JPH05246756A - Ceramic substrate - Google Patents
Ceramic substrateInfo
- Publication number
- JPH05246756A JPH05246756A JP4045206A JP4520692A JPH05246756A JP H05246756 A JPH05246756 A JP H05246756A JP 4045206 A JP4045206 A JP 4045206A JP 4520692 A JP4520692 A JP 4520692A JP H05246756 A JPH05246756 A JP H05246756A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- ceramic substrate
- ceramic powder
- pts
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は各種電子素子の搭載基板
等として用いられるセラミック基板の製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic substrate used as a mounting substrate for various electronic elements.
【0002】[0002]
【従来の技術】従来のセラミック基板は、耐火物骨材、
燃焼助剤、バインダーを混練しシート化後、焼成してセ
ラミック基板を得ているが、シートの伸びが非常に小さ
いため、シート打抜き工程においてシートにクラックが
発生しやすいという問題があった。しかしセラミック基
板のクラックは基板表面に描かれる回路パターンの障害
となり、最近のフアインパターンにおいては回路の断
線、ショートの原因となっていた。2. Description of the Related Art Conventional ceramic substrates are refractory aggregates,
Although a ceramic substrate is obtained by kneading a combustion aid and a binder into a sheet and then firing the sheet, there is a problem that cracks are likely to occur in the sheet during the sheet punching process because the sheet has a very small elongation. However, cracks in the ceramic substrate hinder the circuit pattern drawn on the substrate surface, and in recent fine patterns, they have caused circuit disconnection and short circuits.
【0003】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに従来のセラミック基板ではクラックが発生しやすい
という欠点がある。本発明は従来の技術における上述の
問題点に鑑みてなされたもので、その目的とするところ
は、伸びがあり、クラックの発生し難いセラミック基板
を提供することにある。As described in the prior art, the conventional ceramic substrate has a drawback that cracks easily occur. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a ceramic substrate that has elongation and is unlikely to cause cracks.
【0004】[0004]
【課題を解決するための手段】本発明は、セラミック粉
体にポリエステル型可塑剤、バインダーを添加、混合、
混練してからシート化後、焼成したことを特徴とするセ
ラミック基板のため上記目的を達成することができたも
ので、以下本発明を詳細に説明する。According to the present invention, a polyester type plasticizer and a binder are added to and mixed with ceramic powder.
Since the ceramic substrate is characterized by being kneaded, formed into a sheet, and then fired, the above object can be achieved. The present invention will be described in detail below.
【0005】本発明に用いるセラミック粉体は、アルミ
ナ質、マグネシア質、珪石質、窒化質、ボロン質等のよ
うな耐火物骨材、セラミック粉末や、タルク、カルシ
ア、イットリゥム等の燃焼助剤等であるが、粒径0.2
〜0.8ミクロンのものを用いることが好ましい。即ち
粒径0.8ミクロンをこえるとクラックが発生しやすい
傾向にあるからである。ポリエステル型可塑剤としては
ポリエステル系であるならばよくポリエステル型可塑剤
全般を用いることができるが、高分子型のものが好まし
い。ポリエステル型可塑剤の添加量は、セラミック粉体
100重量部に対して0.5〜4重量部(以下単に部と
記す)であることが好ましい。即ち0.5部未満ではク
ラックを少なくすることが難しく、4部をこえると成形
性が低下する傾向にあるためである。バインダーとして
は、メチルセルロース、アクリル、酢酸ビニール、ユリ
ア樹脂、メラミン樹脂、フェノール樹脂等を用いること
ができ、バインダー量はできるだけ少ないことが望まし
く、セラミック粉体100部に対して1〜30部が好ま
しい。即ち1部未満では成形し難く、30部をこえると
気泡跡が多くなるためである。混合、混練はニーダー、
バーチカルニーダー、ミキサー、ロール、押出機等のよ
うに通常用いるものが用いられ、特に限定するものでは
ない。シート化は押出機、ロール等を用いることができ
る。焼成方法、焼成装置については通常用いられるもの
をそのまま用いることができる。The ceramic powder used in the present invention includes refractory aggregates such as alumina, magnesia, silica, nitride, boron, etc., ceramic powder, combustion aids such as talc, calcia, yttrium, etc. However, the particle size is 0.2
It is preferable to use one having a diameter of .about.0.8 micron. That is, if the particle size exceeds 0.8 μm, cracks tend to occur. As the polyester type plasticizer, any polyester type may be used as long as it is a polyester type, but a polymer type is preferable. The addition amount of the polyester type plasticizer is preferably 0.5 to 4 parts by weight (hereinafter simply referred to as “part”) with respect to 100 parts by weight of the ceramic powder. That is, if it is less than 0.5 part, it is difficult to reduce cracks, and if it exceeds 4 parts, the formability tends to decrease. As the binder, methyl cellulose, acryl, vinyl acetate, urea resin, melamine resin, phenol resin or the like can be used. It is desirable that the amount of the binder be as small as possible, preferably 1 to 30 parts per 100 parts of the ceramic powder. That is, if it is less than 1 part, it is difficult to mold, and if it exceeds 30 parts, the traces of bubbles increase. Kneader for mixing and kneading,
A commonly used one such as a vertical kneader, a mixer, a roll, an extruder or the like is used and is not particularly limited. An extruder, a roll or the like can be used for forming a sheet. As for the firing method and the firing apparatus, those commonly used can be used as they are.
【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【0007】[0007]
【実施例】粒径0.4ミクロンのアルミナ96部に対
し、タルク4部を加え混合して得たセラミック粉体10
0部に、メチルセルロース6部、ポリエステル型可塑剤
(日本油脂株式会社製、商品名ノニオン)2部を加え3
本ロールで混合、混練して杯土を得た。次に該杯土を押
出機で厚み1.0mmにシート化し400×400mm
に打ち抜いて得たグリーンシートを100℃/時間の昇
温率で1600℃迄昇温させ、1600℃で2時間焼成
後、降温してセラミック基板を得た。Example Ceramic powder 10 obtained by adding 4 parts of talc to 96 parts of alumina having a particle size of 0.4 micron and mixing them
To 0 parts, add 6 parts of methyl cellulose and 2 parts of polyester type plasticizer (Nippon Yushi Co., Ltd., trade name Nonion), and add 3 parts.
It mixed and kneaded with this roll and obtained the clay. Next, the clay is formed into a sheet having a thickness of 1.0 mm by an extruder and 400 × 400 mm.
The green sheet obtained by punching was heated to 1600 ° C. at a heating rate of 100 ° C./hour, fired at 1600 ° C. for 2 hours, and then cooled to obtain a ceramic substrate.
【0008】[0008]
【比較例】ポリエステル型可塑剤を用いない以外は実施
例と同様に処理してセラミック基板を得た。[Comparative Example] A ceramic substrate was obtained by the same process as in Example except that the polyester type plasticizer was not used.
【0009】実施例及び比較例のセラミック基板の性能
は、表1のようである。The performance of the ceramic substrates of Examples and Comparative Examples is as shown in Table 1.
【0010】[0010]
【表1】 [Table 1]
【0011】[0011]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有するセラミック基板
においては、伸び率がよく、クラック発生の少ないセラ
ミック基板が得られ、本発明の優れていることを確認し
た。The present invention is constructed as described above.
With the ceramic substrate having the structure described in the claims, it was confirmed that the present invention is excellent because a ceramic substrate having a good elongation rate and few cracks was obtained.
Claims (2)
剤、バインダーを添加、混合、混練してからシート化
後、焼成したことを特徴とするセラミック基板。1. A ceramic substrate characterized in that a polyester type plasticizer and a binder are added to, mixed with, and kneaded with a ceramic powder, and then formed into a sheet and then fired.
ク粉体100重量部に対して0.5〜4重量部であるこ
とを特徴とする請求項1に記載のセラミック基板。2. The ceramic substrate according to claim 1, wherein the amount of the polyester type plasticizer is 0.5 to 4 parts by weight with respect to 100 parts by weight of the ceramic powder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4045206A JPH05246756A (en) | 1992-03-03 | 1992-03-03 | Ceramic substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4045206A JPH05246756A (en) | 1992-03-03 | 1992-03-03 | Ceramic substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05246756A true JPH05246756A (en) | 1993-09-24 |
Family
ID=12712798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4045206A Pending JPH05246756A (en) | 1992-03-03 | 1992-03-03 | Ceramic substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05246756A (en) |
-
1992
- 1992-03-03 JP JP4045206A patent/JPH05246756A/en active Pending
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