JPH05129459A - Manufacture of ceramic substrate - Google Patents
Manufacture of ceramic substrateInfo
- Publication number
- JPH05129459A JPH05129459A JP3318517A JP31851791A JPH05129459A JP H05129459 A JPH05129459 A JP H05129459A JP 3318517 A JP3318517 A JP 3318517A JP 31851791 A JP31851791 A JP 31851791A JP H05129459 A JPH05129459 A JP H05129459A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- slit
- substrate
- ceramic
- slits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、セラミックス基板中に
スリット及びスリット上スル−ホ−ルを有する多数個取
り基板を製造する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multi-piece substrate having a slit and a through hole on the slit in a ceramic substrate.
【０００２】[0002]
【従来の技術】従来、セラミックス基板は切断加工が困
難なため、最終セラミックス基板寸法に焼成収縮代を加
えた寸法でセラミックスグリーンシートを打抜加工し、
焼成、仕上げるものが一般的であるが、セラミックス基
板の最終形状（ユニット形状）が複雑化する傾向にあ
り、しかも小型サイズが主流であるため、炉のロスが多
く歩留りが悪く、生産性が悪いものであった。このた
め、特開平３−３９２０２号公報に示されるように、複
数のセラミックス基板をスリットで連結した状態のセラ
ミックスグリーンシートを焼成し、印刷実装をした後
に、スリット部で個々に分割する方法が採られるいる
が、一枚の基板から多数個ユニットを取るためスリット
及びスリット上スル−ホ−ルを有する場合には、スル-
ホールとスリットとの接点において、打抜加工時の応力
集中による歪が発生し、打抜加工時、或いは焼成時に破
損してしまうことが多かった。2. Description of the Related Art Conventionally, since it is difficult to cut a ceramic substrate, a ceramic green sheet is punched in a size obtained by adding a firing shrinkage allowance to the final ceramic substrate size.
Baking and finishing are common, but the final shape (unit shape) of the ceramic substrate tends to be complicated, and because the small size is the mainstream, there is a lot of loss in the furnace and the yield is poor, resulting in poor productivity. It was a thing. Therefore, as disclosed in JP-A-3-39202, a method is used in which a ceramic green sheet in which a plurality of ceramic substrates are connected by slits is fired, printed and mounted, and then individually divided by slits. However, if there are slits and through-holes on the slits to take multiple units from one substrate, the
At the contact points between the holes and the slits, strain was generated due to stress concentration during punching, and the strain was often broken during punching or firing.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、複雑な形状のユニットを多数個取りするセラミッ
クス基板の製造は、生産性が悪いのが、通例であった。
本発明者は、従来技術における前記問題点を解決するた
めに、種々検討をして、スリット上にスル−ホ−ルを有
する多数個取りのセラミックス基板の生産性を向上させ
ることの出来るセラミックス基板の製造方法を提供する
ことを目的として、本願発明を完成した。As described in the prior art, it has been customary that the productivity of a ceramic substrate in which a large number of units each having a complicated shape are taken is low in productivity.
In order to solve the above-mentioned problems in the prior art, the present inventor makes various studies and can improve the productivity of a multi-cavity ceramic substrate having through holes on slits. The present invention has been completed for the purpose of providing a method for manufacturing the same.
【０００４】[0004]
【課題を解決するための手段】本発明は、セラミックス
基板中にスリット及びスリット上スル−ホ−ルを有する
多数個取り基板を製造する方法において、焼成前のグリ
ーンシートに、スリット及びスル−ホールを設け、スリ
ットとスル−ホールとの間に、０.０１〜１.０mmのスリ
ットを設けない部分を設け、焼成することを特徴とする
セラミックス基板の製造方法である。SUMMARY OF THE INVENTION The present invention is a method for producing a multi-piece substrate having a slit and a through-hole on a slit in a ceramic substrate, wherein a slit and a through hole are formed on a green sheet before firing. Is provided, and a portion not provided with a slit of 0.01 to 1.0 mm is provided between the slit and the through hole, and the ceramic substrate is fired.
【０００５】本発明は、数多くの焼成例から、スリット
及びスリット上スルーホールを設けた一枚のセラミック
ス基板から多数個のセラミックス基板を製造するに際
し、スリットとスルーホールとの間にスリットを設けな
い部分を設けると、打抜加工時及び焼成時に、必要個所
の割れが生じないことから、その寸法について各種のテ
ストを行い、本願発明として出願範囲がベストであるこ
とを見い出したものである。According to the present invention, when many ceramic substrates are manufactured from one ceramic substrate provided with slits and through holes on the slits from many firing examples, no slits are provided between the slits and the through holes. When the portion is provided, cracking does not occur at necessary portions during punching and firing. Therefore, various tests were carried out on the dimensions, and the invention was found to have the best application range.
【０００６】本発明に用いるセラミックスグリーンシー
トの基材としては、アルミナ質、マグネシア質、珪石
質、窒化物質、ボロン化物質等のような耐火物骨材やセ
ラミックスにメチルセルロース、グリセリン、アクリ
ル、水飴、酢酸ビニル等の有機バインダーや水、タル
ク、カルシア、或いはイットリウム等の燃焼助剤を添
加、混合、混練し、シート化後、乾燥してから、複数の
セラミックスシートに打抜き加工し、焼成、洗浄して、
スリット及びスルーホール部分で個々に分割するもので
ある。前記の通りのセラミックス基板の製造方法を採用
するために、一度の焼成にて、一枚のセラミックス基板
から複数枚のセラミックス基板に分割出来るので、生産
性を向上出来るものである。以下、本発明を実施例にも
とづいて説明する。The base material of the ceramic green sheet used in the present invention includes refractory aggregates such as alumina, magnesia, siliceous, nitriding and boronizing substances, and ceramics such as methylcellulose, glycerin, acryl, starch syrup, Organic binders such as vinyl acetate and combustion aids such as water, talc, calcia, or yttrium are added, mixed, kneaded, formed into sheets, dried, punched into a plurality of ceramic sheets, baked, and washed. hand,
The slits and through holes are individually divided. Since the method of manufacturing a ceramic substrate as described above is adopted, it is possible to improve productivity because one ceramic substrate can be divided into a plurality of ceramic substrates by firing once. Hereinafter, the present invention will be described based on Examples.
【０００７】[0007]
【実施例】平均粒径２.０ミクロンのアルミナ９６重量
部（以下、単に部と表記する）に対し、タルク４部を加
え混合後、ブチラール樹脂６部、溶剤（トルエンとアル
コールを１：１で混合したもの）３０部を加え混練り
後、厚み０.９５mmにシート化し、乾燥後、１００×１
００mmサイズであり、第１図に示す通り、スルーホール
及びスリットを入れ、仕上り後寸法が２０×２０mmサイ
ズのセラミックス基板が１６枚採られるように打抜加工
して得たセラミックスグリーンシート６枚をアルミナ
セッター上に載置し２００℃／時間の昇温スピードで１
５７０℃まで昇温させ、１５７０℃で３時間焼成後、降
温し、エアーブラスト洗浄して異物を除去後、第１図及
び第２図に示すスリットラインに従って１６個に分割
し、２０×２０mmのセラミックス基板９６枚を得た。Example: To 96 parts by weight of alumina having an average particle size of 2.0 microns (hereinafter simply referred to as "part"), 4 parts of talc was added and mixed, and then 6 parts of butyral resin and a solvent (toluene and alcohol were 1: 1). 30 parts) and kneaded into a sheet with a thickness of 0.95 mm, and after drying, 100 x 1
As shown in FIG. 1, 6 sheets of ceramic green sheets, which are 00 mm in size, have through holes and slits, and are punched out so that 16 finished ceramic substrates each having a size of 20 × 20 mm can be taken. alumina
Place it on a setter and raise it at a heating rate of 200 ° C / hour for 1
After raising the temperature to 570 ° C., baking at 1570 ° C. for 3 hours, lowering the temperature, air blast cleaning to remove foreign matters, and dividing into 16 pieces according to the slit lines shown in FIGS. 1 and 2, 20 × 20 mm 96 ceramic substrates were obtained.
【０００８】[0008]
【発明の効果】本発明は、前記の通り一度の焼成にて、
多数のセラミックス基板を生産出来るものであり、今後
益々小型化する傾向のある電子部品用セラミックス基板
の製造方法として、当業者のみならず、ユーザーにも役
立つ有用な発明である。As described above, the present invention can be performed by firing once.
This is a useful invention that is useful not only for those skilled in the art but also for the user as a method for producing a ceramic substrate for electronic parts, which can produce a large number of ceramic substrates and has a tendency to be further miniaturized in the future.
【図１】本発明の実施例におけるセラミックスグリーン
シートの平面図である。FIG. 1 is a plan view of a ceramic green sheet according to an example of the present invention.
【図２】第１図におけるセラミックスグリーンシートの
スル−ホール部近くの拡大図である。Ａ部、Ｂ部、Ｃ部
上の記載は、第１図に矢印で記した部分を示す。FIG. 2 is an enlarged view of the ceramic green sheet in FIG. 1 near a through hole portion. The descriptions on the parts A, B, and C indicate the parts indicated by arrows in FIG.
１ … セラミックス基板の原板、 ２ … スル−ホール ３ … スリット、 ４ … セラミックス基板 1 ... Original plate of ceramics substrate, 2 ... Through hole 3 ... Slit, 4 ... Ceramics substrate
Claims (1)
ト上スル−ホ−ルを有する多数個取り基板を製造する方
法において、焼成前のグリーンシートに、スリット及び
スルホールを設け、スリットとスルホールとの間に、
０.０１〜１.０mmのスリットを設けない部分を設け、焼
成することを特徴とするセラミックス基板の製造方法。1. A method for manufacturing a multi-piece substrate having a slit and a through-hole on a slit in a ceramic substrate, wherein a slit and a through hole are provided in a green sheet before firing, and the green sheet is provided between the slit and the through hole. ,
A method for manufacturing a ceramic substrate, characterized by providing a portion not provided with a slit of 0.01 to 1.0 mm and firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3318517A JPH05129459A (en) | 1991-11-06 | 1991-11-06 | Manufacture of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3318517A JPH05129459A (en) | 1991-11-06 | 1991-11-06 | Manufacture of ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05129459A true JPH05129459A (en) | 1993-05-25 |
Family
ID=18099999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3318517A Pending JPH05129459A (en) | 1991-11-06 | 1991-11-06 | Manufacture of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05129459A (en) |
-
1991
- 1991-11-06 JP JP3318517A patent/JPH05129459A/en active Pending
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