JPH05129478A - Socket with function for removing foreign matter from lead - Google Patents

Abstract

PURPOSE:To provide a socket with a function for removing foreign matter from leads which can reduce insufficient contact caused by a contact by removing foreign matter adhering to leads. CONSTITUTION:This socket is of a tip-contact system which is used at the time of inspecting the function of a multi-pin PGA package and has a function for removing foreign matter adhering to leads and is constituted of a socket main body 1, pin guide 2 which are put in the opening of a socket cover 2, foreign matter removing section 4 which removes foreign matter, contact section 5 which is electrically brought into contact, ball bearing 6 and spring 7 for obtaining electrical continuity, and stopper 8 which fixes the removing section 4. The section 4 is provided in the preceding stage of the contact section 5 and foreign matter which adhere to the leads 1 of a package 13 when the leads are inserted are removed by the section 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used for functional inspection of a semiconductor integrated circuit device having a product lead, and particularly, in a functional test of a highly reliable device in a multi-pin package, a contact failure caused by a contact is prevented. The present invention relates to a technology effectively applied to a socket with a lead foreign matter removing function that can be reduced.

[0002]

2. Description of the Related Art Conventionally, as a socket used for a function inspection of a semiconductor integrated circuit device, for example, "Technical Technology Publishing Co., Ltd."
SI package mounting technology and its reliability improvement "P226
~ P233 and the like described in the literature.

The outline is particularly directed to a surface mount package, for example, a non-insertion force type in which a package lead is sandwiched between a pressing portion and a contact, and a low package in which a package is inserted between opposed contacts. It is roughly divided into the insertion force type.

In addition, the inspection of semiconductor integrated circuit devices has become more and more diversified in recent years due to the differences in the applications, functions and characteristics of the target semiconductor integrated circuit devices, and especially in the functional tests of highly reliable devices, The contact state becomes very important as the speed increases.

[0005]

However, in the prior art as described above, the lead tip shape of, for example, a multi-pin PGA product is not an important standard for directly soldering the product to the board in an actual machine. Therefore, when performing a functional inspection of the contact of the tip of the lead, there is a problem that contact failure due to foreign matter on the tip is caused, and contact failure frequently occurs when foreign matter adheres to the tip and side surfaces of the product lead.

Further, in the case of the tip contact method such as an auto handler, the product is lowered from the top and the product and the socket are brought into contact with each other by an external load applied to the lower side. There is also a problem in that the burden on the lead becomes heavy and problems such as lead bending occur.

SUMMARY OF THE INVENTION An object of the present invention is to provide a lead foreign matter removing function socket capable of removing foreign matter adhering to a lead and reducing contact failure due to contact.

Another object of the present invention is to provide a socket with a lead foreign matter removing function which can reduce the burden on the leads and can suppress the occurrence of lead bending.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the socket with lead foreign matter removal function of the present invention is a socket with lead foreign matter removal function for removing foreign matter adhering to the leads of this product at the same time when the product is inserted, and the socket of the product has a contact portion of the product. A foreign matter removing portion having flexibility so as to contact the outer peripheral portion of the lead so as to be rubbed before the electrical contact of the lead is provided.

Further, the force in the inserting direction of the lead is converted into a force in the lateral direction, and the lead is electrically contacted from the side direction.

In this case, the socket is provided with a foreign substance removing hole for discharging the removed foreign substance to the outside.

[0014]

According to the above-described lead foreign substance removing function socket, the foreign substance removing portion that comes into contact with the outer periphery of the lead is provided. Can be removed. Thereby, contact failure due to contact can be reduced.

Further, by converting the force in the inserting direction of the lead into the force in the lateral direction, it is possible to reduce the load on the lead in the vertical direction. As a result, the occurrence of lead bending can be suppressed.

In this case, by providing the foreign matter removing hole, the removed foreign matter can be discharged to the outside. As a result, it is possible to prevent a secondary contact failure due to the removed foreign matter.

[0017]

[Embodiment 1] FIG. 1 is a sectional view showing an essential part of a socket with a lead foreign matter removing function according to an embodiment of the present invention, FIG. 2 is a plan view showing an essential part of the socket of this embodiment, and FIG. Explanatory drawing which shows the contact part in the socket of an Example in detail, FIG.
FIG. 6 is an explanatory diagram showing in detail the stopper in the socket of this embodiment.

First, the structure of the socket with a lead foreign matter removing function of this embodiment will be described with reference to FIGS.

The socket of the present embodiment is used as a tip contact type socket having a function of removing foreign matter adhering to the leads, which is used, for example, at the time of function inspection of a multi-pin PGA package. Of the pin guide 3, which is fitted into the hole of the hole, the foreign matter removing portion 4 which removes foreign matter, the contact portion 5 which electrically contacts, the ball bearing 6 and the spring 7 which electrically conduct.
And a stopper 8 for fixing the foreign matter removing portion 4.

The pin guide 3 is formed in a cylindrical shape having an open upper surface, and the lower portion thereof is narrowed to be thin,
The socket body 1 and the socket cover 2 are fitted into the openings.

As shown in FIG. 2, the foreign matter removing portion 4 is divided into, for example, crescent-shaped portions which face each other, and the leads of the package are rubbed and inserted into the crescent-shaped concave portions. Then, a lead is vertically provided from the central portion of each crescent, and this lead portion is fixed to the inner peripheral portion of the pin guide 3 via a contact portion 5 and a stopper 8.

As shown in FIG. 3, for example, the contact portion 5 is formed in a cylindrical shape whose upper surface is cut at a right angle, the lower portion is cut obliquely, and the tip of the package is brought into contact with the right-angled portion of the upper surface. The ball bearing 6 is in contact with the lower slope portion. A foreign matter removing hole 9 for discharging foreign matter is obliquely penetrated in the central portion of the contact portion 5, and a notch 10 for fixing the lead portion of the foreign matter removing portion 4 is provided in the outer peripheral portion.

Ball bearing 6 and spring 7
Is elastically provided by a spring 7 between the thin tube portion of the pin guide 3 and the inclined surface portion of the contact portion 5.

The stopper 8 is formed, for example, in a cylindrical shape as shown in FIG. 4, a through hole 11 in which a spring 7 is disposed is opened in the central portion, and the foreign matter removing portion 4 is fixed to the outer peripheral portion. A cutout 12 is provided.

Next, the operation of this embodiment will be described.

First, the lead 13 of the package is inserted from the upper side, and at the same time, the lead 13 is brought into contact with the foreign matter removing portion 4 to remove the foreign matter attached. Then, after removing the foreign matter, the lead 13 is further inserted and brought into contact with the contact portion 5 to measure electrical continuity.

As a result, the leads 13 of the package are
Conduction is made in two ways: the contact path of the contact part 5, the ball bearing 6, the spring 7 and the pin guide 3 and the contact path of the contact part 5, the foreign matter removing part 4 and the pin guide 3.

The foreign matter removed by the foreign matter removing section 4 is discharged from the foreign matter removing hole 9 of the contact section 5 and further removed from the opening of the pin guide 3 to the outside, whereby the contact section 5 and the pin guide 3 are removed. It does not accumulate inside.

Therefore, according to the socket of this embodiment, the foreign matter removing portion 4 is provided before the contact portion 5 for making electrical contact to remove foreign matter attached to the leads 13 of the package to be inserted. , Package lead 13
The contact portion 5 of the socket and the contact portion 5 of the socket can be surely contacted, and contact failure due to foreign matter can be reduced.

[0030]

[Embodiment 2] FIG. 5 is a sectional view showing an essential part of a socket with a lead foreign matter removing function according to another embodiment of the present invention, and FIG. 6 is a sectional view showing a state in which a lead is inserted into the socket of this embodiment. Is.

The socket with a lead foreign matter removing function of this embodiment has a pin guide 3a fitted into the openings of the socket body 1 and the socket cover 2 as shown in FIG.
And a foreign matter removing unit 4 for removing foreign matter and making electrical contact
a, a ball bearing 6a and a spring 7a for electrical conduction, a stopper 8a for fixing the foreign matter removing portion 4a, and a holding rod 14 provided between the foreign matter removing portion 4a and the ball bearing 6a. 1 is different in the contact method with the leads 13 of the package, and is a side contact method with respect to the leads 13.

That is, the foreign matter removing portion 4a of this embodiment is
In addition to the foreign matter removing function, it has a function of measuring electrical continuity with the leads 13 of the package, and contacts the side surface of the leads 13. Then, the lower portions of the lead portions are respectively bent inward as shown in FIG. 5, the leads 13 are brought into contact with the bent portions, and when the leads 13 are further inserted, the upper portions become narrower as the bent portions expand. There is.

Therefore, according to the socket of this embodiment, after the lead 13 of the package is inserted and brought into contact with the foreign matter removing portion 4a to remove the foreign matter, the lead 13 is further inserted and held as shown in FIG. By pressing the rod 14, the lead 13 can be pressed from the side surface at the upper portion of the foreign matter removing portion 4a.

As a result, the force in the vertical direction at the time of inserting the lead is replaced by the force in the horizontal direction by the foreign matter removing portion 4a, and the lead 1
Since the electrical contact can be measured on the side surface of No. 3, by removing the adhered foreign matter, the contact failure between the lead 13 and the socket is reduced, and the load on the lead 13 is reduced as compared with the first embodiment. Because you can
The lead bending potential can be reduced.

[0035]

[Embodiment 3] FIG. 7 is a sectional view showing a main part of a socket with a lead foreign matter removing function according to still another embodiment of the present invention.

The lead foreign matter removing function socket of the present embodiment has a pin guide 3b fitted in the opening portions of the socket body 1 and the socket cover 2 as shown in FIG.
And a foreign matter removing portion 4b for removing foreign matter, a pogo contact pin 5b that makes electrical contact, and a stopper 8b for fixing the foreign matter removing portion 4b. The difference from the first and second embodiments is the contact portion. Is the point that the adapter specification by the pogo contact pin 5b is adopted.

That is, the pogo contact pin 5b of this embodiment has a flat upper portion as shown in FIG.
The tips of the leads 13 of the package can be easily contacted.

Therefore, according to the socket of the present embodiment, the lead 13 of the package is inserted and brought into contact with the foreign substance removing portion 4b to remove the foreign substance, and then the lead 13 is further inserted so that the pogo contact pin 5b is formed. Since the electrical contact can be measured, the contact failure can be reduced by removing the foreign matter adhering to the lead 13 as in the case of Embodiments 1 and 2, and the pogo contact pin 5b can be applied to the socket of the adapter specification. Is possible.

Although the invention made by the present inventor has been specifically described based on the first to third embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, the socket with lead foreign matter removing function of the above-described embodiment is not limited to the structure and shape shown in FIGS. 1 to 7, but a foreign matter removing portion is simply added to the conventional socket. It goes without saying that various modifications can be made, such as when the structure is formed.

In the above description, the invention made mainly by the present inventor is mainly applied to the multi-pin PGA.
The case where the present invention is applied to a socket used for a package has been described, but the present invention is not limited to this, and DI
It is also widely applicable to sockets of other packages such as P and SIP types.

[0042]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). Before the lead of the product is electrically contacted with the contact portion of the socket, a foreign matter removing portion having flexibility so as to rub the outer periphery of the lead is provided so that the product lead of the product lead is Since the foreign matter adhering to the tip and side surfaces can be removed, it is possible to reduce the contact failure due to the contact.

(2) By converting the force in the inserting direction of the lead into a lateral force and making electrical contact with this lead from the side, it is possible to reduce the vertical load on the lead. Therefore, the bending of the lead can be suppressed.

(3) Since the foreign matter can be discharged to the outside by providing the foreign matter removing hole for discharging the removed foreign matter to the outside, secondary contact failure due to the removed foreign matter can be prevented. ..

(4) Due to the above (1) to (3), it is possible to reduce the contact failure. Therefore, in the functional test of the highly reliable device especially in the multi-pin package, it is possible to improve the yield and shorten the completion time. You can get the sockets that are enabled.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a socket with a lead foreign matter removing function according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a main part of the socket of the first embodiment.

FIG. 3 is an explanatory diagram showing details of a contact portion in the socket of the first embodiment.

FIG. 4 is an explanatory diagram showing details of a stopper in the socket of the first embodiment.

FIG. 5 is a sectional view showing a main part of a socket with a lead foreign matter removing function according to a second embodiment of the present invention.

FIG. 6 is a sectional view showing a state in which a lead is inserted in the socket of the second embodiment.

FIG. 7 is a cross-sectional view showing the main parts of a lead foreign matter removing function socket according to a third embodiment of the present invention.

[Explanation of symbols]

 1 Socket main body 2 Socket cover 3, 3a, 3b Pin guide 4, 4a, 4b Foreign matter removing section 5 Contact section 5b Pogo contact pin 6, 6a Ball bearing 7, 7a Spring 8, 8a, 8b Stopper 9 Foreign matter removing hole 10 Notch 11 Through hole 12 Notch 13 Lead 14 Presser bar

Claims (3)

[Claims] 1. A socket with a lead foreign matter removing function for removing foreign matter adhering to a lead of the product at the same time when the product is inserted, before the lead of the product electrically contacts the contact portion of the socket. A lead foreign matter removing function socket, comprising: a foreign matter removing portion having flexibility so as to make frictional contact with an outer peripheral portion of the lead, and removing the foreign matter attached to the lead by the foreign matter removing portion. 2. The socket with a lead foreign matter removing function according to claim 1, wherein a force in the insertion direction of the lead is converted into a force in the lateral direction to electrically contact the lead from a side surface direction. .. 3. The lead foreign matter removing function socket according to claim 1, wherein the socket is provided with a foreign matter removing hole for discharging the removed foreign matter to the outside.