦断面説明図である。
FIG. 8 is an explanatory longitudinal sectional view showing still another example of the conventional conductor wire connection structure.

【符号の説明】[Explanation of symbols]

12 回路基板 14a フラットケーブルの露出端部 15 押込固定具 16a 導体箔パターンのランド部 17 スイッチ接点部材 12 circuit board 14a exposed end of flat cable 15 indentation fixture 16a land of conductor foil pattern 17 switch contact member

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 回路基板上に形成された導体箔パターン
のランド部に、導体線の露出端部が電気的に接続されて
なる回路基板の導体線接続構造において、 上記導体箔パターンのランド部上にリフローによりハン
ダ付けされた接点部材と、この接点部材上に電気的接触
状態にて重ね合わせられた導体線の露出端部と、前記回
路基板側に着脱自在に嵌合された固定手段と、を備えて
なり、 上記固定手段の嵌合押圧力によって、導体線の露出端部
が、接点部材を介して導体箔パターンのランド部側に圧
接固定されていることを特徴とする回路基板の導体線接
続構造。
1. A conductor wire connection structure for a circuit board, wherein an exposed end of a conductor wire is electrically connected to a land portion of a conductor foil pattern formed on a circuit board. A contact member soldered by reflowing above, an exposed end of the conductor wire superposed on the contact member in an electrical contact state, and a fixing means detachably fitted to the circuit board side. The exposed end portion of the conductor wire is fixed by pressure contact to the land portion side of the conductor foil pattern through the contact member by the fitting pressing force of the fixing means. Conductor wire connection structure.
【請求項2】 回路基板上に形成された導体箔パターン
のランド部に、導体線の露出端部を電気的に接続するよ
うにした回路基板の導体線接続構造の製造方法におい
て、 上記導体箔パターンのランド部上に、リフローによって
接点部材をハンダ付けする工程と、 上記接点部材上に、導体線の露出端部を電気的接触状態
にて重ね合わせる工程と、 前記回路基板側に着脱自在に固定手段を嵌合し、当該固
定手段の嵌合押圧力によって導体線の露出端部を、導体
箔パターンのランド部側に接点部材を介して圧接させる
ことにより導体線の固定を行う工程と、備えてなること
を特徴とする回路基板の導体線接続構造の製造方法。
2. A method for manufacturing a conductor wire connection structure of a circuit board, wherein an exposed end portion of a conductor wire is electrically connected to a land portion of a conductor foil pattern formed on a circuit board. A step of soldering the contact member on the land portion of the pattern by reflow; a step of superposing the exposed end portion of the conductor wire on the contact member in an electrically contacting state; A step of fitting the fixing means, and fixing the conductor wire by pressing the exposed end portion of the conductor wire by a fitting pressing force of the fixing means to the land portion side of the conductor foil pattern via a contact member; A method of manufacturing a conductor wire connection structure for a circuit board, comprising:
JP31753791A 1991-11-05 1991-11-05 Conductor wire connection structure of circuit board and manufacture thereof Pending JPH05129746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31753791A JPH05129746A (en) 1991-11-05 1991-11-05 Conductor wire connection structure of circuit board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31753791A JPH05129746A (en) 1991-11-05 1991-11-05 Conductor wire connection structure of circuit board and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH05129746A true JPH05129746A (en) 1993-05-25

Family

ID=18089361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31753791A Pending JPH05129746A (en) 1991-11-05 1991-11-05 Conductor wire connection structure of circuit board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH05129746A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022123996A1 (en) * 2020-12-07 2022-06-16 山下マテリアル株式会社 Flexible multi-layer substrate, and manufacturing method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022123996A1 (en) * 2020-12-07 2022-06-16 山下マテリアル株式会社 Flexible multi-layer substrate, and manufacturing method therefor

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